Semiconductor Electronic Technology – Explanation of the Crystal Expansion Machine

I see fans in the comment section requesting tutorials on the crystal expansion machine, so today we will share an explanation of the operation of the crystal expansion machine, taking the semi-automatic crystal expansion machine (V1130 model) as an example. There are many types of crystal expansion machines (fully automatic, semi-automatic), and the operation is quite simple:Model Overview:

Product Features:※ High Efficiency: Utilizes technology to achieve film expansion and improve production efficiency;※ Film Expansion: The equipment is easy to operate, allowing control over the film expansion process to ensure product quality;※ Semi-Automation: Semi-automatic operation mode reduces labor costs and enhances production efficiency;Principle of the Crystal Expansion Machine: The blue film holding the chips is tightened, and the cut wafers are expanded to increase the gap between individual wafers (Die) for easier suction and placement.Installation and Debugging:

1.DevicePlacement: Place the device in the designated area and press down on the brake of the casters;

2.Electrical and Pneumatic Installation: Connect the power plug to a 220V socket, quickly connect the air hose to the air source, and ensure proper grounding;

3.Device Testing:

① Turn on the main switch:② Confirm the pressure range on the pressure regulator (0.6-0.8Pa):③ After powering on, press the reset button on the panel:④ Automatic page debugging:⑤ Place the inner ring of the expansion ring in the aluminum ring below:⑥ Place the outer ring of the expansion ring with grooves in the aluminum ring above, with the grooves facing down:⑦ Press both start buttons on the panel simultaneously (dual key interlock, device operation):2 keys:Basic parameters are as follows:

This concludes the entire crystal expansion process. Thank you to the fans for providing the material; if there are any copyright issues, please contact this public account for deletion. Thank you.