Siemens EDA: First Tape-Out Success Rate Drops to 14% in 2024!

Siemens EDA: First Tape-Out Success Rate Drops to 14% in 2024!

On May 14, according to EEnews Europe, Abhi Kolpekwar, Vice President and General Manager of Siemens EDA’s Design Verification Technology, stated that the first tape-out success rate (referring to chips based on advanced process technology) is currently declining, having dropped from 32% in 2020 and 24% in 2022 to 14% in 2024. “This is a … Read more

Dramatic Decline in First Silicon Success Rate for Chips!

Dramatic Decline in First Silicon Success Rate for Chips!

The success rate of first silicon for chips is sharply declining due to the increasing complexity of chip manufacturing, the need for more iterations as manufacturers shift from single-chip to multi-chip components, and the growing demand for customization, which extends the design and verification process. Details from a new functional verification survey highlight that developing … Read more