Unveiling PCB Embedded Power Semiconductor Technology Solutions: Part One – Magna and Vitesco’s Solutions

– Analysis of “PCB Embedded Power Chips”

– Original Author: Mr.H, Source: Magna, Vitesco

– This article is an excerpt from Knowledge Planet, the full report and interpretation are published on Knowledge Planet

– Over 1000 latest global automotive power system related reports and analyses have been uploaded to Knowledge Planet, welcome to learn and communicate

Introduction: Recently, PCB embedded power semiconductor technology has become a hot topic in the industry. From the information currently available, this technology indeed has great prospects, but it will also have a significant impact onthe controller industryand even the entire industrial chain will have considerable impact.With the popularization of power devices embedded in PCB technology, the supply chain will become simpler and more efficient; and controller companies will also face transformation, with challenges and opportunities coexisting.

| SysPro Note: The technology of embedding power devices into PCBs refers to directly embedding power chips, passive components, etc. into the PCB board, achieving integration of components and PCB through special manufacturing processes.

Regarding this technology direction, many interpretations have been made previously: Magna, Vitesco and other technical solutions. I would like to take this opportunity to reorganize. The core purpose is to gain an overall understanding of the market status, advantages and challenges, solutions, and implementation methods of this technical route, to see the whole picture. Finally, review as a whole,how doesTA find the best balance between power, efficiency, and material utilization to design an efficient traction inverter, thus increasing the range of electric vehicles? Tentatively set as a trilogy.

Catalog

Part One: Market Solution Unveiling

1. Vitesco’s Solution

• 1.1 Introduction of Technical Solutions

• 1.2 Advantages of Technical Solutions

• 1.3 Performance and System Benefits

2. Magna’s Solution

• 2.1 Reasons for Magna to Adopt Embedded Power Semiconductor Technology

• 2.2 Process of Embedded PCB Technology (Published on Knowledge Planet)

• 2.3 Switching Loss Performance of Embedded Power Modules (Published on Knowledge Planet)

• 2.4 Summary of Embedded Power Module Characteristics

Part Two: Unveiling Embedded PCB Power Semiconductor Technology (Part One)

1. Basic Concepts

2. Structural Features

3. Overview of Process Technology

4. Application Technologies

5. Challenges and Solutions

Part Three: Unveiling Embedded PCB Power Semiconductor Technology (Part Two)

1. Chip Types

2. Switching Characteristics

3. Packaging Technology

4. … (To be supplemented)

Note: Excerpt, full content published on Knowledge Planet

01

Vitesco’s Solution

Vitesco showcased their latest motor controller solution at the 2024 ATC Summit: PCB Embedded Power Chip Technology. Vitesco mentioned their product roadmap in the report, as shown in the figure below. It can be seen that Vitesco focuses on wide bandgap semiconductor solutions, with various packaging and interconnection technologies.

Image Source: Vitesco

1.1 Advantages of Technical Solutions

So, what are the benefits of embedding power chips into PCB substrates? Here, I will first explain the benefits, and then explain the reasons.

1. Under the same current and power output, the amount of semiconductor required for PCB embedded power modules is reduced. This advantage not only reduces production costs, but also improves the integration and reliability of the system. The main contributions come from the following two points:

• PCB embedded power semiconductors have lower thermal resistance. In high-performance scenarios, the average current output capability per chip can reach +30 A;

• Lower switching losses. Under the same working conditions, the embedded solution can achieve +11 A loss optimization. Low switching losses mean higher energy efficiency, which not only helps reduce energy consumption during system operation but also minimizes the impact of heat generated during switching on system performance.

Image Source: Vitesco

2. In rapidly evolving xEVs, embedded PCB power semiconductor technology also demonstrates its rapid design iteration capability. This feature significantly shortens product development cycles and accelerates the time to market for new products. This is mainly due to its high flexibility:

• Embedded PCBs can accommodate more components, providing greater space and possibilities for design. We can adjust and optimize circuit designs according to actual application needs, thus meeting various complex application scenarios.
• Better scalability. Due to the flexible design space, by exploring and applying new circuit topologies, embedded PCBs can implement multiple variants according to user application needs, achieving more efficient and stable power conversion and control.

Image Source: Vitesco

3. Finally, it should be noted that: PCB embedded power semiconductors, due to their aforementioned high output, flexibility, scalability, and other advantages, have made significant contributions to gate drive and primary absorption capacitors, further enhancing the performance and reliability of power modules.

| SysPro Note: This may be difficult to understand, let me explain.

