ACROVIEW Technology, a leader in chip programming, announced the release of a new version of its programming software, which now supports multiple compatible chip models, including Winbond’s flash memory chip W25X05CLSN. This chip has achieved full compatibility with the ACROVIEW AP8000 universal programmer, significantly enhancing the compatibility of the AP8000 series devices with various chips.
The W25X05CLSN (512K bits) serial flash memory provides a storage solution for space, pin, and power-constrained systems. The flexibility and performance of the W25X05CLSN far exceed those of ordinary serial flash devices. They are ideal for code download applications and can also be used for storing voice, text, and data. These devices operate on a single power supply of 2.3V to 3.6V, with a working current as low as 1mA and a power-down current of only 1μA. All devices come in space-saving packages.
The W25X05CLSN array is organized into 256 programmable pages, each with 256 bytes. A maximum of 256 bytes can be programmed at once. The W25X05CLSN features 16 erasable sectors, 2 erasable 32KB blocks, and 1 erasable 64KB block. The smaller 4KB sectors provide greater flexibility for applications requiring data and parameter storage.
The W25X05CLSN supports a standard Serial Peripheral Interface (SPI), as well as high-performance dual-output and dual I/O SPI. Its interface includes: serial clock, chip select, serial data DI (I/O0), and DO (I/O1). The device supports SPI clock frequencies of up to 104MHz, and when using the fast read dual-output command, the equivalent clock rate can reach 208MHz. These transfer rates can rival those of 8-bit and 16-bit parallel flash memory. The continuous read mode allows for efficient memory access, with only 16 clock cycles needed for addressing a 24-bit address, thus supporting true XIP (execute in place) operations.
Additionally, the W25X05CLSN is equipped with a hold pin, write protection pin, and programmable write protection feature, providing further control flexibility. The device also supports JEDEC standard manufacturer and device identification, along with a 64-bit unique serial number.

Features
• Serial Flash Memory Series
– 512K bits / 64K bytes (65,536 bytes)
– Each programmable page is 256 bytes
– Uniform erasable areas: 4KB, 32KB, and 64KB
• Supports single/dual output/input SPI interfaces
– Standard SPI: Clock (CLK), Chip Select (/CS), Data Input (DI), Data Output (DO), Write Protect (/WP), Hold (/Hold)
– Dual SPI: Clock (CLK), Chip Select (/CS), Input/Output 0 (IO0), Input/Output 1 (IO1), Write Protect (/WP), Hold (/Hold)
• Data transfer rates up to 208M bits/second
– Clock operating frequency up to 104MHz
– Dual I/O SPI equivalent frequency of 208MHz
– Automatic increment read function
• Efficient “Continuous Read Mode”
– Low instruction overhead
– Supports continuous reading
– Only 16 clock cycles needed to address memory
– Supports true XIP (execute in place) operations
• Software and hardware write protection
– Write protection can be applied to all or part of the memory
– Protection can be enabled/disabled via the /WP pin
– Supports top or bottom array protection
• Flexible 4KB sector architecture
– Uniform sector/block erase (4/32/64KB)
– Page programming maximum of 256 bytes, time < 1ms
– Erase/write cycles exceed 100,000 times
– Data retention time exceeds 20 years
– Low power consumption, wide temperature range
– Single 2.3V to 3.6V power supply
– Operating current 1mA, power-down current < 1μA (typical)
– Operating temperature range -40°C to +85°C
• Space-saving packages
– 8-pin SOIC/VSOP (150 mil)
– 8-pin TSSOP (173 mil)
– 8-pad USON (2×3 mm)

Internal Block Diagram
With a strong technical foundation, ACROVIEW’s self-developed AP8000 universal programmer is regarded as a benchmark solution in the industry. This device supports flexible one-to-one and one-to-eight configurations, providing both online and offline operating modes. It has also developed dedicated programming solutions for eMMC and UFS storage chips, fully meeting the offline programming and on-board programming needs for Winbond’s entire range of chips. The AP8000 consists of three core modules: host, baseboard, and adapter, and this modular design grants it excellent compatibility and expandability. As a universal programming platform, the AP8000 can adapt to various programmable chips on the market and, with its stable and efficient performance, has become the core component of the ACROVIEW automated IPS5800S programming system, efficiently handling large-scale chip programming tasks to meet mass production needs.
The AP8000 host features flexible connectivity options, equipped with USB and NET interfaces, allowing for easy networking of multiple programmers. Through the networking function, users can easily achieve synchronized control of multiple programmers, efficiently conducting parallel programming operations. In terms of safety, the host is equipped with an intelligent safety protection circuit that can monitor the chip placement status and circuit connection in real-time. If it detects abnormal conditions such as chip reverse insertion or short circuits, it will immediately trigger a power-off protection mechanism, ensuring the safe operation of both the chip and the programmer. The host is equipped with a high-speed FPGA chip, significantly enhancing data transmission and processing efficiency, ensuring a smooth and efficient programming process. To enhance user convenience, the back of the host is equipped with an SD card slot. Users only need to store the project files generated with the PC onto the SD card and insert it into the slot. They can then complete file selection and loading for programming operations through the physical buttons on the programmer, achieving independent operation without a PC. This design not only reduces dependence on computer hardware configurations but also simplifies the setup process, significantly improving operational flexibility.
In terms of expandability and compatibility, the AP8000 adopts a modular design with baseboard and adapter boards, effectively extending the functional boundaries of the host. Currently, this device has achieved support for all mainstream semiconductor manufacturers’ products, covering well-known brands such as Yangtze Memory Technologies, ASR, XTX, Ambiq, and LATTICE. It supports a wide range of device types, including NAND, NOR, MCU, CPLD, FPGA, EMMC, etc., and is fully compatible with various industry-standard file formats such as Intel Hex, Motorola S, Binary, and POF, providing users with a one-stop, all-scenario chip programming solution.
Company Introduction
About Winbond: Winbond Electronics Corporation was established in September 1987 and was officially listed on the Taiwan Stock Exchange in 1995. Winbond is one of the few companies globally that possesses both memory and logic integrated circuits with proprietary products and technologies. From product design, technology research and development, wafer manufacturing to its own brand marketing globally, Winbond is committed to providing comprehensive integrated circuit products and solution services to customers worldwide. Core products include code flash memory, TrustME® secure flash memory, customized memory solutions, and a diverse range of logic integrated circuit products and solutions. Products are applied in handheld device applications, consumer electronics, and computer peripheral markets, and are also positioned in high-threshold and high-quality requirements fields such as automotive and industrial electronics.
About ACROVIEW Technology:ACROVIEW Technology is a national-level specialized and innovative “little giant” enterprise engaged in the research, production, and sales of semiconductor chip testing and programming equipment. The company is dedicated to empowering the entire industry chain customers, including Fabless, IDM, OSAT, wafer fabs, and end-device enterprises, through innovative semiconductor testing technologies and solutions. ACROVIEW’s pioneering fully automated aging testing ABI (Auto Burn-In) system greatly enhances the aging testing efficiency of customer chips and reduces Per DUT testing costs. Additionally, it provides equipment products and solutions for all stages from PSV, CP, FT, BI, SLT, to programming. We perfectly integrate the leading advantages of product technology, system-level expertise, and a globally laid-out R&D and sales service network to create value for customers to gain a competitive edge in the market.
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