Sensors are the “perceptual cornerstone” of the information age and serve as a critical entry point in core fields such as the Internet of Things, artificial intelligence, smart vehicles, and industrial automation. Against the backdrop of intensified global semiconductor competition and supply chain restructuring, China’s sensor chip industry is facing unprecedented development opportunities and challenges.In recent years, with the acceleration of domestic substitution processes and breakthroughs in technology iterations, Chinese sensor companies have gradually transitioned from early technology followers to innovation leaders. In subfields such as CMOS image sensors, MEMS sensors, silicon photonics chips, and smart sensor SoCs, a number of globally competitive companies and products have emerged.From the perspective of product application scenarios, these companies are not only continuing to deepen their presence in traditional markets such as security monitoring and consumer electronics but are also achieving large-scale applications in emerging scenarios such as intelligent driving, machine vision, environmental perception, and industrial control, demonstrating strong ecological synergy and customized solution advantages. On one hand, image sensor companies represented by SmartSens and Geke Micro continue to break through the boundaries of pixel size and imaging performance; on the other hand, companies like HuaPu Micro and Meixin Semiconductor are deeply laying out in the MEMS and RF sensing fields, promoting high precision, low power consumption, and multi-modal integration as industry trends. Innovative products such as Qunfa Optoelectronics‘ OPA silicon photonic chips and Ruisizhi‘s integrated visual sensors indicate that Chinese sensors are moving from “replacement” to “leadership,” seizing technological high ground in cutting-edge areas such as LiDAR and event vision.The seventh “Chip Master – Hardcore Chip Annual Selection Event,” hosted by the leading semiconductor electronic information media Chip Master, gathered over a hundred well-known and potential companies in the Chinese semiconductor industry and their significant “chip” products for the year 2025. This article selects numerous domestic sensor chip companies and their key products participating in the evaluation, showcasing the latest technological achievements in the industry and reflecting the critical breakthroughs of the Chinese semiconductor industry at the perception level. We look forward to the continued deepening of innovation and expansion of boundaries by these companies, representing the strength of domestic sensor chips, playing an increasingly important role in the global wave of intelligent perception.*The following product rankings are not in any particular order, and the company and product information is sourced from the companies themselves.
SmartSens
SmartSens Technology (abbreviated as SmartSens) is a high-tech enterprise engaged in the research, design, and sales of CMOS image sensor chip products, headquartered in Shanghai, China, with R&D centers in multiple cities and countries.
Since its establishment, SmartSens has focused on innovation and research in high-end imaging technology, gaining recognition and favor from numerous customers due to its performance advantages. As a company dedicated to providing CMOS image sensor products that cover multiple application scenarios and full performance, its products have met the full performance needs across various application fields such as security monitoring, machine vision, smart automotive electronics, and smartphones.
SmartSens will uphold the vision of “using cutting-edge intelligent imaging technology to help people better see and understand the world,” with customer needs as the core driving force, continuously promoting upgrades in cutting-edge imaging technology, expanding product application fields, and working with partners to promote the deep development of future intelligent imaging technology.
SmartSens Intelligent Transportation Application 9MP High-Performance CMOS Image Sensor SC935HGS
Based on SmartSens’ SmartGS™-2 Plus technology, the 9MP global shutter CIS – SC935HGS, equipped with Lightbox IR® near-infrared enhancement technology, supports multiple HDR modes and boasts advantages such as high dynamic range, high frame rate, low noise, and distortion-free imaging. It has undergone comprehensive optimization of key capabilities such as high-temperature performance, frame rate, and shutter efficiency for actual ITS application scenarios, effectively addressing various pain points in road monitoring and fully meeting the rapid, clear, accurate, and stable image capture needs of ITS systems under complex conditions.
