In today’s era, the benefits brought by Moore’s Law are slowing down, and the Multi-Die system provides a way to integrate multiple heterogeneous die (small chips) in a single package, reducing power consumption and improving performance for compute-intensive applications. For this reason, Multi-Die systems are rapidly becoming the preferred architecture for hyperscale users, autonomous vehicle developers, and mobile device developers.
Although the development of Multi-Die systems can follow a verification process similar to that of single-chip SoCs, every step must be comprehensively considered from the perspective of the entire system rather than just individual die. Does this mean that the verification of Multi-Die systems is more difficult? Certainly, developers will encounter some unique challenges, but these challenges can be overcome by applying the appropriate frameworks, processes, and technologies.
This article will further introduce the relevant knowledge of Multi-Die system verification. Click here to read the original article to view the webinar series How to Easily