1. Product Overview
1.1 Overview
The T618 is a high-performance 4G LTE core board developed based on the Unisoc chip, which comes pre-installed with Google’s Android 10.0 system. It integrates a rich array of interfaces (such as LCM, camera, touchscreen, microphone, speaker, UART, USB, I2C, and SPI interfaces, etc.), greatly expanding its applications in the M2M field. It is widely used in smart cash registers, smart POS devices, tax control machines, security monitoring, smart access control, smart education, in-vehicle devices, high-end information collection devices, smart robots, smart homes, smart hardware, industrial smart handheld devices, drones, high-end law enforcement or policing equipment, smart intercom devices, smart wearables, vending machines, fitness equipment, logistics lockers, and more.

1.2 Current Cooperative Fields
In-vehicle devices
Educational learning machines
1.3 Features
High Performance: The T618 core board adopts an octa-core ARM® Cortex-A75 (dual-core) + Cortex-A55 (six-core) architecture, with a maximum frequency of 2.0GHz, and is equipped with an Arm Mali-G52 3EE2-Core GPU. It is one of the most powerful octa-core CPUs on the market, capable of playing various HD video formats and efficiently processing complex interactive operations, providing users with a smooth interactive experience.
Compatibility: The T618 core board reserves multiple SPI, I2S, I2C, Camera, MIPI display, interrupt trigger, ADC detection, USB2.0, UART, and expanded IO interfaces;
Stability: The T618 core board is an all-in-one Android board that incorporates unique technologies in both hardware and software to ensure product stability, allowing the final product to achieve 24/7 unattended operation;
Expandability: The T618 core board features a 60*50MM size with four corner postage hole designs, making it easy for customers to flexibly switch appearances for different product forms.
High Transmission Capability: The T618 core board comes with call functionality, supporting GSM/CDMA/WCDMA/TD-SCDMA/TDD-LTE/FDD-LTE.
1.4 Board Packaging
Packaging Type: LCC+LGA packaging
Size: 43mm*44mm
PCBA Thickness: Maximum thickness 2.8mm
Pin Count: 152+171Pin
1.5 Module Appearance

2. Basic Function List
2.1 Main Hardware Indicators

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