Gu Liang Microelectronics: DSP Product Selection Solutions

Gu Liang Microelectronics Co., Ltd.’s “Lushan” series DSP chips include a variety of products, each with its unique performance specifications:

  1. 32-bit High-Performance Floating-Point DSP Chip LS-T35: Successfully developed in May 2021, it uses an 8-inch 180nm process, operates at a main frequency of 150MHz, and supports 32-bit floating-point operations. It integrates 256K16b Flash and 34K16b SARAM, features 16 channels of 12-bit high-precision ADC, 6 channels of high-precision PWM, 2 CAN channels, 3 SCI (UART) channels, and 1 each of SPI/I2C/McBSP interfaces. It can also connect external memory through GPIO and XINTF expansion interfaces. Available in CQFP176 (ceramic package), LQFP176 (plastic package), BGA176 (plastic package), it supports a working temperature range of -40℃ to +125℃.
  2. 32-bit High-Performance Fixed-Point DSP Chip LS-Z9: Successfully developed in April 2022, it operates at a frequency of 100MHz. It integrates 64K16b Flash and 18K16b SARAM, has 16 channels of 12-bit high-precision ADC, 4 channels of high-precision PWM, 4 SPI channels, 2 CAN channels, 2 SCI (UART) channels, and 1 I2C channel. It can connect external memory through GPIO and XINTF expansion interfaces, available in LQFP100, BGA100 packages, and supports a working temperature range of -40℃ to +125℃.
  3. 32-bit Low-Power Floating-Point DSP Chip LS-Z35: Launched in July 2022, it uses an 8-inch 110nm process, operates at a frequency of 60MHz, and integrates a Control Law Accelerator (CLA), 64K16b Flash and 10K16b SARAM. It features 16 channels of 12-bit high-precision ADC, 7 channels of high-precision PWM, 2 SPI channels, 1 each of CAN/SCI (UART)/I2C interfaces, and can connect external memory through GPIO and XINTF expansion interfaces. Available in LQFP80, LQFP64, QFN56 packages, it supports a working temperature range of -40℃ to +125℃, widely used in charging piles, on-board chargers, etc., with a domestic market demand exceeding 80 million pieces annually.
  4. 32-bit Low-Power Fixed-Point DSP Chip LS-Z27: Successfully developed in January 2023, it operates at a frequency of 60MHz, integrating 32K16b Flash, 6K16b SRAM, 12-bit multi-channel ADC, 4 high-resolution PWM channels, 1 SCI, 1 SPI, and 1 I2C. Available in QFP48/SOP38 packages, it supports a working temperature range of -40℃ to +125℃, used in household appliance inverters, digital power supplies, etc., with a domestic market demand of about 30 million pieces annually.
  5. 32-bit High-Performance Floating-Point DSP Chip LS-Z69: Mass production in April 2024, using 110nm process technology, with a maximum frequency of 120MHz. It integrates a Control Law Accelerator (CLA), Floating-Point Unit (FPU), Viterbi Unit (VCU), 254K16b Flash, 50K16b SRAM, 12-bit ADC16, DMA6, as well as 16 PWM channels, 3 CAP, 2 QEP, 1 USB2.0, 1 CAN, 2 SCI, 2 SPI, and 1 I2C interfaces, available in LQFP100/QFP80 packages.
  6. Next-Generation 32-bit High-Performance Floating-Point DSP Chip LS-Z049: First successfully developed, operating at a frequency of 100MHz, integrating a co-processor CLA, Configurable Logic Block (CLB), Floating-Point Unit (FPU), Trigonometric Function Unit (TMU), and Viterbi Accelerator (VCU). Available in LQFP100/LQFP64/VQFN56 packages, supports -40℃ to +125℃, widely used in new energy vehicles, digital power supplies, etc., with a domestic market demand of about 50 million pieces annually, growing year by year.
  7. Next-Generation Low-Power Floating-Point DSP Chip LS-Z025: Developed in April 2024, operating at a frequency of 100MHz, integrating Floating-Point Unit (FPU), Trigonometric Function Accelerator (TMU), Configurable Module (CLB)2, 128K16b Flash, 22K*16b SRAM, 16 channels of 12-bit ADC, 6 DMA, 14 high-precision PWM, 3 CAP, 2 QEP, 1 SCI, 2 SPI, 2 I2C, 1 CAN, and new peripheral interfaces such as FSI, LIN, PMBus, available in LQFP80/LQFP64/LQFP48 packages.
  8. Next-Generation High-Performance Dual-Core Floating-Point DSP Chip LS-T79D: Successfully taped out in July 2024, operating at a frequency of 200MHz, configurable for dual-core/single-core. It integrates a Floating-Point Unit (FPU), Trigonometric Function Unit (TMU), Viterbi Computation (VCU), 2 Control Law Accelerators (CLA), and 4 Configurable Logic Blocks (CLB), with abundant internal memory resources, including 4MB (2MW) Flash, 256 KB (128KW) global shared RAM, etc. It also integrates 16-bit high-precision ADC, 8 SDFM, 1 USB2.0, and many other peripheral interfaces, available in LQFP100, LQFP176, and BGA337 packages.

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