HuaPu Micro
Shenzhen HuaPu Microelectronics Co., Ltd. (abbreviated as HuaPu Micro) was established in 2004 and is a national high-tech enterprise and a national-level specialized and innovative small giant enterprise. It is also the Guangdong Provincial Engineering Technology Research Center for high-precision MEMS sensor design, packaging, and calibration. As a brand manufacturer of IoT system-level services that integrates high-performance RF chip design, firmware and protocol development, and application testing, HuaPu Micro focuses on three main directions: wireless data transmission, environmental perception, and the Internet of Things. Relying on a diverse product range including wireless RF chips, modules, sensors, and isolators, it has built a complete product layout covering key links in information perception and information interaction.
The company has a chip R&D team of over a hundred people, mainly composed of core teams from globally renowned design companies. The spread spectrum chip developed by the company breaks international monopolies and can provide reliable Chinese chips for domestic industries, automotive, and military applications in long-distance, high-security communication fields.
HP206W
HP206W can accurately provide pressure, temperature, and altitude data, with an internal data compensation function, featuring a high-speed I²C interface. Its temperature and pressure data are digitized through a high-resolution 24-bit ADC, while altitude data is calculated using a patented algorithm.
The pressure output resolution of HP206W can reach Pascal (Pa) decimal places, and the altitude resolution can be accurate to 0.2 meters. It has been widely used in barometers, altimeters, industrial pressure and temperature monitoring systems, and waterproof consumer electronic devices.
Minyuan Sensor
Minyuan Sensor is a vertical solution provider for industrial, safety, and environmental sensing chips and modules. The founding team returned from studying abroad and has rich industry experience from well-known semiconductor companies in the United States and Canada. The company has established sensor chip design, module design, and customer service teams in Jiaxing, Zhejiang, Beijing, and Hefei. The company’s technology route has upgraded from traditional analog devices to digital-analog hybrid intelligent sensing chips, with core signal chain acquisition circuits that include sensitive material drive, weak signal amplification, conditioning, analog-to-digital conversion, algorithm compensation, storage, and communication functions. The sensor modules and devices are equipped with embedded edge computing algorithms, providing customized, multi-sensor fusion, turnkey solutions for various industry applications based on product structure and industrial design.
The core chip products of the company include four major series: high-precision capacitive sensing chips, inductive conditioning chips, electrochemical conditioning chips, and digital temperature sensing chips; sensor modules include 14 series such as liquid level, water immersion, flow, rainfall, moisture content, conductivity, pH value, frost, temperature, humidity, proximity, position, tilt, and vibration.
Featured sensors include soil multi-parameter sensors, grain moisture sensors, deep water level gauges, capacitive water immersion sensors, high-reliability temperature and humidity probes, ultra-low temperature industrial temperature probes, three-axis high-precision inclinometers, low-power rain gauges, FFT vibration analyzers, and frost sensors, widely used in automotive electronics, industrial testing, smart home appliances, smart agriculture, and safety monitoring industries.
MCP1081S/MC1081
A ten-channel, wide-band capacitive analog-digital hybrid sensing SoC, integrating a microprocessor, storage, and rich I/O interfaces; capacitive excitation frequency ranges from 100K to 30MHz, with 16-bit fF-level resolution and strong penetration; supports various working modes including single-ended capacitance, differential capacitance, and mutual capacitance; built-in digital temperature measurement, LDO, and active shielding, widely used in liquid level, moisture content, humidity, water immersion, proximity, touch, frost, and other sensing fields.
MLC12G
MLC12G is a highly integrated inductive-capacitive sensing chip, with an oscillation frequency that can be configured between 10KHz and 100MHz, and frequency measurement output values as 16-bit digital signals. Function configuration and data read/write support a maximum I2C communication rate of 1MHz, with a built-in low-noise power management module LDO, adaptable to a wide power supply voltage range of 2.0V to 5.5V, and includes temperature sensing signals for temperature compensation. Frequency calculations are fully digitized through an internal digital signal processing unit, widely used in metal proximity, human proximity, position sensing, and other industrial and specialized detection scenarios.
