Technical Article | Optional Spacing and Component Isolation for Printed Circuit Boards with ‘ic’ Protection Level Assembly

Technical Article | Optional Spacing and Component Isolation for Printed Circuit Boards with 'ic' Protection Level AssemblyTechnical Article | Optional Spacing and Component Isolation for Printed Circuit Boards with 'ic' Protection Level Assembly

PCEC

Technical Article

As an option to reduce the spacing requirements for conductive components, when the pollution level is controlled to level 2 or lower, the spacing and component isolation of printed circuit boards with ‘ic’ protection level assembly can use the reduced spacing shown in Table 1 under the following conditions. That is, if the rated voltage of the equipment or the nominal voltage of any part does not exceed 60 V peak, there are no other requirements for isolation spacing apart from general industrial standards. Equipment with a rated voltage in the range of 60~375 V peak should meet the requirements for creepage distance and air gap as specified in Table 1. Regardless of whether inside or outside the equipment, measures should be taken to limit the circuit to the overvoltage category II as specified in GB/T 16935.1—2023 “Insulation Coordination for Equipment in Low-Voltage Power Supply Systems Part 1: Principles, Requirements, and Tests”.

Table 1 Special Conditions for Protection Level, Materials, and Installation Compliance

Electrical Clearance, Creepage Distance, and Spacing for ‘ic’ Protection Level

Technical Article | Optional Spacing and Component Isolation for Printed Circuit Boards with 'ic' Protection Level AssemblyTechnical Article | Optional Spacing and Component Isolation for Printed Circuit Boards with 'ic' Protection Level AssemblyTesting and Inspection Center Chen MingweiSpecialty:Inspection and Research of Explosion-Proof ProductsContact:

13602068923

[email protected]

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Technical Article | Optional Spacing and Component Isolation for Printed Circuit Boards with 'ic' Protection Level Assembly

Technical Article | Optional Spacing and Component Isolation for Printed Circuit Boards with 'ic' Protection Level Assembly

Technical Article | Optional Spacing and Component Isolation for Printed Circuit Boards with 'ic' Protection Level Assembly

– End –

Planning: PCEC Testing and Inspection Center

Text/Image: Chen Mingwei

Review: Liu Bing, An Penghui

Editor: Meng Fanhua

Chief Editor: Jia Lei

Supervisor: Yin Hong

Technical Article | Optional Spacing and Component Isolation for Printed Circuit Boards with 'ic' Protection Level Assembly

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The copyright of this article belongs to Zhongchuang Xinhai (Tianjin) Certification Service Co., Ltd. Any infringement will be pursued legally.

If you need to reprint, please contact PCEC first:022-26651066/

18698107480/[email protected].

Technical Article | Optional Spacing and Component Isolation for Printed Circuit Boards with 'ic' Protection Level Assembly

Technical Article | Optional Spacing and Component Isolation for Printed Circuit Boards with 'ic' Protection Level Assembly

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