RRAM

Semiconductor CAD Alliance Zhangjiang Forum – Embedded NVM Technology Under Advanced Processes

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Semiconductor CAD Alliance Zhangjiang Forum - Embedded NVM Technology Under Advanced Processes

On the evening of September 4, the weekly public lecture of the CAD Alliance Zhangjiang Forum was held at the Alliance Member Activity Center. The Semiconductor CAD Alliance Zhangjiang Forum series of public lectures aims to invite experts from various subfields to share in-depth insights on specific technical topics (such as new ideas, new technologies, … Read more

Tungsten and PCB (Printed Circuit Boards)

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Tungsten and PCB (Printed Circuit Boards)

Tungsten in the field of PCB (Printed Circuit Boards) is primarily applied in interconnection materials and advanced packaging technologies. Its high electrical conductivity, high-temperature resistance, and anti-electromigration properties make it a critical material. Below is a detailed analysis of applications and consumption: 1.Core Application Scenarios (1)Interconnection Materials and Via Filling Tungsten forms conductive layers for … Read more