BYD Semiconductor Obtains Patent for Heat Exchange Structure, Enhancing Heat Exchange Efficiency

The “temperature war” in the new energy vehicle sector is quietly escalating. While consumers worry about range anxiety, engineers are brainstorming another battle—how to keep batteries, motors, and power modules operating within optimal temperature ranges. Recently, a new patent from BYD Semiconductor has provided an elegant solution for this battle.

From “Linear Thinking” to “Three-Dimensional Maze”: The Evolution of Heat Exchange Tubes

Traditional heat exchange structures resemble a straight pipe, where the refrigerant rushes through, carrying away limited heat. However, BYD’s new patent makes the heat exchange tube “smarter”.

The core technology lies in the S-shaped extended second heat exchange tube. These tubes resemble a three-dimensional maze, where the refrigerant, flowing in a winding manner, increases its contact area with the tube walls. Just like running on a curve is more strenuous than on a straight path, the refrigerant’s “steps” slow down, but it has more opportunities to absorb heat. Data shows that this structure can improve heat exchange efficiency by over 30%, equivalent to upgrading the thermal management system from a “brisk walk” to a “jog”, while carrying away more heat.

Temperature Balancing Technique for Power Modules

The cleverness of this patent goes beyond just improving heat exchange efficiency. When applied to power modules, the S-shaped tubes naturally form a multi-channel parallel structure. Just like a river flowing more smoothly after branching, the temperature differences between phases are significantly reduced. Tests show that power modules using this structure have a maximum to minimum temperature difference reduced from 5°C to below 2°C, making this “temperature balancing technique” allow chips to operate more stably, extending their lifespan by about 20%.

BYD Semiconductor’s “Thermal Management Code”

A look at BYD Semiconductor’s technical history reveals that its dedication to thermal management has long been embedded in its DNA. The IGBT module launched in 2017 reduced junction temperature by 20% through dual-sided water cooling technology; the SiC module of 2020 improved thermal conductivity using silver sintering technology. This heat exchange structure patent is just a new weapon in its thermal management “arsenal”.

This continuous innovation reflects BYD Semiconductor’s profound understanding of the underlying logic of new energy vehicles—while pursuing performance limits, it is essential to tame the “heat beast”. As one thermal design engineer put it: “BYD Semiconductor’s technical route is like installing an air conditioning unit on power devices, and this unit’s efficiency is continuously evolving.”

BYD Semiconductor Obtains Patent for Heat Exchange Structure, Enhancing Heat Exchange Efficiency

The Thickness of Patents Determines the Height of the Industry

By 2025, BYD Semiconductor is expected to hold 1,422 patents covering the entire industry chain of chip design, packaging, and thermal management. This technological reserve has built a moat in the automotive-grade semiconductor field. For instance, the heat exchange structure patent can not only be used in new energy vehicles but also has potential applications in high heat density scenarios such as 5G base stations and rail transit.

While the industry is still discussing “software-defined vehicles”, BYD Semiconductor proves with its hard-core patents that without solid hardware innovation, even the coolest software is just a castle in the air. This “hard technology” mindset may be the key to its ability to break through in the semiconductor winter.

Making Every Degree of Energy Count

The ultimate competition in new energy vehicles is essentially a contest of energy utilization efficiency. BYD Semiconductor’s heat exchange structure patent allows the refrigerant to carry away more heat and enables power modules to waste less energy. This meticulous technical innovation is a reflection of China’s manufacturing moving towards high-end.

In the future, when consumers enjoy a quieter cabin and longer range, they may not realize that these enhancements stem from the “thermal dance” within an S-shaped heat exchange tube. Meanwhile, BYD Semiconductor is already brewing a new energy revolution with its next patent.

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