PCB Design Insights: EMI and Thermal Management for 800G Systems

PCB Design Insights: EMI and Thermal Management for 800G Systems

As the industry accelerates towards 800G Ethernet and optical interconnects, engineers face new challenges in managing electromagnetic interference (EMI) at unprecedented speeds while ensuring signal integrity. The shift to 112G Pulse Amplitude Modulation 4 (PAM4) SerDes technology not only brings faster edge rates and denser spectral content but also significantly increases the risk of radiated … Read more