The T618(UMS512T)/T610(UMS512)/T310(UMS312) platform is an industrial-grade high-performance 4G smart module capable of running the Android operating system. It supports various standards including TDD-LTE/LTE-FDD/WCDMA/TD-SCDMA/CDMA2000/GSM; supports WiFi 802.11a/b/g/n/ac, BT5.0 LE for short-range wireless communication, and supports GPS/GLONASS/Galileo/Beidou satellite positioning; it supports various voice and audio codecs, and integrates a Mali-G52 3EE 2Core high-performance graphics engine, enabling smooth playback of 1080P video; it features multiple audio and video input/output interfaces and a rich set of GPIO interfaces.The supported frequency bands are shown in the table below:
|
Suffix Model |
CA-F | CA-C |
CA-O |
|---|---|---|---|
|
LTE-FDD |
B1/B2/B3/B5/B7/B8/B20(B17)/B28 |
B1/B3/B5/B8 |
n/a |
|
LTE-TDD |
B34/B38/B39/B40/B41 | B34/B38/B39/B40/B41 |
n/a |
|
TD-SCDMA |
B34/B39 | B34/B39 |
n/a |
|
EVDO/CDMA |
BC0 | BC0 |
n/a |
|
GSM |
B2/B3/B5/B8 | B3/B5/B8 |
n/a |
| Type | Frequency Band |
| WiFi 802.11 a/b/g/n/ac BT5.0 LEGNSS | 2412-2484MHz/5170-5835MHz2402-2480MHzGPS/GLONASS/Galileo/Beidou |
The T618(UMS512T)/T610(UMS512)/T310(UMS312) is a surface-mounted module with a total of 166 LCC pins. Its dimensions are only 40.5mm×50.5mm×2.85mm, making it suitable for embedding in various M2M product applications, ideal for developing in-vehicle computers, multimedia terminals, smart home devices, IoT terminals, and other mobile devices.
Main Performance of the Core Board
The table below describes the detailed performance parameters of T618/T610/T310:Detailed Performance Parameters:
|
T618 UMS512T |
T610 UMS512 |
T310 UMS312 |
|
|---|---|---|---|
|
Process |
12nm | 12nm |
12nm |
|
Application Processor |
4xCortex-A75 2.0Ghz 4xCortex-A55 1.8Ghz |
4xCortex-A75 1.8Ghz 4xCortex-A55 1.6Ghz |
1xCortex-A75 2.0Ghz 3xCortex-A55 1.8Ghz |
|
GPU |
ARM Mali G52@ 850 MHz | ARM Mali G52@ 650Mhz |
IMG GE8300 @ 800Mhz |
|
Camera Interface |
2 MIPI CSI (4 Data lanes) 48MP @ 24fps Dual Cameras: 24+8/16+16MP |
2 MIPI CSI (4 Data lanes) 32MP @ 30fps Dual Cameras: 16+8/13+13MP |
2 MIPI CSI (4 Data lanes) 16MP @ 30fps Dual Cameras: 16+8/13+13MP |
| video decode | 1080p 60fps H.264/H.265 | 1080p 60fps H.264/H.265 | 1080p 30fps H.264/H.265 |
|
video encode |
1080p 60fps H.264/H.265 | 1080p 60fps H.264/H.265 |
1080p 30fps H.264/H.265 |
|
LCM Interface |
MIPI DSI (4 Data lanes) Maximum resolution supported FHD+(2400×1080@60fps) |
MIPI DSI (4 Data lanes) Maximum resolution supported FHD+(2400×1080@60fps) |
MIPI DSI (4 Data lanes) Maximum resolution supported HD+(1600×720@60fps) |
Other Performance Parameters:
|
Performance |
Description |
|---|---|
|
Power Supply |
VBAT supply voltage range: 3.3V~4.6V Typical supply voltage: 3.8V |
|
Transmit Power |
Class 4 (33dBm±2dB) for GSM850/GSM900 Class 1 (30dBm±2dB) for DCS1800 Class E2 (27dBm±3dB) for EGSM900/GSM850 8PSK Class E2 (26dBm±3dB) for DCS1800 8PSK Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (24dBm+1/-3dB) for CDMA BC0 Class 3 (24dBm+1/-3dB) for TD-SCDMA B34/B39 Class 3 (23dBm ±2.7dB) for LTE FDD bands Class 3 (23dBm ±2.7dB) for LTE TDD bands |
|
LTE Features |
Supports 3GPP R12 CAT13 FDD and TDD Supports 1.4 – 20 MHz RF bandwidth Supports downlink (2×2/4×2/8×2) MIMO CAT7 Max 300Mbps (DL), CAT13 Max150Mbps (UL) |
|
WCDMA Features |
Supports 3GPP R9 DC-HSDPA Supports 16-QAM, 64-QAM and QPSK modulation 3GPP R6 HSUPA: Max 11Mbps (UL) 3GPP R8 DC-HSDPA: Max 42Mbps (DL) |
|
TD-SCDMA Features |
Supports 3GPP R9 TD-HSDPA: MAX 2.8Mbps(DL) TD-HSUPA: MAX 2.2Mbps(UL) |
|
CDMA Features |
Max 3.1Mbps (DL), 1.8 Mbps (UL) |
| GSM/GPRS/EDGE Features |
GPRS： Supports GPRS multi-slot class 12 Encoding formats: CS-1, CS-2, CS-3, and CS-4 Maximum 4 Rx slots per frame |
| GSM/GPRS/EDGE Features |
EDGE： Supports EDGE multi-slot class 12 Supports GMSK and 8PSK Encoding formats: CS1-4 and MCS 1-9 |
| WLAN Features |
2.4G/5G dual-band, supports 802 a/b/g/n/ac, up to 150Mbps Supports AP mode |
| Bluetooth Features | BT5.0 LE |
| Satellite Positioning | GPS/GLONASS/Galileo/Beidou |
| Short Message (SMS) |
Text and PDU modes Point-to-point MO and MT SMS broadcast SMS storage: default SIM |
| AT Commands | Not supported |
| LCM Interface |
4lane MIPI_DSI, each lane supports up to 1.5Gbps rate; Supports 2lane (lane 0/1), supports 3lane (lane 0/1/2) |
