Recommended High-Frequency Microwave Circuit Board Material Cases

– 5G Base Station Massive MIMO Antenna Array: A leading equipment manufacturer uses Rogers RO3010 high-frequency substrate (Dk=10.2) with a hybrid pressing process, increasing the antenna unit density to 64 units per board, supporting a transmission rate of 10Gbps in the 28GHz band, with insertion loss reduced by 15%.

– L4 Level Autonomous Driving Millimeter-Wave Radar: A customized 77GHz radar module from a new energy vehicle company uses a ceramic substrate (Dk=10.2) for layer stacking optimization, improving detection accuracy to ±0.1°. It also employs a vacuum resin plug hole process to ensure an impedance drift rate of <2% under high temperature and high humidity conditions (85℃/85%RH).

– Satellite Communication System: A high-frequency board customized for a low Earth orbit satellite project uses RT/duroid® 6010LM material, combined with a 24-layer blind via design, achieving a signal transmission rate of 10Gbps, while the fully automated copper plating process compresses the delivery time to 48 hours.

– Onboard 77GHz Millimeter-Wave Radar: The PCB uses a “high-frequency material + FR-4” hybrid pressing scheme, employing Rogers RO4350B (Dk=3.48, Df=0.0037) for the signal layer and low-cost FR-4 substrate for the power layer, reducing the module size to 50mm×50mm and cutting costs by 20%.

– Antarctic Scientific Research Beidou Satellite Terminal: In the 2023 Antarctic research project, the Beidou satellite terminal uses Rogers 5880 high-frequency board, maintaining a positioning accuracy error of less than 0.1 meters even at -45℃. This material exhibits a dielectric constant fluctuation of <1.5% within the range of -50℃ to +150℃, demonstrating excellent temperature stability.

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