Infineon’s 1200V Chip Embedded PCB Solutions

– Introduction to PCB Embedded Power Semiconductor Technology Solutions

– Excerpt from “SysPro Power Electronics” Knowledge Sphere

– Original article, materials sourced from various solution providers’ product solutions

– This is an excerpt, the complete content will be published in the Knowledge Sphere, welcome to learn and communicate

Introduction: When it comes to PCB embedded power semiconductor technology, the first thing that might come to mind is Infineon’s 1200V CoolSiC™ chip embedded PCB innovative solution, which has been considered in the product portfolios of many domestic and international power system suppliers. The birth of the 1200V CoolSiC™ chip embedded PCB is attributed to the close cooperation between Schweizer and Infineon. So, who exactly is Schweizer? What technical accumulation does it have that contributed to the birth of this innovative technology? Today, we will explore this through three reports.

Table of Contents

1. Schweizer Electronic AG and 1200V CoolSiC™ Chip Embedded PCB

2. Report: Infineon SiC Chip Embedding Technology

3. Report: Schweizer’s Advanced Embedded PCB Technology in Various Application Areas

4. Report: Trends in PCB Technology Development and Embedded Technology Applications in PCBs

Note: This is an excerpt, the complete content will be published in the Knowledge Sphere (click “Read the Original” at the end of the article)

01

Schweizer Electronic AG and

1200V CoolSiC™ Chip Embedded PCB

Schweizer Electronic AG is a German company with a long history and excellent reputation, established in 1849, specializing in the field of printed circuit board (PCB) manufacturing. As an important manufacturer of RF printed circuit boards in the automotive and industrial sectors, Schweizer Electronic AG provides high-quality PCB products and innovative solutions and services in the fields of automotive, solar energy, industrial, and aerospace.

Collaboration with Infineon

Schweizer Electronic AG has established a close cooperative relationship with Infineon, aiming to further enhance the efficiency of silicon carbide (SiC) based chips. Specifically, they directly embed Infineon’s 1200V CoolSiC™ chip into printed circuit boards (PCBs), this innovative solution aims to increase the range of electric vehicles and reduce total system costs.

Through this collaboration, Schweizer Electronic AG, with its innovative p²Pack® solution, enables power semiconductors to be efficiently embedded in PCBs. This embedding technology not only improves the system integration, but also significantly enhances system efficiency and reliability. The two companies demonstrated this new solution by embedding a 48V MOSFET in the PCB, resulting in a 35% performance improvement.

Image Source: Schweizer

Having discussed the story of Schweizer Electronic AG and Infineon, let’s return to technology and see what highlights their collaboration brings? What differences does it bring to industry development and the market? This will be illustrated through three reports.

02

Report 1: Infineon SiC Chip Embedding Technology

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About Infineon (Infineon) chip embedding technology in silicon carbide (SiC) applications, it mainly discusses the combination of Infineon’s 1200V CoolSiC Gen2p technology, Smart p² Pack^® packaging technology, and the third generation EiceDRIVER™ gate driver, and demonstrates their efficient performance in fields such as electric vehicles. Here are the key technology summaries from the materials:

1. CoolSiC Gen2p Technology:

• High Performance and Efficiency Improvement:CoolSiC Gen2p is an advanced power semiconductor technology from Infineon, providing significant performance and efficiency improvements for 800V automotive applications (especially for main inverters).
• Low On-Resistance and Switching Losses: By reducing cell spacing and adjusting the drift region, excellent on-resistance (R_ds,on) is achieved across the entire temperature range. Low on-resistance and low switching losses provide excellent performance for light-load efficiency, helping to increase range and reduce system costs.

2. Smart p² Pack^® Packaging Technology

• Standard Cell (S-Cell) Embedding:Smart p² Pack^® technology embeds 100% electrically tested standard cells (S-Cell) into printed circuit boards, achieving mass production in 48V starter generator applications, with performance improvements of up to 60% compared to traditional solutions.
• High Performance Features: Provides high thermal design flexibility, minimizes parasitic inductance for fast switching, and high system integration, helping to fully leverage CoolSiC technology’s potential.

