As the performance of artificial intelligence chips continues to improve, single chips are gradually approaching the physical limits of efficiency, and advanced packaging technology is rapidly developing towards large size, high performance, and high-density heterogeneous integration.
In this trend, the warping issues in packaging structures and thermal processes are becoming increasingly challenging, becoming a key bottleneck restricting industry development.
Chroma ATE Inc. from Taiwan has launched a “Warping Prevention Carrier Solution for Wafer and Panel Level Packaging,” providing the industry with an innovative solution.
The Roots and Challenges of the Warping Problem
In the CoWoS and integrated fan-out packaging processes, structures such as chips, packaging substrates, bottom filling adhesives, intermediate layers, and cover layers are prone to stress accumulation during repeated thermal cycling due to differences in thermal expansion coefficients, curing shrinkage, and asymmetric thickness..
During processes such as bonding, molding, thermal pressing, and reflow soldering, wafers are also susceptible to deformation and warping. Research shows that the residual stress difference between different material layers can reach320MPa, far exceeding the yield strength of the copper-silicon interface (250MPa), making the warping issue a critical pain point that needs optimization in advanced packaging.
Innovative Solutions with Sapphire Substrates
Chroma ATE Inc. from Taiwan has innovatively proposed the use of high melting point and high hardness “sapphire single crystal substrates” as a solution. The sapphire material possesses high rigidity and wear resistance, effectively suppressing warping, and has over 85% UV and infrared transmittance, allowing for flexible combinations with various dissociation solutions to support future panel-level packaging process needs..
With the application of innovative materials such as sapphire substrates, new possibilities are opened up for the development of artificial intelligence and high-performance computing chips..
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