Technical Navigation: Construction of Electronic Semiconductor Factories and Cleanroom Renovation Process

The construction of electronic semiconductor factories and cleanroom renovation is a systematic project that integrates multiple disciplines and requires strict process control. Its core revolves around the concept of “planning first, cleanliness first, system integration, and verification-based”. The specific process can be divided into the following stages:

1. Project Planning and Definition

This stage is the foundation of the project, where core elements must be clarified to lay the direction for subsequent work.

• Requirement Analysis: Determine product-related parameters (such as wafer size, process node), capacity targets, cleanliness levels (ISO Class 1-5), and special environmental requirements (temperature and humidity control, anti-vibration, anti-static, electromagnetic shielding, etc.).

• Site Evaluation: Consider geological conditions, transportation convenience, supporting infrastructure (power, ultra-pure water, gas supply, wastewater treatment capacity), environmental risks, expansion space, and policies and regulations.

• Feasibility Study: Analyze technical feasibility, economic factors (investment estimates, return cycles), and risk assessments to determine whether the project has the conditions for implementation.

• Project Team Formation: Assemble owners, project management companies, design institutes (covering architecture, process, electromechanical, cleanliness, etc.), professional consultants (in cleanroom, micro-vibration, EMC fields), and representatives from future operations teams.

• Conceptual Design: Complete preliminary overall layout, architectural form planning, core process flow layout, main electromechanical system framework design, and cleanroom zoning concept planning.

• Develop Project Master Plan: Clarify project goals, key milestones, budget framework, and critical path.

2. Detailed Design

Based on the planning, specific designs for each system and structure are carried out to ensure compliance with production and cleanliness requirements.

• Enclosure Structure and Materials: Design walls (color steel plates/stainless steel plates), ceilings (grids/blind plates + FFU), raised floors (determine material, load-bearing, opening rate), doors and windows (ensure airtightness); material selection must follow principles of non-dust generation, non-dust accumulation, easy cleaning, corrosion resistance, and anti-static (such as flooring, wall surfaces, work clothes).

• Specialized Design: Includes airflow organization design (unidirectional flow, non-unidirectional flow area planning), lighting design (high illuminance, anti-glare, embedded clean lighting fixtures), and anti-static design (ground and wall static control measures and equipotential bonding).

• Electromechanical System Design: Covers HVAC, ultra-pure water systems (multi-stage pretreatment, reverse osmosis processes, and circulation pipeline systems), process cooling water systems, bulk gas and specialty gas systems, vacuum systems, chemical supply and distribution systems, exhaust and tail gas treatment systems, power systems (including emergency power), building automation systems, fire protection systems, and water supply and drainage systems.

• Core Systems and Key Parameters: The mainstream approach uses large-scale FFU + raised floor/blind plates + MAU fresh air units + dry coils, requiring precise control of temperature (±0.1°C), humidity (±1-2% RH), pressure gradient, air exchange rates, and other parameters; the filtration system employs multi-stage filtration, with the final filter located at the FFU or high-efficiency air supply outlet.

• Architectural and Structural Design: Meet large span and heavy load requirements, reserve equipment access paths, and consider special structures (anti-vibration platforms, raised floors, technical interlayers).

• Process Design: Determine equipment layout, material flow, personnel flow, and waste flow, optimizing cleanroom space utilization and efficiency.

• Review and Approval: All professional design drawings and specifications must undergo strict review and approval by the owner, consultants, and relevant government departments.

3. Procurement and Construction Preparation

Prepare materials and plans for the construction phase to ensure smooth execution.

• Long-cycle Equipment Procurement: Order key equipment in advance, such as chillers, transformers, air compressors, and bulk gas storage tanks.

• Bidding and Design Deepening: Conduct bidding for general contracting/subcontracting, selecting contractors with experience in semiconductor factory construction; use BIM for collision checks and pipeline optimization across disciplines.