Schweizer’s Smart p2 Pack® integrates Infineon’s S-Cell 1200 V CoolSiC™ Gen2p chip into the PCB, achieving performance improvements of up to 60% compared to traditional solutions

Image Source: Schweizer

3. Third Generation EiceDRIVER™ Gate Driver

• Automotive Inverter Applications:1EDI3035AS is a compact 20-pin DSO package gate driver designed for automotive inverters, providing high compatibility with silicon carbide technology.
• High Performance Output and Adjustment: The output stage provides up to 20A peak current, supporting the driving of multiple SiC cells in parallel. An ultra-fast SOFTOFF concept is achieved through external SOFTOFF resistors to balance short circuit performance and efficiency.

Smart p2 Pack® demonstration board featuring 1200 V CoolSiC and third generation EiceDRIVER™

Image Source: Infineon

4. Chip Embedded Board Design

• Structure and Design: The chip embedded board includes five connectors connected to the main DC link capacitor, and three 900V CeraLink™ capacitors as local DC link capacitors, minimizing parasitic inductance. Each switch contains an embedded S-Cell with a 20mm² CoolSiC chip.
• Low Inductance Connections: The gate driver is close to the half-bridge, and the single board design achieves low inductance gate connections, fast switching, and low oscillation.

Schematic diagram of the power circuit of the demonstration board

Image Source: Infineon

5. Electrical Performance Testing

• Double Pulse Measurement: Demonstrated the recording of the turn-off waveform, verifying the electrical performance of CoolSiC technology
• Short Circuit Measurement and DESAT Detection: Measured the short circuit behavior using Rogowski coils, demonstrating the third generation EiceDRIVER’s rapid performance in detecting and responding to short circuit events.

In conclusion, this material showcases the potential of the half-bridge board combining 1200V CoolSiC Gen2p technology, Smart p² Pack^® packaging technology, and third generation EiceDRIVER™ gate driver in applications such as electric vehicles.

Figure 4: Example of turn-off waveform recording

Image Source: Infineon

Figure 5: Type 1 short circuit waveform

Image Source: Infineon

Conclusion: This technology combines to achieve voltage transients of up to 100V/ns, low oscillation, low voltage overshoot, and remarkable short circuit times (<550ns), fully demonstrating the synergistic advantages of various technologies, resulting in significant improvements in performance, efficiency, and reliability of power electronic modules, bringing major breakthroughs for applications in electric vehicles and other fields.

References: [1] Innovative chip embedding technology promotes the development of electric vehicles: Infineon SiC chip embedding technology (☆☆☆☆☆)

03

Report 2: Schweizer’s Advanced Embedded PCB Technology Innovations in Various Application Fields

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This report mainly introduces Schweizer Electronic AG’s innovations in printed circuit board (PCB) technology, products, solutions, and their applications in various fields. Here are the key technology summaries from the materials:

PCB Manufacturing Technology

• Production Process: The report introduces the production process of PCBs, helping to understand the foundational content of PCB innovations

• Technical Specifications: Compared and analyzed the basic data of standard version and Schweizer’s advanced PCB, including minimum conductor line width/spacing, minimum micro via diameter, HDI layer counts, etc.

Application Areas and Solutions

• Power Electronics: Focused on Schweizer’s solutions in the field of power electronics

Image Source: Schweizer

• High Current Technology: Includes heavy copper boards, embedded boards, and combination board technology, aimed at handling high currents and efficient heat dissipation

Image Source: Schweizer

• Thermal Management: Introduced IMS boards and Cool boards technology, providing efficient thermal management solutions

Image Source: Schweizer

Chip Embedding Technology

• i² Board®: An integrated plug-in board for logic semiconductors, supporting horizontal current flow, providing cost advantages for high yield and large-scale production.

Image Source: Schweizer

• Cavity Board: Achieves deeper contact surfaces, supporting short bonding loops for high-frequency applications.

Image Source: Schweizer

• p² Pack®: A power embedding solution providing ultra-thin, high-power modules, combining embedding technology and PCB processes, significantly improving switching behavior, reducing power losses, and optimizing heat dissipation.

