Technical Article | Evaluation of Temperature Classes for Printed Lines on Class I and Class II Printed Circuit Boards

Technical Article Technical Articles PCECDuring the review of technical materials, it was found that there are some misconceptions regarding the evaluation of temperature classes for printed lines on Class I and Class II circuit boards. Additionally, some requirements in GB/T 3836.4—2021 “Explosive Atmospheres Part 4: Equipment Protected by Intrinsic Safety ‘i’” were not clearly stated, … Read more

Guide to Surface Treatment of Copper Foil and PCB Manufacturing

Guide to the Manufacturing Methods of Printed Circuit Boards 1. Overview This article discusses the methods for surface treating copper foil, carrier-attached copper foil, and their use in manufacturing copper-clad laminates and printed circuit boards. The patent primarily focuses on how to optimize the adhesion of plated circuits, etchability of electroless copper, and dry film … Read more

Upgrading Circuit Board Clean Rooms: How to Revitalize Old Workshops?

As the electronic manufacturing industry continues to raise its standards for cleanliness in production environments, many older circuit board clean rooms are struggling to meet modern process requirements. Common issues in these outdated workshops include aging equipment, insufficient cleanliness, high energy consumption, and unreasonable layouts, all of which directly affect product quality and production efficiency. … Read more

Detection of Odorous Gases Emitted from Circuit Boards

Fire Hazard Pre-Detection: Detection of Odorous Gases Emitted from Circuit Boards In recent years, the proliferation of IoT has led to the high performance and miniaturization of electrical products, resulting in circuit boards developing towards higher density. This high-density circuit board is at risk of quality degradation due to long-term use and thermal accumulation, which … Read more

New Circuit Board Materials Developed in Wuhan: A PhD Student’s Startup Enters the ‘Seed’ Stage

Recently, in the laboratory of the School of Materials Science and Engineering at Wuhan University of Technology, the hot press machine roared as it mixed, pressed, disassembled, and tested the performance of a high-frequency, high-speed, low-loss copper-clad laminate that was “ejected” by the machine. “The quality of 5G network signal transmission is crucially dependent on … Read more

Guide to Enhanced Heat Dissipation Printed Circuit Boards

The structure, manufacturing methods, and applications of printed circuit boards (PCBs) with electronic components. The core of this patent lies in improving heat dissipation efficiency by directly connecting heat dissipation elements to the wiring layer of the PCB, allowing for embedding in high-heat components such as power amplifiers. Key Concepts and Components Printed Circuit Board … Read more

Unit 2: Laminate Imperfections in Printed Circuit Boards

Laminate imperfections in printed circuit boards (Laminate Imperfection) refer to internal and external defects that can be observed from the surface of the printed board. There are more than a dozen types of laminate imperfections, including Measling, Crazing, Delamination/Blistering, Foreign Inclusion, Weave Exposure, Mechanically Induced Disrupted Fiber, Scratch, Dent, Tool Mark, Surface void, Color Variation … Read more

Introduction to the Stop Position Compensation Function of Fuji NXT SMT Placement Machine

This function detects the profile of the circuit board loaded into the machine and the F positioning point to perform stop position compensation, maintaining a fixed function. It can effectively address situations where the stop position fluctuates due to differences in the weight or size of the circuit board. 1. Installation of Low-Reflection Board If … Read more

Introduction and Usage of the PCB Height Detection Function in Fuji NXT SMT Pick and Place Machine

The PCB height detection function of the NXT pick and place machine is a feature that measures the warpage of the circuit board transported onto the transport track. For circuit boards with warpage, in addition to ensuring stable component placement, if the warpage exceeds the tolerance value, please avoid production in advance to prevent the … Read more