Ceramic materials play an irreplaceable role in the field of printed circuit boards (PCBs), becoming the ideal substrate for high-frequency and high-power electronic applications due to their excellent thermal conductivity, electrical insulation, and mechanical stability. With the continuous improvement of performance requirements for electronic devices in high-end industries such as 5G communication, new energy vehicles, and aerospace, the ceramic substrate market is ushering in a new round of growth opportunities. As an important force in the global PCB industry, China has seen the rise of several ceramic manufacturing enterprises that possess international competitiveness in terms of technological strength and production capacity.
This article will systematically review ten representative companies in the field of PCB ceramic manufacturing in China from the dimensions of technical capabilities, product layout, and market influence, aiming to provide references for industry decision-making and technology selection.
01
Shandong Sinocera Functional Materials Co., Ltd.
– Headquarters: Shandong
– Established: 2005
– Core Advantage: Diverse material platform, leading scale
Sinocera is a leading enterprise in the domestic electronic ceramic materials field, with business covering multiple sectors including electronic materials, catalytic materials, and biomedical applications. Its electronic ceramic products are widely used in communication, automotive electronics, and semiconductor packaging, with a strong technical foundation in high-purity alumina and aluminum nitride substrates, serving mainstream electronic companies both domestically and internationally.
02Chaozhou Three-Circle (Group) Co., Ltd. (CCTC)
– Headquarters: Chaozhou, Guangdong
– Established: 1970
– Core Advantage: Full industry chain integration, global market layout
CCTC is one of the earliest companies in China engaged in the production of electronic ceramic components, with a product line that includes optical communication ceramic inserts, resistor substrates, and semiconductor packaging bases, ranking among the top globally in terms of production and sales scale. It has a prominent market share in the alumina ceramic substrate field and continues to invest in the research and industrialization of high-end materials such as aluminum nitride.
03Bomin Electronics
– Headquarters: Shenzhen, Guangdong
– Established: 1994
– Core Advantage: Collaborative innovation between PCBs and ceramic substrates
Bomin Electronics is based on high-end PCB manufacturing and actively expands into the ceramic substrate and core component fields, possessing integrated service capabilities of “PCB + ceramic substrate + system solutions.” Its ceramic products are mainly used in high-power LED lighting, microwave communication, and other scenarios, with outstanding customization development capabilities.
04Jiangsu Yixing Electronic Components General Factory Co., Ltd.
– Headquarters: Yixing, Jiangsu
– Established: 1969 (restructured in 2017)
– Core Advantage: Deep expertise in ceramic packaging
This company was formerly a state-owned backbone enterprise, focusing on alumina multilayer ceramic packaging technology for a long time, and is one of the earliest companies in China to achieve large-scale production of ceramic packaging. Its products cover various packaging types such as DIP, QFP, and PGA, occupying an important position in the integrated circuit, optocoupler, and microwave device packaging markets.
05Fujian Minhang Electronics Co., Ltd.
– Headquarters: Fujian
– Established: 2002
– Core Advantage: Expert in military and high-reliability ceramic shells
Minhang Electronics focuses on the research and manufacturing of ceramic packaging shells, with products covering various structural forms such as CLCC, CQFP, and CPGA, primarily serving the military, aerospace, and high-end industrial control fields, renowned for high reliability packaging in harsh environments.
06MicroSimple Technology
– Headquarters: Dongguan, Guangdong
– Established: 2010
– Core Advantage: Integration of thick film technology and ceramic substrates
MicroSimple Technology started from traditional PCB manufacturing and gradually expanded into the ceramic substrate and passive component fields. Its ceramic product line includes alumina/aluminum nitride COB substrates and high-frequency microwave resistors, mainly targeting the LED lighting and automotive electronics markets, aligning with mid-to-high-end consumer and industrial application needs.
07Zhejiang Dehui Ceramic Electronics (TC Ceratronix)
– Headquarters: Jiaxing, Zhejiang
– Established: 2013
– Core Advantage: Advanced ceramic connection technology (AMB/DBC)
Dehui Electronics focuses on high-performance electronic ceramic components, introducing advanced production and testing equipment from Japan and Germany, possessing core competitiveness in active metal brazing (AMB) and direct bonded copper (DBC) processes. Its aluminum nitride and silicon nitride substrates are widely used in the fields of new energy vehicles and power electronics modules.
08Chengdu Wanshida Ceramics Co., Ltd.
– Headquarters: Chengdu, Sichuan
– Established: 2005
– Core Advantage: Leading high thermal conductivity ceramics and DBC technology
Wanshida Ceramics specializes in high-precision alumina substrates and DBC ceramic copper-clad laminates, with products widely used in power modules, semiconductor thermoelectric, and LED packaging fields, performing excellently in applications with extremely high thermal performance requirements, with clients primarily from industrial control and automotive electronics sectors.
09Nanjing Zhongjiang New Materials Technology Co., Ltd. (CHC)
– Headquarters: Nanjing, Jiangsu
– Established: 2012
– Core Advantage: Comprehensive technology layout of DBC/DPC/AMB
Zhongjiang New Materials independently develops alumina and aluminum nitride DBC substrates, while mastering direct copper plating (DPC) and active metal brazing (AMB) processes, with a complete product line covering multiple high-end fields such as photovoltaic inverters, IGBT modules, and RF devices.
010Su Zhou Gaoyu Zhe Electronics Technology (Guoyi Electronics, GYZ)
– Headquarters: Kunshan, Jiangsu
– Established: 2013
– Core Advantage: Integrated capabilities in electronic ceramics and precision structural components
Gaoyu Zhe focuses on consumer electronics and automotive electronics as core markets, integrating precision component design and ceramic material processes, with main products including LDS ceramic antennas and sensor bases. After being listed on the Science and Technology Innovation Board in 2021, the company further strengthened its R&D investment and production capacity expansion.
Industry Trend Insights
Currently, the PCB ceramic manufacturing industry in China exhibits the following development characteristics:
– Technological breakthroughs: Leading enterprises such as Sinocera and CCTC have entered the high-end substrate fields of aluminum nitride and silicon nitride, continuously narrowing the technological gap with internationally leading companies;
– Market differentiation: The main growth drivers for high thermal conductivity ceramic substrates come from 5G communication base stations and electronic control systems of new energy vehicles, while ceramic packaging products benefit from the accelerated localization of semiconductors;
– Strengthened industry chain collaboration: Ceramic manufacturers are increasingly collaborating closely with PCB companies and module manufacturers to jointly promote the development of customized, system-level solutions.
Looking ahead, as China continues to invest in strategic emerging industries such as 5G, new energy, and artificial intelligence, the PCB ceramic materials industry is expected to maintain a high growth trend. Enterprises that master core technologies, possess large-scale production capabilities, and have quality customer resources will occupy a more advantageous position in the new wave of industrial competition.
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