First, let’s talk aboutgate drive, which is the key to controlling power semiconductor devices switching. The optimized design of its circuit ensures that power semiconductor devices can quickly and accurately respond to control signals during switching, affecting switching speed and switching losses. Meanwhile, PCB embedded power semiconductor technology allows us to ensure the integrity and accuracy of gate drive signals during transmission through meticulous circuit layout and wiring, or by using high-performance materials and processes.

Primary absorption capacitors play a role in absorbing voltage spikes and suppressing electromagnetic interference. Similar to above, PCB embedded power semiconductor technology allows us to have more possibilities in the layout and connection methods of capacitors, reducing parasitic inductance and resistance of the capacitors, thus improving the absorption capacity and response speed of the capacitors. This means that during switching, generated voltage spikes can be absorbed and suppressed more effectively, protecting power semiconductor devices from over-voltage damage. At the same time, it also helps to reduce electromagnetic interference, enhancing the electromagnetic compatibility of the module.

Image Source: Vitesco Report

1.2 How is the performance and system benefits?

So, what about the performance and system benefits of this technology?

1. Performance aspect. Under the same chip area, PCB embedded technology has lower thermal resistance, can carry more current, in other words: for the same flow requirement, this technology can reduce semiconductor usage by 20% to 30%.

Image Source: Vitesco Report

2. Efficiency aspect. In the same WLTC cycle spectrum, PCB embedded technology can reduce inverter losses by more than half compared to frame-style packaging technology. This means that to meet the same range requirements, battery usage can be reduced, achieving cost reduction for the whole vehicle. In addition, lower switching losses allow for higher switching frequencies to benefit the overall system efficiency, achieving smaller inverter sizes, higher maximum motor speeds, etc.

Image Source: Vitesco Report

3. Lifespan performance. Under the same temperature conditions, power cycling test results show that the lifespan of embedded power modules is far greater than that of frame-style packaging technology.

Image Source: Vitesco Report

02

Magna’s Solution

Magna adopted a new topology in the next-generation electric drive system inverter: embedded power semiconductor technology.

2.1 Why is Magna doing this?

Why is Magna doing this? Mainly for the following reasons:

First, technological differentiation is a major highlight of PCB embedded power modules. Compared to other technologies, this module exhibits uniqueness in multiple aspects. Its unique design philosophy and advanced manufacturing processes enable the module to outperform similar products in performance, thus meeting the urgent market demand for high efficiency and reliability.

Secondly, in terms of design freedom and scalability. This technical solution has high customizability, allowing designers to flexibly adjust the configuration and parameters of the module according to specific application scenarios and needs. This design freedom not only improves product adaptability, but also significantly shortens the product application development cycle and reduces costs. Meanwhile, the module’s scalability is also very strong, whether for small-scale applications or large-scale system integration, it can easily cope, demonstrating strong application potential.

In addition, very low switching losses are another significant advantage of PCB embedded power modules. This technical solution successfully reduces energy losses during switching by using advanced semiconductor materials and optimized circuit designs, improving energy utilization efficiency. This characteristic is particularly important for high-power devices that require stable operation for long periods; it not only can reduce operating costs, but also extend service life.

Image Source: Magna

2.2 Process of Embedded PCB Technology

(Published on Knowledge Planet)

So, how did this technology evolve from SiC chips to inverters step by step? This process is briefly described in the figure below.

2.3 Switching Loss Performance of Embedded Power Modules

(Published on Knowledge Planet)

This figure shows the advantages of this technology in terms of switching losses. The black and red curves represent the performance data of frame-style modules and embedded modules.…..

2.4 Summary of Embedded Power Module Characteristics

This figure summarizes the design indicators of Magna’s 800V SIC embedded power board, with the following characteristics:

• Uses MPT 800V SiC chips

• Peak current of 530Arms

• Each half-bridge uses 250mm2 of SiC material

• Module adopts single-sided cooling design

Image Source: Magna

The above is about the research on the Vitesco and Magna PCB embedded power semiconductor technology solutions, based on existing information, this solution is still in the prototype stage. To truly move towards mass production and obtain mature and reliable products, there are still many issues to solve, such as control, heat dissipation, EMC, materials, and process technology. We will discuss these issues later.

The above is an excerpt from <PCB Embedded Power Semiconductor Technology Solutions Trilogy Part One content, the original report and complete interpretation content are published on Knowledge Planet (click the end of the article “Read the Original”) The original materials are sourced from Vitesco and MAGNA public sharing, based on ensuring the original purpose of the content, the structure has been reorganized, the content has been expanded, and explanations have been added. (Click the link below in the original report to jump)

• Magna: Magna’s Next Generation Electric Drive System
• Vitesco: PCB Embedded Power Module

Thanks to Vitesco and MAGNA engineering technicians for their contributions to efficient traction inverters, it has been greatly beneficial!Hope the above content is also helpful to you!

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November 14, 2024

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