Challenging Times: Chip Tape-out Success Rate Hits Historic Low with 8 out of 10 Companies Failing

Challenging Times: Chip Tape-out Success Rate Hits Historic Low with 8 out of 10 Companies Failing

The semiconductor industry is facing unprecedented technical challenges, with the chip tape-out success rate dropping to a historic low!

According to data from Siemens, an Electronic Design Automation (EDA) company,the success rate of first-time chip tape-outs has fallen to a historic low of 14%, a significant decrease from 24% two years ago.

In other words,eight out of ten chip design companies encounter failures during their first tape-out.

IC design professionals analyze that this is mainly due to increased chip complexity and changes in corporate development models. In the future, specialized divisions and outsourcing to ASIC companies will become trends.

Tape-out is a critical milestone in chip design, akin to a life-and-death test, as it involves submitting the completed chip design to a foundry for sample production to verify whether the design meets expectations.

If it fails, not only are the millions invested in R&D wasted, but it may also result in missed market opportunities.

Challenging Times: Chip Tape-out Success Rate Hits Historic Low with 8 out of 10 Companies Failing

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Challenging Times: Chip Tape-out Success Rate Hits Historic Low with 8 out of 10 Companies Failing

Challenging Times: Chip Tape-out Success Rate Hits Historic Low with 8 out of 10 Companies Failing

Challenging Times: Chip Tape-out Success Rate Hits Historic Low with 8 out of 10 Companies Failing

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