| Camera Interface |
3 groups of MIPI_CSI, CSI0 4lane 2.5Gbps/lane, CSI1 2lane 1.6Gbps/lane, CSI2 4lane 2.5Gbps/lane (4lane or 2x2lane) |
| Audio Interface |
Audio Input: 3 groups of analog microphone inputs 1 as headset MIC input, the other two are normal call noise-canceling MICs Audio Output: A) Speaker [email protected] (Bypass Mode), 8Ω load, Class-D mode [email protected] (Bypass Mode), 8Ω load, Class-AB mode B) Receiver C) Headphones |
| USB Interface |
Supports USB2.0 high-speed mode, maximum data transfer rate of 480Mbps Used for software debugging and software upgrades, etc. Supports USB OTG (requires additional 5V power supply chip) |
| USIM Card Interface |
2 groups of USIM card interfaces Supports USIM/SIM cards: 1.8V and 3V Supports dual SIM dual standby |
| SDIO Interface |
Supports SD3.0; 4bit SDIO; SD/MMC cards Supports hot swapping |
| I2C Interface |
4 groups of I2C, maximum speed up to 400K, can reach up to 3.4Mbps when using I2C DMA, for peripherals such as TP, Camera, Sensor, etc. |
| Antenna Interface | Main antenna, DRX antenna, GNSS antenna, WIFI/BT antenna interfaces |
| Physical Characteristics |
Dimensions: 40.5±0.15×50.5±0.15×2.85±0.2 mm Interface: LCC Warpage: <0.3mm Weight: 10.9g |
| Temperature Range |
Normal operating temperature: -20°C ~ +70°C Extreme operating temperature: -25°C and +80°C 1) Storage temperature: -40°C ~ +85°C |
|
Software Upgrade |
Via USB |
|
RoHS |
Complies with RoHS standards |
Notes:
|
1. “1)” indicates that when the module operates within this temperature range, the RF performance may deviate from specifications, such as increased frequency or phase errors, but it will not drop the connection. 2. “*” indicates that this function is currently under development. |
Functional Block Diagram
The following diagram illustrates the functional block diagram of T618/T610/T310, detailing its main functions:
⚫ Power Management
⚫ RF Section
⚫ Baseband Section
⚫ LPDDR4x+EMMC Memory
⚫ Peripheral Interfaces
–USB Interface
–USIM Card Interface
–UART Interface
–SDIO Interface
–I2C Interface
–ADC Interface
–LCD(MIPI) Interface
–TP Interface
–CAM(MIPI) Interface
–AUDIO Interface
Physical Dimensions
Top and Side View Dimensions
Bottom Dimensions (Top View)
Recommended Package (Top View)
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About New Move Technology Co., Ltd.
Shenzhen New Move Technology Co., Ltd. is a leading provider of mobile communication technology and IoT solutions, integrating technology research and development, product manufacturing, system integration, and product sales as a national high-tech enterprise and a national specialized and innovative enterprise.
The company established an SMT manufacturing subsidiary in 2018, with professional production equipment and modern production workshops, providing strong support for the production of core modules and customer-customized PCBA projects, offering a full range of services from R&D to manufacturing.
The company is headquartered in Baoan, Shenzhen, with a research and development center in Changsha, focusing on mobile communication technology (2G/3G/4G/5G) and Android smart IoT technology (Android, IoT).
Based on years of technical reserves and resource accumulation in the communication field, the company has established comprehensive strategic partnerships with globally renowned mobile chip manufacturers such as MediaTek (MTK), Unisoc, and Qualcomm, receiving strong technical support from the chip manufacturers. Our company keeps pace with major mobile chip manufacturers, continuously launching powerful Android communication modules, thereby providing customers with stable, reliable, and high-performance smart IoT hardware platforms. We offer comprehensive technical support covering the entire process from R&D, manufacturing, to supply chain, providing strong support for customers to quickly launch products. The successfully developed Android motherboards based on MediaTek, Unisoc, Qualcomm platforms have been widely used in smart handheld terminals, POS machines, advertising machines, robots, smart homes, industrial control, vehicle navigation, security monitoring, mobile medical, education and training, and IoT-related fields.
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