Weekly Insights on a Chip Company: Rockchip

Weekly Insights on a Chip Company: Rockchip

1. Basic Information Rockchip was established in 2001 and is headquartered in Fuzhou, with subsidiaries in Shenzhen, Shanghai, Beijing, Hangzhou, and Hong Kong, creating a broad business network. On February 7, 2020, Rockchip successfully went public on the Shanghai Stock Exchange, with stock code 603893, marking its entry into the capital market. The company focuses … Read more

Industry Trends: Security Monitoring Main Chip (SoC) Series – Rockchip RV1103

Industry Trends: Security Monitoring Main Chip (SoC) Series - Rockchip RV1103

The security industry has emerged in response to the modern society’s demand for safety. With the reform and innovation of video surveillance technology, the industry has gone through four stages: analog monitoring, digital monitoring, network high-definition monitoring, and intelligent monitoring. Each breakthrough in these stages has been led by innovations in upstream technology.In security monitoring … Read more

Introduction to Rockchip Electronics Co., Ltd. and Its Chips RK3288 and RK3588

Introduction to Rockchip Electronics Co., Ltd. and Its Chips RK3288 and RK3588

Introduction to Rockchip Electronics Co., Ltd. 1. Company Overview Rockchip Electronics Co., Ltd. (abbreviated as “Rockchip”) was established in 2001 and is headquartered in Fuzhou, Fujian Province, China. It is a high-tech enterprise focused on integrated circuit design and research and development. The company adopts a Fabless model, concentrating on chip design, while wafer manufacturing, … Read more

From SoC to SoIC to CIC

Source: SiP and Advanced Packaging Technology Original Author: Suny Li The differences and similarities between SoC (System on Chip), SoIC (System on Integrated Chip), and CIC (Cubic Integrated Circuit) will be compared and interpreted today. SoC SoC stands for System on Chip, which is a system or product formed by combining multiple integrated circuits with … Read more

Full Big Core vs. Tri-Cluster: Major Changes Expected in the New Flagship SoC

Full Big Core vs. Tri-Cluster: Major Changes Expected in the New Flagship SoC

Recently, leaked information has revealed that MediaTek’s next-generation flagship SoC, the Dimensity 9300, may adopt a full big core CPU architecture. Based on ARM’s new mobile processor reference design, it will feature a “4+4” configuration, consisting of 4 Cortex-X4 super big cores and 4 Cortex-A720 big cores. Additionally, it will upgrade to the new fifth-generation … Read more

China’s Chips! The Hidden Gold Mine of Chip Manufacturers in the Mid-Range Market

China's Chips! The Hidden Gold Mine of Chip Manufacturers in the Mid-Range Market

This article is sourced from: Intelligent Communication Positioning Circle Recently, Counterpoint Research released its global smartphone AP/SoC chip market research report for Q4 2024. The report shows that MediaTek, Apple, Qualcomm, UNISOC, Samsung, and HiSilicon occupy the top six positions, with market shares of 34%, 23%, 21%, 14%, 4%, and 3% respectively, accounting for 99% … Read more

Real-Time Ray Tracing! Android Flagships to Feature It in Six Months

Real-Time Ray Tracing! Android Flagships to Feature It in Six Months

Real-time ray tracing will become standard. In addition to the iPhone equipped with Apple’s self-developed A-series chips, most Android manufacturers’ SoCs come from Qualcomm, MediaTek, and Samsung. Image source: wccftech. Qualcomm, MediaTek, and Samsung are not deeply involved in the independent design of CPU and GPU architectures for their SoCs, leaning more towards Arm’s public … Read more

TaiLing Microelectronics Achieves Bluetooth Low Energy 5.3 Certification

TaiLing Microelectronics Achieves Bluetooth Low Energy 5.3 Certification

TaiLing Microelectronics has recently obtained the Bluetooth 5.3 certification issued by the Bluetooth Special Interest Group. This certification encompasses all core technical specifications at the controller level related to Bluetooth Low Energy Audio (LE Audio) and the latest features of Bluetooth Low Energy 5.3, making it one of the first chip manufacturers to fully support … Read more

Optimization of Dynamic Address Mapping for Multi-I2C in SoC

Optimization of Dynamic Address Mapping for Multi-I2C in SoC

For many years, I have been troubled by a reuse issue in C, such as when we establish an I2C IP register address offset, and there are multiple I2Cs on the SoC, each with irregular offsets. How can we solve the problem of calling this function with different offsets for multiple I2Cs in a single … Read more

Zhuhai Company Successfully Tapes Out AI Chip!

Zhuhai Company Successfully Tapes Out AI Chip!

Jimu Network ยท Love Jimu APP, available for download in major app stores Recently, Zhuhai Haoze Technology Co., Ltd., a leading company in the domestic integrated AI vision chip field, announced that its self-developed first ultra-performance integrated AI chip, VVT300, has successfully taped out, marking the transition of the chip from the theoretical stage to … Read more