Communication | ASIC + Ethernet Process Acceleration, Focus on Domestic Manufacturers’ Development Opportunities

Written byHuang Yayuan, Wei Pengcheng, Li Heran

Broadcom’s latest financial report indicates that AI customized chips (ASIC) and Ethernet network products are driving rapid growth in its AI revenue, further proving the significant role of the ASIC + Ethernet model in the future development of the AI industry. Meanwhile, Broadcom predicts that by 2027, the Serviceable Addressable Market (SAM) for customized chips and networks will reach $60-90 billion. We expect that with the high growth of the customized chip market, Ethernet solutions will also experience rapid development. We particularly recommend manufacturers that are leading in Ethernet solution layouts.

Broadcom’s AI revenue is rapidly growing, benefiting from ASIC and Ethernet products.

At its Q4 2024 earnings call, Broadcom stated that AI customized chips (ASIC) and Ethernet network products are driving its AI revenue growth. Broadcom mentioned that three major cloud service providers have already established multi-generation technology roadmaps for AI customized chips, and Broadcom is also customizing development for the next generation AIXPU for two other large-scale companies. Broadcom expects that in the future, these cloud service providers plan to deploy 1 million XPU clusters within a single architecture, with a SAM scale reaching $60-90 billion by 2027. We believe that the model of CSP manufacturers developing customized chips + Ethernet is likely to experience rapid development in the future.

The ASIC + Ethernet combination has cost advantages over NV + IB, strengthening the trend of domestic Ethernet solutions accelerating their application in AI clusters.

In July 2023, Broadcom, Intel, AMD, Cisco, Arista, and others jointly established the “Super Ethernet Alliance,” subsequently launching RoCEv2 to counter NVIDIA’s monopoly trend in cluster interconnect technology. Chinese manufacturers such as Alibaba Cloud, Unisoc, and Ruijie Networks have since joined the Super Ethernet Alliance. Currently, many domestic AI clusters are adopting the Ethernet RoCEv2 solution, balancing cost, scalability, and high-speed low-latency performance. Broadcom’s FY24Q4 semiconductor revenue exceeded expectations, further validating the important role of Ethernet in AI clusters. In the first three quarters of 2024, both Unisoc and Ruijie’s 400G switch revenues have significantly increased, and the 800G switch is accelerating its introduction. At the chip level, Shengke Communication’s 12.8T/25.6T chips are now capable of mass production. We are optimistic about the sustained demand for leading domestic switch and switch chip companies. Additionally, as the scale of AI clusters expands, the demand for AIDC will also increase rapidly.

Inference end drives the demand for Ethernet optical modules, AEC has obvious advantages in short-distance connections.

As the business models for AI applications gradually mature, the demand at the inference end will drive rapid growth in the demand for Ethernet optical modules. In the future, optical modules are expected to experience dual-driven demand from “training end driving Infiniband network demand” + “inference end driving Ethernet demand.” In the investor communication records from Zhongji Xuchuang in June this year, it was also stated that the demand at the inference end is driving rapid growth in the sales of Ethernet switches and associated 800G optical modules. Leading domestic optical module manufacturers currently have a leading market share in overseas/domestic markets and are expected to benefit significantly from the booming future demand for Ethernet optical modules. Furthermore, due to its low cost, low power consumption, and high reliability, AEC has certain advantages over AOC and DAC in short-distance connections (3-7 meters), effectively meeting the short-distance network needs of AI. According to the latest report from SemiAnalysis, AWS has already introduced the AEC solution in its latest AI network architecture, so we are optimistic about the increasing penetration rate of AEC in AI networks and recommend paying attention to leading AEC companies and domestic companies with potential supply capabilities.

Risk Factors:

Progress in AI-related applications may not meet expectations; cloud service providers’ capital expenditures may fall short of expectations; demand for new technology routes like Ethernet may not meet expectations; leading manufacturers’ R&D progress may lag; industry market competition may intensify; technical path risks; supply chain risks;

Investment Strategy:

Broadcom’s latest financial report indicates that AI customized chips (ASIC) and Ethernet network products are driving rapid growth in its AI revenue, further proving the significant role of the ASIC + Ethernet model in the future development of the AI industry. Meanwhile, Broadcom predicts that by 2027, the SAM for customized chips and networks will reach $60-90 billion. We expect that with the high growth of the customized chip market, Ethernet solutions will also experience rapid development. We particularly recommend manufacturers that are leading in Ethernet solution layouts, such as leading switch and switch chip companies; the optical module supply chain and AEC leaders; and AIDC leaders.

Communication | ASIC + Ethernet Process Acceleration, Focus on Domestic Manufacturers' Development Opportunities

Communication | ASIC + Ethernet Process Acceleration, Focus on Domestic Manufacturers' Development Opportunities

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