Meixin Semiconductor
Meixin Semiconductor was established in 1999 and has over twenty years of experience in MEMS sensor research and production technology. It has production and R&D institutions in China, Europe, and the United States, with a sales network covering Asia-Pacific, Europe, America, and Africa. As a global leader in inertial MEMS sensor supply, Meixin Semiconductor has established a complete system for brand, channel, and quality control. Meixin is one of the earliest IDM model inertial sensor suppliers in China, which has created its core competitiveness in testing, packaging, and wafer production.
Meixin Semiconductor provides customers with one-stop solutions from MEMS sensor chips, software algorithms, to application solutions. Its products include thermal acceleration sensors, capacitive acceleration sensors, AMR geomagnetic sensors, Hall sensors, eOIS image stabilization chips, six-axis IMUs, and encoders, widely used in automotive, industrial, medical, wearable, smart home, and consumer electronics fields, providing people with a more intelligent, reliable, and safe technological experience.
MXC3638AL
MXC3638AL is a vehicle-grade three-axis acceleration sensor designed with a single chip and ultra-low power consumption, supporting I2C/SPI communication interfaces, with 16-bit high precision and configurable working modes. It supports motion detection and achieves ultra-low power standby through interrupt output, waking up the MCU on motion-triggered interrupts. The LGA package size is 2x2mm, and it meets AECQ100 Class3 standards, making it well-suited for applications such as automotive smart keys.
Qunfa Optoelectronics
Yangzhou Qunfa Optoelectronics Technology Co., Ltd., established on November 25, 2021, is located at 21 Mu Yang Road, Yangzhou High-tech Industrial Development Zone. Qunfa has sponsored the University of Michigan’s OPA project and obtained exclusive technical authorization for the OPA project in the Chinese region, mainly engaged in the design, simulation, testing, and radar prototype development of all-solid-state OPA silicon photonic chips. The aim is to develop and mass-produce highly integrated, multi-wavelength tunable, large-angle scanning all-solid-state OPA silicon photonic chips, which can be fully integrated on silicon substrates and are expected to significantly reduce the cost of existing LiDAR systems. After years of research, the company has mastered a new optical phased array technology solution, modulating the direction of the laser beam by changing the incident laser wavelength, overcoming the challenges of traditional optical phase shifters such as high modulation voltage, high power consumption, and slow response speed, improving product integration, stability, and significantly reducing costs, achieving a technological breakthrough in all-solid-state OPA silicon photonic chips, filling a domestic gap and reaching a globally leading level.
2D/3D OPA Silicon Photonic Chip
The Qunfa OPA silicon photonic chip adopts a third technical route wavelength modulation scheme, modulating the direction of the laser beam by changing the incident laser wavelength, overcoming the challenges of traditional optical phase shifters such as high modulation voltage, high power consumption, and slow response speed, improving product integration, stability, and significantly reducing costs, achieving a technological breakthrough in all-solid-state OPA silicon photonic chips, filling a domestic gap and reaching a globally leading level.
Jiesheng Microelectronics
Jiesheng Microelectronics is a high-tech company founded by national specially appointed experts and a team of overseas returnees with PhDs from Europe and the United States, headquartered at 125 Jinye Road, Xi’an High-tech Zone, Xi’an Semiconductor Industry Park.
Jiesheng Microelectronics specializes in the production of Hall magnetic sensor SOC chips, analog drive ICs, power management chips (AC-DC/DC-DC), MOSFETs, diodes, transistors, and various types of thyristors. JSMSEMI Jiesheng Microelectronics has a complete independent R&D system and masters several leading domestic key core technologies, developing various magnetic switch series chips, magnetic speed and direction sensor chips, linear sensor chips, and magnetic encoder chips, including 25V to 700V gate drive IC chips, 3300V/5000V isolation gate drive IC chips, motor drive IC chips, smart power switches, and smart modules. It provides high-reliability power analog IC chips for end customers in automotive electronics, photovoltaics and energy storage, data centers, and industrial control markets.