Image Source: Schweizer

System Cost Reduction

• Cost Optimization Strategies: By participating in early planning and layout processes with clients, optimizing manufacturing panel sizes, investing in modern production facilities, etc., Schweizer helps clients reduce system costs.
• Product Examples: Such as FR4 Flex boards, HF boards, ENEPAG boards, and combination boards, demonstrating how innovative PCB design can reduce costs.

Image Source: Schweizer

In summary, this technical report comprehensively introduces Schweizer Electronic AG’s innovations in PCB technology, products, solutions, and their applications in power electronics, high-frequency applications, thermal management, etc., emphasizing Schweizer’s key role in promoting PCB technology innovation and development, providing us with certain insights.

References: [2] Schweizer’s Advanced Embedded PCB Technology Innovations in Various Application Fields (☆☆☆☆☆, 16 pages)

03

Report 3: Trends in PCB Technology Development and Applications of Embedded Technology in PCBs

The article opens with an overview of the global PCB market, pointing out that the global PCB market size has reached $58.3 billion and predicts the growth trend of the market. Subsequently, the report showcases Schweizer’s achievements in technological innovation, especially in areas such as rapid prototyping, reliable mass production, chip embedding, high-frequency PCBs (HiLo PCBs).

Image Source: Schweizer

In the power PCB trends section, the report delves into the new requirements for PCB design brought about by electric vehicles and autonomous driving technology, such as higher current carrying capacity, better heat dissipation performance, and smaller volume. Schweizer has successfully addressed these challenges through its innovative Inlay Board, IMS Board, and p²Pack® solutions, showcasing multiple application examples such as radar sensors, cameras, LED headlights, and hybrid/electric vehicle drive systems in the report.

Image Source: Schweizer

Moreover, the report particularly emphasizes the importance of embedding technology in high-frequency PCB fields and introduces Schweizer’s latest research and development achievements in this area, such as µ²Pack® and i²Board® embedded solutions. These technologies not only enhance PCB performance and reliability but also provide customers with more flexible design options and lower system costs.

Image Source: Schweizer

Finally, the report further demonstrates Schweizer’s leadership and innovation capabilities in the PCB technology field by showcasing multiple demonstration projects developed in collaboration with partners (such as Infineon). These projects not only demonstrate the practical application effects of Schweizer’s technology but also lay a solid foundation for its future market expansion and business development.

Image Source: Schweizer

References: [3] Trends in PCB Technology Development and Applications of Embedded Technology in PCBs (☆☆☆☆☆, 37 pages)

The above content is an introduction to Infineon’s innovative solution of embedding 1200V CoolSiC™ chips in PCBs and Schweizer’s technical features (excerpt), the complete report has been published in the Knowledge Sphere “SysPro System Engineering Think Tank” and is available for further review and study, hoping to be helpful!

[1] Innovative chip embedding technology promotes the development of electric vehicles: Infineon SiC chip embedding technology (☆☆☆☆☆)

[2] Schweizer’s Advanced Embedded PCB Technology Innovations in Various Application Fields (☆☆☆☆☆, 16 pages)

[3] Trends in PCB Technology Development and Applications of Embedded Technology in PCBs (☆☆☆☆☆, 37 pages)

[4-EE Sphere] Schweizer Electronic AG’s breakthrough progress and roadmap in 48V and future high-voltage chip embedding technology (☆☆☆☆☆, 23 pages)

[5-EE Sphere] FAQs about Schweizer Electronic AG’s embedded PCB technology (☆☆☆☆☆, 40 pages)

[6-EE Sphere] In-depth analysis of power semiconductors embedded technology in PCBs (☆☆☆☆☆)

[7-EE Sphere] Implementation of power chip embedding technology in PCBs (☆☆☆☆☆)

Note: Reports 4/5/6/7 are published in the “SysPro Power Electronics Technology” sphere (advanced growth sphere, introduction at the end of the article)

Additionally, there is an interesting video introduction about Schweizer’s embedded technology which can be searched and viewed in the sphere: PCB Embedded Power Semiconductors | Schweizer Technology Solutions | p2 Pack Packaging | Video

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January 4, 2025

[Disclaimer] The article represents the author’s independent views and does not represent the position of the public account. If there are issues regarding the content, copyright, etc., please contact within 30 days of publication for deletion or copyright negotiation

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