1. Xinyuan Micro: Coating, Development, and Cleaning Equipment · Company Overview Founded in 2002 by the Shenyang Institute of Automation, Chinese Academy of Sciences, a joint venture between Advanced Manufacturing (Shenyang Institute + Nanhua Group) and South Korea’s STL; STL withdrew in 2007, and in 2013, the actual controller changed from the Shenyang Institute to Zheng Guangwen. In June 2025, Northern Huachuang acquired Xinyuan Micro for 3.135 billion yuan in cash, becoming the major shareholder. · Company Products Xinyuan Micro has achieved full coverage of 28nm and above nodes and continues to promote customer validation of ArF immersion lithography machines and the new generation of ultra-high-capacity architecture FTEX. · International Market Competition The global coating and development equipment industry is highly concentrated, with Tokyo Electron (TEL) holding an absolute dominance, capturing over 90% of the global market share and monopolizing the coating and development equipment market for EUV lithography machines, with technology covering from mature processes to 3nm advanced processes.
2. Tuojing Technology: PECVD, SACVD, HDPCVD, ALD, Bonding · Company Overview Established in 2010. · Products PECVD: In 2011, the first 12-inch PECVD was delivered to SMIC for validation. In 2013, it passed product line testing, and in 2014, it received the first mass production order for PECVD machine PF-300T from SMIC. In 2016, the first 12-inch ALD equipment was delivered to ICRD, and in 2019, it successfully passed the 14nm industrialization validation. In 2017, the first mass production 3D NAND PECVD equipment was delivered to clients, filling the gap for domestic equipment in the advanced storage chip field.
SACVD: In 2019, SACVD equipment was delivered to clients, suitable for gap filling in 14nm processes. ALD: In 2019, 12-inch ALD equipment passed process industrialization validation on the 14nm production line.
PF-300T pX series will mainly be used in the manufacturing of logic chips below 10nm. In 2023, the wafer-to-wafer bonding product Dione 300 successfully achieved industrial application.
3. Fuchuang Precision: Precision Components for Semiconductor Equipment (Mass Supply of 7nm Process Components) The company’s precision components business: The gas distribution plate with threaded inclined holes has achieved large-scale production and is successfully applied to PEALD machines; the heated gas distribution plate has completed R&D and accelerated customer validation processes, suitable for core machines such as CVD and ETCH; the cross-hole welded gas distribution plate has achieved production breakthroughs, mainly supporting ALD and PVD equipment. In 2025, the company, along with strategic investors, will acquire the international brand Compart to strengthen core links in the gas transmission field.
4. ZK Instrument: Dry Vacuum Pumps and Vacuum Scientific Instruments The dry vacuum pumps: The company’s products meet the production needs of 14nm advanced logic chips and 128-layer and above 3D NAND storage processes, and have been applied in large quantities in leading wafer manufacturing companies in China.
Currently, the IPO has been accepted.
5. Xinsong Semiconductor: Vacuum Manipulators Xinsong Semiconductor is a subsidiary of Xinsong Robotics, established in February 2023.
Japan is the largest production area for semiconductor manipulators globally, accounting for about 60% of the market share, while the United States accounts for about 20%, and South Korea is also an important production area, accounting for about 6% of the market share.
6. Heyan Technology: Precision Cutting Equipment for Semiconductors Established in 2011, the core members come from the Shenyang Institute of Instrumentation, with main products including fully automatic precision dicing machines for 6-inch, 8-inch, and 12-inch wafers, and JIGSAW fully automatic cutting and sorting integrated machines, widely used in integrated circuits, discrete devices, optoelectronic devices, sensors, and optical communications. In 2022, it received investment from the National Integrated Circuit Industry Fund.
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