High Power Density Power Module for Edge AI Applications

High Power Density Power Module for Edge AI Applications

In modern AI data centers and edge computing environments, high power density and integration are mandatory requirements. To meet the demand for efficient power management solutions, Microchip Technology has launched the MCPF1412 power module, a highly integrated Point of Load (POL) buck converter featuring I2C and PMBusĀ® interfaces, compact size, system telemetry, and protection functions, … Read more