
The T820 (T9100) utilizes advanced 6nm EUV process technology, integrating a high-performance application processor with a built-in financial-grade security solution, delivering a new performance experience in the 5G era.
Additionally, the T820 (T9100) supports 4K ultra-high-definition video recording, 108MP ultra-high pixel photography, and 120Hz high refresh rate display, significantly enhancing multimedia and entertainment experiences on devices.
Overview of the main features of the Unisoc T810/T9100 platform: The Unisoc T820/T9100 features a 1+3+4 tri-cluster octa-core CPU architecture, consisting of 1x 2.7GHz Arm Cortex-A76 big core + 3x 2.3GHz Arm Cortex-A76 big cores + 4x 2.1GHz Arm Cortex-A55, supporting up to 3MB of L3 cache, further enhancing performance. The T820/T9100 is equipped with an Arm Mali-G57 MC4 GPU, with a clock frequency of up to 850MHz.
The T820/T9100 is built using a 6nm EUV advanced process, combined with AI intelligent adjustment technology, resulting in a 40% reduction in power consumption compared to the first-generation Unisoc 5G mobile platform.
Furthermore, the T820/T9100 utilizes LPDDR4X memory and UFS3.1 flash storage, achieving lower power consumption design and smarter real-time temperature control, providing performance support for gaming applications while keeping power consumption at a lower level.
In addition, the T820/T9100 employs AI noise reduction and Smart PA intelligent amplifier technology, offering users a clearer calling experience while providing portable devices such as smartphones and tablets with richer bass and superior sound quality, especially increasing the average volume of the device without exceeding the speaker’s capacity.
Based on Unisoc’s innovative digital audio technology, it can accurately suppress environmental noise, providing users with a professional recording effect that integrates audio and video. Equipped with a low-power voice wake-up system, it will better empower voice assistant applications.
Detailed specifications of the Unisoc T810/T9100 platform:Detailed specifications:
| Product | T820/T9100 |
| Package Type | 360LGA |
| Dimensions (mm) | 45±0.15×48±0.15×2.5±0.15mm |
| Weight (g) | Approximately 17.5 |
| Frequency Bands | NR:N1/N28A/N41/N77/N78/N79 FDD-LTE:B1/B3/B5/B8/B28A TDD-LTE:B34/B38/B39/B40/B41 WCDMA:B1/B5/B8 TD-SCDMA:B34/B39 EVDO/CDMA:BCO GSM/EDGE:850/900/1800MHZ |
| Satellite Positioning(GNSS) | GPS/GLONASS/BEIDOU/QZSS/GALILEO |
| WIFI | 2.4GHZ/5GHz |
| Application Processor | 1xCortex-A76 up to 2.7GHz+3xCortex-A76 up to 2.3GHz+4xCortex-A55 up to 2.1GHz |
| Graphics Processor | Arm MaliTM-G57 cores, up to 850MHz |
| Memory | 4GB+64GB |
| Voltage Characteristics | 3.55~4.4V, typical value 4V |
| Operating Temperature | -20℃~+65℃ |
| Sleep Current | <10mA |
| Operating Current | TBD |
| Data Transmission | |
| NR Features | Supports 5G Sub-6GHz, 3GPP Release 15; 5G NSA and SA modes Supports 5-100MHz bandwidth; supports DL (4×4) MIMO Max rate 2.4Gbps (DL), max 575Mbps (UL) |
| LTE Features | Supports 3GPP R15 CAT15 FDD and TDD Supports 1.4-20 MHz bandwidth Supports downlink (4×4) MIMO max 800Mbps (DL)max 150Mbps (UL) |
| WCDMA Features | Supports 3GPP R9 DC-HSPA+ Supports 16-0AM.64-QAM and QPSK modulation 3GPP R6 HSUPA: Max 11.5Mbps (UL) 3GPP R8 DC-HSPA+: Max 42.2Mbps (DL) |
| TD-SCDMA Features | Supports 3GPP R9 TD-HSDPA: Max 2.8Mbps (DL) TD HSDPA: Max 2.2Mbps (UL) |
| CDMA Features | MAX 3.1MBPS (DL), 1.8 MBPS (UL) |
| WLAN Features | Dual-band 2.4GHz/5GHz, supports 802.11a/b/g/n/ac, supports AP mode |
| Bluetooth Features | BT5.0 |
| Multimedia | |
| Display | QHD+(3360×1440) @60 fps/FHD+(2520×1080)@120 fps HDR+ |
| Video Codec | Encoding: H.265 up to 4K@60 fps, H.264 up to 4K@24 fps Decoding: H.265 up to 4K@60 fps, H.264/VP9 up to 4K@30 fps |
| Interfaces | |
| USIM | Supports USIM/SIM cards; 1.8V and 3V; supports dual SIM dual standby |
| USB | USB3.0 or USB2.0 OTG mode |
| SDIO | Supports SD3.0, 4-bit SDIO, SD/EMMC cards; supports hot swapping |
| LCM | 2 sets of 4-lane MIPI DSI, supports up to QHD+@60 fps/FHD+@120 fps Supports DisplayPort 1.4, up to 4K (3840×2160) @60 fps |
| I2C | 8 sets of I2C, maximum rate up to 400K, maximum speed up to 3.4Mbps |
| ADC | 2 channels, for general-purpose 12BIT ADC. INPUT RANGE=0.01~1.2V |
| PCIe | 1 set, 1-lane PCIe Gen 3, supports NVMe |
| UART | 5 sets, where UART0 is used for debugging, 1 UART is multiplexed with I2C5 |
| I2S | 2 sets, 1 set is default configured for I2S function, 1 set is multiplexed with other functions |
