Chip’s Eye of Insight: Core Applications of Thermal Reflectance Imaging (TR) Technology in Microscopic Thermal Management
Abstract In the cutting-edge field of modern integrated circuit (IC) design and manufacturing, the continuous increase in chip power density has made thermal management an increasingly severe challenge. From advanced process nodes with FinFET and GAA transistors to 3D integration and heterogeneous integration technologies, localized “hot spots” at the micron or even nanometer scale have … Read more
