What is an AI Agent?

Today, let’s discuss what exactly an AI Agent is. Recently, the concept of intelligent agents has become quite popular, and I will share my personal understanding of it. If there are any inaccuracies, I welcome your criticism and corrections. AI refers to the artificial intelligence technologies we are familiar with today, such as ChatGPT, DeepSeek, … Read more

Listening to Bach: The Semiconductor King TSMC’s Zhang Zhongmou Interpreted by Yu Qiuyu

📖 Reading the newspaper in the morning with Bach, reading biographies in the afternoon with Beethoven, and listening to Mozart before bed while reading literary essays… This is a wise person who maintains a rich inner life in a complex world, designing every moment of life so exquisitely. Flipping through “The Autobiography of Zhang Zhongmou”, … Read more

Global Chip War: Restructuring and Breakthroughs in the Semiconductor Industry

In the first quarter of 2025, TSMC announced the official mass production of its 1.4nm process technology, achieving a transistor density of 320 million per square millimeter—equivalent to shrinking the entire map of New York City down to the size of a fingernail. Meanwhile, the latest data from the U.S. Department of Commerce shows that … Read more

Detailed Explanation of Semiconductor IGBT with Built-in Fast Recovery Diode (FRD)

IGBT with Built-in Fast Recovery Diode (FRD) IGBT product lineup includes types with built-in fast recovery diodes (hereinafter referred to as “FRD”). In inverter and motor drive applications using IGBT, the diode is also used as a path for the reverse current generated during switching. This diode is known as a “freewheeling diode,” and is … Read more

Weekly Report on Glass Substrates: Surge in Demand for Semiconductor Glass Substrates! Multiple Companies Accelerate Capacity Layout to Seize Market Heights

Gobi Jia is laying out glass substrates, and nano-microcrystalline glass has entered the terminal supply chain Microcrystalline glass: Source:Gobi Jia On June 12, during the 2025 online collective reception day for investors of listed companies in Hubei, the person in charge of Gobi Jia stated that the company’s glass substrate and carrier board business has … Read more

Power Semiconductors: The ‘Energy Backbone’ Behind Military Equipment

When missiles pierce the sky, radars scan vast distances, and warships cut through waves, the “power source” of these steel beasts is the seemingly unremarkable yet crucial power semiconductor devices. Harsh Military Environments: Commercial Devices Struggle Extreme Temperatures: The surface of missiles reaches extremely high temperatures when crossing the atmosphere, while polar equipment faces -50℃ … Read more

Semiconductor Investment Market Update for the Fourth Week of June

Semiconductor Investment Market Update for the Fourth Week of June 1. Yitang Co., Ltd.: Two core products rank second globally in market share, with technology reaching international leading levels. 2. Domestic chips receive timely capital support. 3. Ximi Technology secures Series B funding. 4. Another financing of 3.1 billion yuan is needed; previous fundraising projects … Read more

Semiconductor Insights | Semiconductor Chip Industry News July 4

01 Market Dynamics and Industry Trends U.S. Department of Commerce / Synopsys / Cadence: Lifted export restrictions on chip design software to China, allowing Synopsys, Cadence, and Siemens to resume sales to China, resulting in a surge in related stock prices and a net inflow of 21.585 billion yuan into the electronics sector. This move … Read more

Introduction to Semiconductor Packaging Processes and Equipment

The semiconductor manufacturing process can be divided into front-end and back-end processes. The front-end process mainly involves wafer manufacturing, while the back-end process primarily focuses on packaging and testing. Among these, packaging (Package) in the back-end process refers to a series of technical methods that connect tested integrated circuit bare chips (Die) to external circuits, … Read more

Common Software Engineering Methods in Embedded Development

What are the common software engineering methods in embedded development? Follow UsLearn Embedded Together, learn and grow together 1. Object-Oriented Programming (OOP) Although C is not an object-oriented programming language, with some programming techniques, it can achieve the core features of Object-Oriented Programming (OOP), such as encapsulation, inheritance, and polymorphism. 1. Encapsulation Encapsulation is the … Read more