| SPI | 2 sets, 1 set is default configured for I2S function, 1 set is multiplexed with other functions |
| Antenna | 7 RF antennas, WIFI/BT antenna, GNSS antenna, FMRX antenna interfaces |
| Camera | 4x MIPI CSI (4 DATA LANES) 64MP @30FPS |
| Software Features | |
| Operating System | Android 13 |
| Charging Function | 5V2A |
| Software Upgrade | Via USB |
| Certification | |
| RoHS | Complies with RoHS standards |
Recommended Reading
-
MediaTek Dimensity 9000 flagship 5G chip specifications and performance introduction
-
MediaTek Dimensity 8000 5G mobile platform detailed specifications
-
New Move Technology XY6877ZA (MTK6877 platform) – New 6nm popular Wi-Fi 6 5G AI core board
-
New Move Technology MTK6833 (Dimensity 700 platform) 5G all-network communication Android smart core board introduction
-
New Move Technology XY6853ZA (MTK6853 platform) Android core board – 5G all-network communication AI smart module
-
New Move Technology launches AI smart module XY8788 (I500P)
-
New Move Technology XY6765CA (MTK6765 platform) octa-core Android core board – Android development board solution introduction
-
New Move Technology XY6762CA (MTK6762 platform) Android 4G Android core board/development board – 4G smart module applications
-
New Move Technology 4G all-network communication MTK6761 Android motherboard | Android smart module custom development
-
New Move Technology XY6739CW (MTK6739 platform) function introduction – MTK 4G Android core board
-
New Move Technology XY6785CD (MTK6785 platform) function specifications introduction – MTK MediaTek 4G Android core board
-
New Move Technology XY450 (Qualcomm SDM450 platform) Android smart module – 4G all-network communication – supports dual-screen display and dual-touch control
-
XY310/XY610/XY618 (Unisoc T310/T610/T618 platform) Android core board – 4G all-network communication – BOM fully localized
-
Android motherboard smart hardware custom development production
-
Android development board – Android smart module development evaluation kit
-
Android 4G industrial control motherboard – industrial touch all-in-one advertising machine motherboard development board – smart hardware customization
-
Shenzhen New Move Technology Co., Ltd. product manual update (including MTK, Unisoc, Qualcomm mobile SOC platform models)
-
Summary of MediaTek, Qualcomm, Unisoc mobile SOC platform models (including detailed specifications)
New Move TechnologyLeading IoT Solution Provider
About New Move Technology Co., Ltd.
Shenzhen New Move Technology Co., Ltd. is a leading provider of mobile communication technology and IoT solutions, integrating technology research and development, product manufacturing, system integration, and product sales as a national high-tech enterprise and a national specialized and innovative enterprise.
The company established an SMT manufacturing subsidiary in 2018, with professional production equipment and modern production workshops, providing strong support for the production of core modules and customer-customized PCBA projects, offering customers a full range of services from R&D to manufacturing.
The company is headquartered in Bao’an, Shenzhen, with a research and development center in Changsha, focusing on mobile communication technology (2G/3G/4G/5G) and Android smart IoT technology (Android, IoT).
Based on years of technical reserves and resource accumulation in the communication field, the company has established comprehensive strategic partnerships with globally renowned mobile chip manufacturers such as MediaTek (MTK), Unisoc, and Qualcomm, receiving strong technical support from the chip manufacturers. Our company keeps pace with major mobile chip manufacturers, continuously launching powerful Android communication modules, thereby providing customers with stable, reliable, and high-performance smart IoT hardware platforms. We offer comprehensive technical support covering the entire process from R&D, manufacturing, to supply chain, providing strong support for customers to quickly launch products. The successfully developed Android motherboards based on MediaTek, Unisoc, Qualcomm platforms have been widely used in smart handheld terminals, POS machines, advertising machines, robots, smart homes, industrial control, vehicle navigation, security monitoring, mobile medical, education and training, and IoT-related fields.
Contact Us
Company Headquarters: 4th Floor, Block A, Jinyuan Business Building, No. 300 Xixiang Avenue, Bao’an District, Shenzhen
Customer Hotline: Mr. Liu, phone and WeChat same number 18688981861