Jiesheng Microelectronics is one of the companies in the industry that can provide the most comprehensive products and solutions, with over 50 types of packaging forms and more than 10,000 models. The company has passed ISO9001:2008 quality management system certification. JSMSEMI products meet SGS report standards and comply with SVHC and RoHS standards.
Reliable supplier of automotive industrial-grade chip production and solutions.
JSM758
The JSM758 series is an open-loop current sensor module based on the Hall effect principle, providing a more economical and precise solution for AC or DC detection, widely used in industrial, commercial, and communication systems for AC or DC current detection. This product can be used for motor control, load detection and management, power supplies and DC-DC converters, photovoltaic inverters, UPS, overcurrent protection, and current detection in medium and low-power frequency converters.
The JSM758 consists of a high-precision, low-noise, low-temperature drift linear Hall IC, magnetic core, and low insertion resistance (0.12mΩ) current conductor path (located near the mold surface). The external current flowing through this conductor path generates a magnetic field, which the chip converts into a voltage signal proportional to the input current. The output voltage of the JSM758 is provided by a low-offset, chopper-stabilized BCDMOS Hall IC, and the output voltage is precisely calibrated in-house according to different current ranges. When the applied external current flows through the conduction path (from pin 4 to pin 5), the chip’s output has a positive slope (>V00). The typical internal resistance of this conduction path is 120uQ, achieving low energy consumption. The terminals of the conductive path (pins 4 and 5) are electrically isolated from the signal terminals (pins 1 to 3). This allows the JSM758 current sensor module to be used in current detection applications without the need for other expensive isolation technologies.
All pins of the JSM758 series are tin-plated, and the packaging materials are lead-free, complying with RoHS standards.
Octopus Microelectronics
Hangzhou Octopus Microelectronics Co., Ltd. (hereinafter referred to as “Octopus Microelectronics”) is a high-tech enterprise dedicated to the research and development of microelectronic technology, with nearly a hundred employees. The company focuses on the integration of “SoC + sensing chips + AI algorithms,” aiming to become a leader in various intelligent modules’ “sensing and computing integration (SAI).”
Founded at the end of 2019 and headquartered in Hangzhou, China, the company has a research and development team composed of top industry experts and engineers, with over 86% of R&D personnel, of which 63% hold master’s or doctoral degrees. Through continuous technological innovation and product optimization, Octopus Microelectronics provides high-quality microelectronic products and solutions to customers. The company’s products are widely used in consumer electronics, security, industrial automation, and other fields, receiving high praise from customers.
Hangzhou Octopus Microelectronics Co., Ltd. actively responds to national and government policies, vigorously developing semiconductor and chip design and R&D technologies. With its outstanding performance in technological R&D and product innovation, the company has occupied an important position in domestic and international markets. With its excellent technical strength and continuously innovative products, Octopus Microelectronics’ influence in the industry is increasing. In the past year, Octopus Microelectronics’ shipment volume accounted for nearly 40% of the smart lock fingerprint chip market. This significant market share not only proves the company’s competitiveness in the market but also reflects Octopus Microelectronics’ advantages in technological innovation and product reliability.
Octopus Microelectronics’ market share in the smart lock fingerprint chip market is not only large but also shows a continuous growth trend. In the past three years (2022-2024), the company’s fingerprint chip shipment volume has maintained a high compound growth rate of over 40%, which is attributed to the company’s continuous investment in technological R&D and its outstanding performance in marketing and customer service. By continuously optimizing product performance and enhancing user experience, the company has successfully attracted a large number of customers and established a good reputation in the market.
AI Semiconductor Fingerprint Sensor OS861X
The AI semiconductor fingerprint sensor OS861X, set to be launched at the end of 2024, addresses four major pain points in the industry. It adopts a more efficient acquisition area, paired with a self-developed DIXmatchᵀᴹ AI parameter pre-selection hybrid algorithm, achieving rapid recognition and low power consumption; optimized for special populations, with a comprehensive recognition pass rate of over 99.4%; high ESD protection, supporting large-capacity enrollment and 360-degree omnidirectional recognition, with a high security level and wide application.
