On September 24, the 2025 Beijing International Microelectronics Symposium and IC WORLD Conference (hereinafter referred to as the “IC WORLD Conference”) opened in Beijing. The forum on the “Wide Bandgap Semiconductor Materials and Device Innovation Cluster Ecosystem” was successfully held, co-hosted by the Economic and Information Technology Bureau of Shunyi District, Beijing Integrated Circuit Society, and Beijing Chuangzhi Yilian Technology Co., Ltd., attracting over a hundred representatives from leading companies in the third-generation semiconductor industry chain, including Northern Huachuang and Suzhou Ruifei Optoelectronics, as well as industry experts and scholars.
During the opening speech, Chen Xiaonan, Secretary-General of the Beijing Integrated Circuit Society, pointed out that as one of the organizers of this IC WORLD Conference, the society has always aimed to serve the high-quality development of the semiconductor industry in the country and Beijing. By leveraging its resource integration advantages, it aims to build a high-level communication platform to empower the innovation of wide bandgap semiconductor technology and industrial upgrading. Deputy District Mayor Hou Ying of Shunyi District noted that wide bandgap semiconductor technology is leading revolutionary changes in fields such as energy, communications, and smart vehicles. Since 2015, when the national government included the third-generation semiconductor industry in the key development areas of “Made in China 2025”, Beijing has clearly positioned Shunyi as the core area for the development of the third-generation semiconductor industry. As a major area for high-end manufacturing in the capital, Shunyi District is an important carrier of the innovation industry cluster demonstration area in the “Three Cities and One District” of Beijing’s international science and technology innovation center.
In October 2023, Shunyi District’s third-generation semiconductor industry was successfully selected as a “2023 Annual Characteristic Industry Cluster of Small and Medium-sized Enterprises” by the Ministry of Industry and Information Technology. It has formed an industrial chain layout from equipment to materials, chips, modules, packaging testing, and downstream applications, with initial scale effects evident. By 2024, there will be 30 third-generation semiconductor entities in the district, including 13 above-scale enterprises, covering fields such as microwave RF and power electronics.
During the 14th Five-Year Plan period, Shunyi District will focus on the application end, concentrating on chip devices, actively developing modules, promoting the large-scale application of chips, and simultaneously advancing the development of fourth-generation semiconductors such as gallium oxide, striving to seize the high ground of future industries. At the same time, relying on the three core areas of the Beijing-Tianjin-Hebei intelligent connected new energy vehicle technology ecological port in Shunyi, it will focus on the localization of automotive-grade chips and the upgrading of the third-generation semiconductor industry, constructing a full-chain innovation ecosystem of “materials-chips-modules-vehicles-scenes”, becoming a core area for automotive-grade chip industry and a demonstration area for third-generation semiconductor applications in China.
During the keynote speech session, seven key enterprises including Guolian Wanzhong, Tesdi, Yaze Zhongbao, and Mingjia Semiconductor discussed various topics such as cutting-edge technologies in wide bandgap semiconductors, equipment localization, key materials, and yield management, presenting the latest technological advancements and industrialization achievements.
Participants expressed that this forum provided a high-end dialogue platform for wide bandgap semiconductor enterprises, promoting the joint construction of a third-generation semiconductor industry hub by related enterprises in Beijing, Tianjin, and Hebei, as well as nationwide.