Just over a month since the official launch of the optoelectronic epitaxy and chip project on July 16, Zhaochi Integrated, a subsidiary of Zhaochi Co., has announced a key milestone:
Optoelectronic Chip Project
The project has initiated the tape-out of the 2.5G DFB laser chip. The tape-out process is completed on the company’s own production line, and mass production is expected to be achieved within this year, targeting a 50% share of the existing markets for telecommunications and optical modems.
Zhaochi Quality! Performance Benchmarking Against Leading Competitors
The 2.5G DFB laser chip is the core light source for optical communication network access. The chip adopts a Distributed Feedback (DFB) structure, capable of stable output at 1270nm, 1310nm, or 1490nm single longitudinal mode laser at a rate of 2.5G bps, primarily integrated into optical modules for Fiber to the Home (FTTH) ONU/OLT ends, serving as the “entry ticket” for optoelectronic chip manufacturers into the mainstream supply chain.
This time, Zhaochi Integrated’s optoelectronic epitaxy and chip project 2.5G DFB laser chip product has entered the tape-out stage, indicating that the project has transitioned from the core technology R&D phase to the critical validation stage before mass production, laying a solid foundation for achieving the mass production target in 2025.
In terms of product performance, the comprehensive performance indicators of this round of tape-out for the 2.5G DFB laser chip are superior compared to leading competitors, allowing Zhaochi Integrated to successfully transition from the “usable” stage to the “well-usable” range.
According to the plan, after the tape-out is completed, the project will enter the packaging testing and customer sampling stage, with mass production expected to be achieved within the year. Looking further ahead, with the rollout of the 2.5G products, Zhaochi Integrated will use this as a starting point to continuously refine the process, improve product performance, and capture 50% of the market share for 2.5G DFB laser chips with dual support from technology and production capacity.
Zhaochi Efficiency! Full Series Product Planning Initiated
While running the 2.5G process platform, Zhaochi Integrated has also simultaneously initiated the epitaxial growth work for 10G and 25G DFB laser chips. In terms of target planning, Zhaochi Integrated plans to launch 50G DFB and 100G VCSEL chips by 2026, focusing on the passive optical network (PON) and short-distance optical interconnect module markets to meet the demands for high-density, low-latency data transmission.
On the technical side, Zhaochi Integrated has initiated R&D on silicon photonics and PIC technology, aiming to build highly integrated optoelectronic solutions for co-packaged optics (CPO) architecture, providing core engine support for the next generation of data center optical interconnects.
Zhaochi Model! Replicating the Successful Path of LEDs
Zhaochi Integrated is a subsidiary of Zhaochi Co., which is the project company for LED chips under Zhaochi Semiconductor.
The main substrate for LED chips is sapphire, and this technology shares origins with compound semiconductor processes such as GaAs, SiC, and GaN. Following the homogeneity of substrate technology and the coverage of full-spectrum technology, Zhaochi Semiconductor has been continuously transforming and upgrading towards compound semiconductor enterprises in recent years, extending the application range of chips to optical communication, RF devices, power devices, and more. These technological and experiential accumulations have deeply empowered Zhaochi Integrated and become the foundation for the “efficient” characteristics of the optoelectronic epitaxy and chip project.
From a planning perspective, the roadmap from 2.5G to 10G, 25G, and even future 800G and 1.6T replicates the growth path of Zhaochi Semiconductor during the LED era: first accumulating process, yield, and cost advantages in the massive general lighting chip market, then leaping into high-value niche markets.
Zhaochi Semiconductor has followed this rhythm from general LEDs to high-end scenarios such as automotive, infrared, and ultra-high-definition displays; now, the optical communication track will also replicate this growth curve. With the achievement of the mass production target for the 2.5G DFB laser chip, Zhaochi is expected to dominate the access network optical chip market and lay the foundation for the competition in next-generation optical communication technologies.
Selected Past Highlights
Optoelectronic chip project officially launched! Zhaochi targets the golden track of AI computing power
Secured large orders to lock in future growth, Zhaochi’s BOSA devices capture 40% market share in their first battle
High-tech strength reinforced, interpreting the top ten core highlights of Zhaochi Co. in the first half of the year