Ruisizhi
Ruisizhi® is a leading developer of integrated visual sensors, established in 2019, with its operational headquarters in Shenzhen and R&D teams in Beijing, Zurich, Shanghai, and Nanjing. Based on its proprietary integrated visual sensing technology, Ruisizhi® has developed the ALPIX® series of integrated visual sensing chips, combining event sensors with traditional CMOS image sensors, supporting synchronous or asynchronous output of high-quality image data and event data, and providing leading customized intelligent visual solutions for mobile phones, consumer electronics, security, and automotive fields, continuously empowering the visual AI ecosystem.
Machine Perception Integrated Image Sensor ALPIX-Pizol
As the world’s first visual sensor that integrates excellent low-light performance, high frame rate motion capture, high dynamic range imaging, and ultra-low power consumption sensing characteristics, ALPIX-Pizol® provides groundbreaking multi-modal integrated visual solutions for low-power, low-consumption edge-side AI perception, ultra-low power imaging, drones, robotics, and smart city applications, empowering edge-side AI and spatial intelligence industry ecosystems.
Rays Technology
Rays Technology (RAYSEES) is a high-tech company in the semiconductor optics field, providing industry-leading VCSEL optical chips and related optical solutions. The company is committed to developing groundbreaking innovative technologies to assist customers in smart automotive, consumer electronics, medical aesthetics, and industrial manufacturing fields in achieving innovative applications.
Rays Technology was founded by a team of PhDs who returned from the United States, with core team members having a deep background in the optoelectronic semiconductor industry and years of large-scale industrialization experience. Currently, Rays Technology has launched several self-developed high-performance, high-reliability VCSEL chips and optical integration products, applying for over 150 domestic and international technology invention patents, serving over 100 global customers.
Rays 850nm Single-Mode Polarization-Locked VCSEL
The Rays 850nm single-mode polarization-locked VCSEL fills the market gap for high-precision light sources in China and has achieved mass production. With its excellent performance, it provides strong support for optical encoders (industrial motor control, scanners, smartwatches, medical imaging devices) and optical sensors (gas sensing, biosensing, speed sensing) in two major application directions. This solution not only features high performance and low power consumption but also demonstrates extremely high stability, significantly promoting technological innovation and dual optimization of cost-effectiveness in related fields.
This product not only reaches international advanced levels in performance but also achieves optimization in cost. The product price is significantly lower than that of similar foreign products and fully complies with RoHS and REACH environmental standards. The company has built an optical integration and chip packaging factory of over 4,000 square meters, with a monthly production capacity of 5 million units, ensuring mass production capabilities.
Geke Micro
Geke Micro Co., Ltd. (abbreviated as “Geke”) was established in 2003, headquartered in Shanghai, China, with nine branches worldwide. Its main business includes the design, research and development, wafer manufacturing, packaging, and sales of CMOS image sensors (CIS) and display driver chips (DDIC). Its products are widely used in mobile phones, smart IoT, automotive, wearables, mobile payments, medical, and industrial fields.
GC50F6
GC50F6 is the world’s first single-chip 0.61μm small pixel CIS, breaking through the quality bottleneck of small pixels. It adopts Geke’s proprietary GalaxyCell® 2.0 process, significantly improving light sensitivity through FPPI®Plus pixel isolation and BDTI backside deep trench technology. As the smallest optical size product with 50 million pixels, it can reduce the thickness of camera modules, meeting the demand for ultra-thin models. With a non-stacked differentiated technology route and a full product layout, Geke’s mobile CIS shipments ranked second globally in 2024, demonstrating market competitiveness.
GC50E1
GC50E1, a 50 million pixel CMOS image sensor (CIS), features a 0.7μm pixel size and a 1/2.5” optical size.
GC50E1 is Geke’s second-generation 50M 0.7μm image sensor. With high pixel count, excellent autofocus, and HDR performance, it is suitable for flagship front cameras and ultra-wide-angle lenses, making it a preferred choice for mainstream smartphone rear cameras.
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