1.1 Scope of Application
RK3399 is the highest performance chip in the Rockchip product line, offering high performance and scalability in applications. The hardware specifications of the chip are industry-leading, utilizing mature solutions, high-quality materials, and stable software and hardware, making it widely applicable for: advertising machines, digital signage, smart self-service terminals, smart retail terminals, O2O smart devices, etc.
1.2 Product Overview
The CPU of RK3399 adopts the big.LITTLE core architecture, featuring a dual-core Cortex-A72 big core + four-core Cortex-A53 small core structure. Significant improvements have been made in integer, floating-point, memory, overall performance, power consumption, and core area. The GPU of RK3399 uses a new generation of high-end image processor Mali-T860 with four cores, integrating more bandwidth compression technologies (such as smart overlay, ASTC, and local pixel storage), and supports more graphics and computing interfaces. Overall performance has improved by 45% compared to the previous generation.
1.3 Product Features
Integrated USB3.0 Type-C dual ports, supporting audio and video output via Type-C display port.
Dual ISP with 800 MPix/s pixel processing capability, supporting simultaneous data input and advanced processing (such as 3D and depth information extraction) from dual cameras.
MIPI/eDP interface supports 2560×1600 screens and dual display.
HDMI2.0 interface and H.265/H.264/VP9 4K @ 60fps support for decoding and displaying high-definition video.
Built-in PCI-e interface supports PCI-e based high-speed Wi-Fi and storage expansion.
Supports input from an 8-channel digital microphone array.
Provides comprehensive support for systems compatible with Android, Linux, and other operating systems.
It has strong compatibility and scalability, applicable for VR, game consoles, tablets, and other multifunctional terminals.
1.4 Appearance and Interface Diagram
Front View:

Side View:

Chapter 2 Basic Function List

Chapter 3PCB Size and Interface Layout
3.1 PCB Size Diagram

PCB: 8-layer board
Size: 73.6*116.8mm, PCB thickness 1.6mm
Screw hole specifications: ∮3.2mm x 4
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