• Construction Organization Design: Develop detailed construction plans, logistics plans (especially for large equipment access), safety plans, quality plans, and cleanliness control plans; also complete site leveling and temporary facility construction.

4. Civil Construction

Build the main structure of the factory to provide a foundation for subsequent electromechanical installation and cleanroom renovation.

• Carry out foundation works (focus on anti-vibration foundations), main structure construction (steel structure/reinforced concrete), roofing works, and exterior protective structure construction (curtain walls/masonry).

• During construction, pay attention to structural load reservations, equipment foundation embedding, and large equipment access path reservations.

5. Electromechanical Installation and Cleanroom Renovation

This is the core implementation phase of the project, directly affecting cleanroom performance.

• Cleanroom Renovation: Build enclosure structures (color steel plate walls, ceiling tiles), install raised floors, FFU units, lighting and emergency equipment, lay anti-static flooring/coating, and install airtight doors and pass-through windows.

• Electromechanical Equipment Installation: First install the main pipeline networks (air ducts, water pipes, process pipelines), then install HVAC main units, pumps, air compressors, etc.; install pipelines and cable trays in interlayers/technical corridors, reserving terminal interfaces to the cleanroom, and install related terminal equipment within the cleanroom.

• Cleanliness Control: Strict cleanliness control measures begin at this stage, such as personnel training, material cleaning, zoned management, and negative pressure buffering, to prevent contamination of completed areas.

6. System Testing, Commissioning, and Balancing

Ensure all systems operate stably according to design parameters.

• Test and commission HVAC systems (air volume balancing, temperature and humidity adjustments), water systems (flow, pressure adjustments), gas systems (purity, pressure tests), ultra-pure water systems (water quality compliance tests), and control systems (logic tests, interlock tests); also conduct pipeline pressure tests, air duct leakage tests, and circuit tests.

• Conduct individual equipment tests (to ensure equipment operates normally alone) and system commissioning (to ensure overall system stability).

7. Cleanroom Performance Testing and Certification

Verify whether the cleanroom meets design standards and usage requirements.

• Testing items include suspended particle counts (core indicators), air speed and uniformity, air volume and exchange rates, pressure differentials, temperature and humidity uniformity and stability, illuminance, noise, self-cleaning time, airflow pattern visualization, anti-static performance, and filter leakage.

• Tests are conducted under both static (no equipment and personnel) and dynamic (with equipment and simulated operations) conditions, with final certification reports issued by independent third-party organizations based on standards such as ISO 14644.

8. Process Equipment Move-in and Installation

Introduce process equipment into the cleanroom and complete installation connections.

• Develop a detailed equipment move-in plan (route, timing, clean packaging unboxing procedures), conduct equipment unboxing, inspection, and cleaning in designated buffer zones, then complete equipment positioning, leveling, and Hook-Up connections with facility systems (electricity, water, gas, etc.), and perform equipment function tests.

9. Comprehensive Verification and Trial Production

Inspect the collaborative operational capability of the entire factory system.

• Conduct system interconnection tests to verify the compatibility of process equipment with facility support systems; validate equipment performance and the stability, purity, and reliability of facility system supplies through actual or test wafer operations; gradually increase production batches to verify capacity targets; while also validating the effectiveness of operating procedures.

10. Final Acceptance and Handover

The project is completed and officially delivered for use.

• Review all testing, commissioning, and verification reports, hand over completion drawings and operation maintenance manuals, ensure training for operation and maintenance personnel is completed, and confirm that the factory meets the performance indicators and capacity targets specified in the contract before formal acceptance by the owner.

Throughout the entire process, it is essential to focus on quality management, safety management, cleanliness control, change management, communication coordination, and document management to ensure the professionalism and rigor of the project, ensuring that the electronic semiconductor factory and cleanroom meet production needs.

Technical Navigation: Construction of Electronic Semiconductor Factories and Cleanroom Renovation ProcessTechnical Navigation: Construction of Electronic Semiconductor Factories and Cleanroom Renovation Process

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