Market Application Background
The localization of core semiconductor equipment is key to solving“bottleneck” technologies and ensuring national strategic security. Driven by policies and downstream demand, the demand for domestic equipment has surged. The semiconductor die bonding machine is a core packaging device, and its motion control equipment determines the performance of high-speed, high-precision placement of wafer chips, which is crucial for achieving key steps such as positioning, alignment, and bonding.
This article mainly introduces the application of the ultra-high-speed real-time motion control card XPCIE1032H in high-speed semiconductor die bonding machines, providing a quick understanding of the use of the XPCIE1032H ultra-high-speed real-time motion control card from Zhengyundong Technology.
Traditional Control System Solutions
Traditional Solution One(Based on PLC):
Utilizes PLC + touch screen + industrial computer + machine vision. Its drawbacks include the need to switch between the PLC screen and the PC screen for motion control and machine vision debugging, making operations cumbersome. Additionally, PLCs are limited by scanning cycles, resulting in slow responses and low data interaction rates with PCs, leading to lower overall equipment productivity.
Traditional Solution Two(Based on Motion Control Card):
Utilizes PCI motion control card + industrial computer + machine vision. The motion control card is integrated within the industrial computer, communicating with vision through a high-speed PCI interface, allowing for fast data exchange and simplified single-screen debugging, significantly improving the speed and precision of wafer chip handling, ultimately achieving higher UPH productivity.
Zhengyundong Technology Solution
The Zhengyundong Technology solution is centered around an industrial computer + XPCIE1032 ultra-high-speed motion control card + machine vision, enhancing productivity and stability.
Utilizes Windows real-time kernel technology, executing motion control, IO, and other processes within the CPU core, with command issuance and reading from PC machine vision interacting through CPU memory,interaction speeds are dozens of times faster than traditionalPCI/PCIe motion control cards, and 50-100 times faster than PLC network data interaction, resulting in an overall efficiency improvement of 6%-20%+.
01
Application of Ultra-High-Speed Real-Time Motion Control Card XPCIE1032H in High-Speed Semiconductor Die Bonding Machines
Zhengyundong High-Speed Semiconductor Die Bonding Machine Solution Architecture
1
16DI: Connects origin and limit photoelectric sensors, switch inputs, etc.;
2
16DO: Connects signals for electromagnetic valve suction, vacuum breaking, and visual flying capture; connects two cameras;
3
EtherCAT Interface: 125us EtherCAT synchronization cycle, connecting die bonding arm axes, die loading and unloading, blue film needle axes, silver glue dispensing axes, carrier substrate feeding axes, and a total of 12 servo and stepper axes; also expands EtherCAT IO modules.
Operating Principle of Die Bonding Machine
The die bonding machine consists of material picking, pushing, dispensing, arm movement, die bonding platform, blue film needle platform, fixtures, and discharge mechanisms, integrating high-speed precision positioning, visual positioning, and pneumatic suction technologies.Core Control Steps are as follows:
01
Visual Positioning:
Identifying the positions of wafer chips and carrier substrates
02
Dispensing:
Precisely dispensing silver glue at specified positions on the carrier substrate
03
Placement:
The arm picks up the wafer chip and accurately places it at the dispensing position
MotionRT750 Real-Time Motion Control Kernel, Exclusively Using x86 CPU Core
XPCIE1032 ultra-high-speed motion control card is equipped with the Windows real-time kernel MotionRT750, utilizing a dual-system architecture of Windows non-real-time layer + MotionRT750 real-time layer. The real-time layer ensures that motion control is unaffected by Windows fluctuations/jitters, guaranteeing high precision and stability; the non-real-time layer seamlessly interfaces with rich Windows applications such as VS/CAD/CAM, greatly enhancing development and debugging efficiency.
Command interaction cycles as fast as microseconds
XPCIE1032 ultra-high-speed motion control card is equipped with the Windows motion control real-time kernel MotionRT750, directly utilizing CPU/memory calculations in the PC, significantly improving function execution efficiency and response speed, thereby greatly enhancing the UPH productivity of die bonding machines.
Through development tests using languages such as C# and C++, results show its communication speed far exceeds traditional PCI/PCIE card solutions and PLC network interaction solutions, with a significant overall productivity improvement.
In the same testing environment, after 50 linear motor reciprocating movements and 1000 IO flip tests, the MotionRT750 solution’s control cycle was shortened by approximately 2500ms compared to traditional PCI communication, with an efficiency improvement of over 17.1%.
Motion control cycles as fast as 50us
XPCIE1032 ultra-high-speed real-time motion control card equipped with Windows real-time kernel MotionRT75050 can control 16 axes or 32 axes via EtherCAT bus, and its EtherCAT communication synchronization cycle can be shortened to 125μs, with motion control cycles reaching as fast as 50μs, significantly enhancing EtherCAT communication efficiency.
In precision motion control applications such as die bonding, it can achieve faster and smoother motion trajectory planning. Compared to traditional pulse control cards, its wiring is simpler and maintenance is more convenient.
