Key developments in the domestic chip industry and representative companies in major fields:
|
Field |
Key Developments |
Representative Companies/Technologies |
Level/Status |
|
Advanced Manufacturing Processes |
14nmmass production,7nmbreakthrough |
SMIC |
Leading in mainland China |
|
e-Flash technology mass production below28nm |
Lingkai Semiconductor |
Internationally competitive, filling domestic gaps |
|
|
AIChips |
FP8precision solutions, computing power optimization, ecosystem building |
Huawei Ascend910B, Moore ThreadsMUSA, Cambricon |
Ascend910B FP16computing power surpasses NVIDIAH100 |
|
Large Model Training and Inference |
DeepSeek-V3.1adapting to domestic chips |
Promoting domesticAIecosystem closure |
|
|
Storage Chips |
232layers3D NANDflash memory |
Yangtze Memory Technologies |
International level (yield continuously improving) |
|
LPDDR5X DRAM |
Changxin Memory |
Self-developed“Rock Solid”architecture, power consumption reduced by40% |
|
|
Chip Design |
3nmflagshipSoCdesign |
Xiaomi’s玄戒O1 |
One of only4globally, the only one in mainland China |
|
Equipment and Materials |
5nmetching machine |
SMEE |
Internationally leading |
|
90nmlithography machine |
Shanghai Microelectronics |
Commercialized (compared to international advanced, there is a gap) |
|
|
EDAtools above28nm |
Huada Jiutian |
Breakthrough in domestic design software |
Progress in AISmart Chips
AIchips are a highlight in the breakthrough of domestic chips.
- Performance Improvement: Huawei Ascend910Bchip has surpassed NVIDIAH100by67 TFLOPSinFP16computing power (256 TFLOPS).
- Ecosystem Building: The success of domesticAIchips lies not only in hardware but also in software and ecosystem.Moore Threads’sMUSAarchitecture,Chipone’sNPUaccelerators are supporting the domesticAIecosystem.DeepSeek-V3.1 large model adoptsFP8precision solutions, effectively optimizing the computing power resource allocation of domestic chips.
- Market Replacement: After the US banned the sale ofH20chips, Huawei Ascend910Bhas achieved a replacement rate of over60%in the domestic market.
Breakthroughs in Storage Chips
Storage chips are the cornerstone of the information industry.
- Flash Memory (NAND): Yangtze Memory Technologies has achieved the world’s first mass production of232layers3D NANDflash memorytechnology, breaking the foreign monopoly.
- Memory (DRAM): Changxin Memory has made progress inLPDDR5Xmemory chips, with its self-developed“Rock Solid”architecture reducing power consumption by40%, and has adapted to HarmonyOSPC.
- Key Technology Breakthrough: Lingkai Semiconductor announced the breakthrough and mass production ofembedded flash memory (e-Flash) below28nmin August 2025. This technology is widely used in IoT terminals, automotive electronics,AIedge computing, etc. Its read and write speed is improved by40% compared to40nm, and power consumption is reduced by25%, and it has passedAEC-Q100 automotive certification, which is significant for domesticMCUs, automotive electronics, and other fields.
The “Battle for Semiconductor Equipment and Materials”
Semiconductor equipment and materials are the cornerstone of chip manufacturing and the focus of domestic industry efforts.
- Etching Equipment: SMEE’s5nmetching machine has reachedinternational leading level and is used in international advanced production lines.
- Lithography Equipment: Shanghai Microelectronics’s90nmlithography machine has been commercialized, but there is still a significant gap compared to the most advanced internationalEUVlithography machines.
- EDATools: Domestic companies such as Huada Jiutian have supportedEDAtools (chip design software) for processes above28nm, but more advanced EDA tools are still mainly dominated by American companies.
- Materials: The localization rate of materials such as high-purity silicon wafers and photoresists is still less than30%.
Representative companies and their core highlights in each segment:
|
Industry Segment |
Representative Companies |
Core Highlights |
Recent Developments/Market Performance |
|
Chip Design |
Cambricon (688256) |
Focusing onAI chips, covering cloud, edge, and terminal.Integrated computing architecture significantly improves energy efficiency. |
Q1 2025revenue increased by4230.22%year-on-year. Strong stock performance. |
|
Unisoc (002049) |
FPGAchips are an important force in domestic substitution, with products passing automotive certification and applied in5Gbase stations. |
Net profit in the first half of 2025 increased by55%year-on-year. |
|
|
Sanan Optoelectronics (300661) |
Analog chip design company, products include power management chips, entering BYD’s supply chain. |
Net profit in the first half of 2025 increased by60%. |
|
|
Chip Manufacturing |
SMIC (688981) |
Domesticleading wafer foundry,14nmprocessyield has reached international leading level, meeting the demand for domesticAIchip manufacturing. |
Revenue in the first half of 2025 increased by35%, capacity utilization remains high. |
|
Packaging and Testing |
Changdian Technology (600584) |
The world’s third-largest packaging and testing company, mastering3Dpackaging andChiplettechnology, providing packaging solutions for high-endAIchips. |
AIrelated packaging revenue has significantly increased, with order growth exceeding50%. |
|
Equipment and Materials |
North Huachuang (002371) |
Semiconductor equipment platform enterprise,5nmetching machinehas entered TSMC’s supply chain,PVDequipmentlocalization rate exceeds30%. |
Revenue in 2025 is expected to exceed30 billion yuan. |
|
Shanghai Silicon Industry (688126) |
Large-size silicon wafer supplier,12inch silicon wafers certified by SMIC, defect density reaches international advanced level. |
Market share in 2025 is25%. |
|
|
Ecological Related |
Suizhuan Technology |
Releasednative supportFP8parameter precisionAIchip SuizhuanL600. |
Deep cooperation with Hongxin Electronics (300657), jointly established a joint venture. |
|
Muxi Integrated Circuit |
XiyunC600 GPU based onHBM3ememory,native supportFP8 Tensorinstructions, planning small batch production in the fourth quarter of 2025. |
Supercom Communication (603322) is its specific industry agent. |
|
|
Moore Threads |
Next-generation fully functionalGPUbased onMUSAcomputing architecture,with nativeFP8computing capability, supportingDeepGEMMlibrary. |
Heer Technology (002402) is the only direct shareholder in A-shares, holding1.244%of the shares. |