Texas Instruments Launches Stackable DC/DC Buck Converter for Enhanced Power Density in High-Current FPGAs and Processors

Texas Instruments Launches Stackable DC/DC Buck Converter for Enhanced Power Density in High-Current FPGAs and Processors

Texas Instruments (TI) today launched a new stackable integrated circuit (IC) 40-A SWIFT™ DC/DC buck converter. The TPS546D24A PMBus buck converter can deliver up to 160A of output current at an ambient temperature of 85°C, which is four times higher than other power integrated circuits on the market. Among many 40A DC/DC converters, the TPS546D24A … Read more

High Power Density Power Module for Edge AI Applications

High Power Density Power Module for Edge AI Applications

In modern AI data centers and edge computing environments, high power density and integration are mandatory requirements. To meet the demand for efficient power management solutions, Microchip Technology has launched the MCPF1412 power module, a highly integrated Point of Load (POL) buck converter featuring I2C and PMBus® interfaces, compact size, system telemetry, and protection functions, … Read more