More stable, safer, and more reliable
Industrial automation equipment must meet the requirement of continuous operation 24/7, as any abnormal downtime can cause significant losses. The XPCIE1032 ultra-high-speed motion control card, equipped with the Windows motion control real-time kernel MotionRT750, utilizes EtherCAT bus redundancy and PC fault isolation technology to build a highly reliable control system, unaffected by Windows blue screen issues, providing stable and safe guarantees for industrial production.
EtherCAT Bus Redundancy Technology:
Automatic switching of communication link faults significantly reduces the risk of downtime caused by disconnections, with 32 axes capable of stable operation as fast as 125us.
PC-Level Fault Hard Isolation:
Unaffected by Windows blue screen issues, when the Windows system experiences a blue screen or crash, the MotionRT750 real-time kernel can continue to operate independently, and the emergency stop button can still function normally, ensuring the safety of the production process.
Zhengyundong High-Speed Semiconductor Die Bonding Process Flowchart
Summary of Application Advantages
1
Unified API, Flexible Development: Supports development in various upper computer languages, all series products can call the same set of API functions, allowing for more flexible user development.
2
Breaking Real-Time Bottlenecks, Stable and Efficient Operation: Completely solves the non-real-time issues of traditional PCI/PCIE cards in Windows environments, ensuring efficient and stable operation of the equipment.
3
Rapid Response, Significantly Increased Productivity: Based on core interaction technology, command response reaches the microsecond level, dozens of times faster than traditional PCI/PCIE solutions. Actual tests show UPH increased to 22K for single-head, 43K for dual-head, with overall production efficiency improving by over 10%.
4
Multi-Channel Flying Capture, Shortened Cycles: Equipped with 16 independent hardware position comparison outputs, supporting multi-station visual flying capture for synchronized execution, effectively shortening machine CT.
5
Intelligent Motion Control, Smooth and Precise Actions: Integrates SS curve acceleration and deceleration, arc motion, and online speed variation functions to achieve “soft landing,” ensuring smoother, gentler, and more precise actions for wafer handling and die bonding.
Hardware Selection Configuration
|
Product Type |
Product Model |
Manufacturer |
Quantity |
|
Motion Control Card |
XPCIE1032H |
Zhengyundong |
1 |
|
IO Module Coupler |
ZMIO310-ECAT |
Zhengyundong |
1 |
|
IO Module |
ZMIO310-16DI/16DO |
Zhengyundong |
6/4 |
|
Servo/Linear Drivers |
EtherCAT Bus |
– |
8 |
|
Stepper Motors |
Pulsed |
– |
4 |
|
Industrial Computer |
– |
– |
1 |
|
Visual Equipment |
– |
– |
1 |
|
Other Accessories |
– |
– |
– |
02
Introduction to XPCIE1032H Motion Control Card
1
6-64 axes EtherCAT bus + pulse optional, with 4 channels of single-ended 500KHz pulse output, convenient for connecting pulse drives;
2
32 axes EtherCAT synchronization cycle 125us, supports multi-card linkage;
3
Onboard 16 general-purpose inputs, 16 general-purpose outputs, including 8 high-speed inputs and 16 high-speed outputs;
4
Supports PWM output, precise output, PSO hardware position comparison output, visual flying capture, etc.;
5
Supports linear interpolation, arc interpolation, continuous trajectory processing (speed prediction), high-order SS curve acceleration and deceleration;
6
Supports electronic cam, electronic gear, position latch, synchronous following, virtual axis, pitch compensation, and other functions;
7
Supports 30+ robotic arm models for forward and inverse kinematics algorithms, such as SCARA, Delta, UVW, 4-axis/5-axis RTCP…
To help you better and more quickly develop and apply the high-speed semiconductor die bonding machine solution based on the ultra-high-speed real-time motion control card XPCIE1032H, we have prepared detailed documentation. For further understanding of its usage, parameter configuration, and practical application cases, please contact 400-089-8936.
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About Zhengyundong Technology
Zhengyundong Technology Co., Ltd. was established in 2013, focusing on the research of purely domestic motion control technology and the development of general motion control software and hardware platforms and products. It is a national high-tech enterprise and a specialized and innovative “little giant” enterprise.
Zhengyundong Technology gathers outstanding talents from companies such as Huawei and ZTE. Striving for innovation, the company currently holds more than fifty intellectual property rights, including patents and copyrights. While adhering to independent innovation, it actively collaborates with major universities and research institutes to jointly research the foundational technologies of motion control, making it one of the fastest-growing companies in the domestic industrial control field and one of the few companies that fully master core motion control technologies and real-time industrial control software platform technologies.
In addition to its main R&D center, Zhengyundong Technology has three R&D branches in Zhongshan, Wuhan, and Shanghai. To better serve customers, it has two regional service centers in Suzhou and Dongguan, and sales and technical service institutions in Foshan, Xiamen, Qingdao, Wuhan, Chengdu, Tianjin, and Zhengzhou.
After years of development and application with numerous partners, Zhengyundong Technology’s products are widely used in fields such as 3C electronics, semiconductors, new energy, robotics, packaging and printing, textiles and garments, laser processing, medical pharmaceuticals, CNC machine tools, and traditional processing.
