1. Overview
China Electronics Technology Group Corporation Chip Technology Co., Ltd. (formerly known as China Electronics Technology Group Corporation Optoelectronic Technology Co., Ltd. and China Electronics Technology Group Corporation Energy Co., Ltd.) was established from China Jialing Industrial Co., Ltd. (Group) and officially listed on the Shanghai Stock Exchange on October 13, 1995. The company completed a major asset restructuring in 2021, with the stock code “600877” and the stock abbreviation “Electronics Technology Chip”.
The company specializes in the design, research and development, manufacturing, testing, and sales of silicon-based analog semiconductor chips and their application products. Its main products include silicon-based analog semiconductor-related chips, devices, modules, integrated solutions, and related smart terminal application products, which can be widely used in fields such as the Internet of Things, consumer electronics, green energy, security electronics, automotive electronics, and smart power supplies. As of the end of 2023, the company has fully utilized the high integration, multifunctionality, multi-channel, and analog-digital mixed reconfigurability characteristics of silicon-based analog processes, developing nearly a thousand series, solution-oriented, and integrated single-chip and module products, providing overall solutions for end customers, continuously improving product cost-performance ratio through technological innovation and industrial chain layout, and entering more leading and high-quality customer supply chains.
| Item | Content |
|---|---|
| Full Company Name | China Electronics Technology Group Corporation Chip Technology Co., Ltd. |
| Stock Code | 600877 |
| Establishment Date | 1995 (formerly known as Chongqing Southwest Integrated Circuit Design Co., Ltd.) |
| Headquarters Location | Chongqing |
| Listing Status | Listed on the Shanghai Stock Exchange in 1995 |
| Major Shareholder | China Electronics Technology Group Corporation (holding approximately 24.6%) |
| Main Business | Research and production of special integrated circuits, IoT chips, and semiconductor devices |
2. Company Team and Management
| Position | Name | Educational Background | Professional Experience |
|---|---|---|---|
| Chairman | Li Bin | Born in April 1971, Han nationality, member of the Communist Party, from Hebei, with a graduate degree and a master’s degree, senior engineer at researcher level. Graduated from Shijiazhuang Communication Measurement and Control Technology Research Institute, majoring in Communication and Electronic Systems. | Since March 1998, he has served as the leader and director of the software group of the National Engineering Research Center for Communication Software and Special Integrated Circuit Design at the 54th Research Institute, deputy chief engineer of the 54th Research Institute, director of the Integrated Circuit and Application Software Department, deputy general manager, general manager, deputy secretary of the Party Committee, director, chairman, and secretary of the Party Committee of Zhongke Xinchip Integrated Circuit Co., Ltd., deputy director and executive deputy director of the 58th Research Institute, deputy secretary of the Party Committee, and secretary of the Party Committee, deputy director of the Science and Technology Department of China Electronics Technology Group Corporation, and chief scientist. Currently serves as the secretary of the Party Committee of the China Electronics Technology Chip Technology Research Institute and chairman and secretary of the Party Committee of China Electronics Technology Chip Technology (Group) Co., Ltd. |
| General Manager | Ma Yu | Male, born in May 1972, Han nationality, from Linhe, Inner Mongolia, member of the Communist Party, with a graduate degree and a master’s degree, senior engineer. Graduated from Harbin Institute of Technology, majoring in Management Science and Engineering. | Since March 1997, he has served as deputy director and director of the technical reform department of the Civil Products Bureau of the Aerospace Industry Corporation, senior staff member of the Military Electronics Department of the System Engineering Department of the Ministry of Industry and Information Technology, deputy director and researcher of the Electronic Components Department of the System Engineering Department of the Ministry of Industry and Information Technology, assistant director and deputy director of the 58th Research Institute of China Electronics Technology Group Corporation, deputy general manager of Zhongke Xinchip Integrated Circuit Co., Ltd., and deputy general manager of China Electronics Technology Group Chongqing Optoelectronic Co., Ltd. Currently serves as deputy secretary of the Party Committee, director, and general manager of China Electronics Technology Chip Technology Co., Ltd. |
| Board Secretary, Financial Officer | Chen Guobin | Male, born in December 1979, Han nationality, from Dongying, Shandong Province, member of the Communist Party, with a graduate degree and a master’s degree. Graduated from Dalian University of Technology, majoring in Automotive Engineering and Accounting. | Previously served as financial director and board secretary of Liaoning Muchang International Environmental Protection Industry Co., Ltd.; financial officer, board secretary, and audit director of Shenyang Laijin Automotive Parts Co., Ltd.; financial director and board secretary of Hive Electric Drive System (Jiangsu) Co., Ltd. Currently serves as a member of the Party Committee, financial director, and board secretary of China Electronics Technology Chip Technology Co., Ltd. |
| Vice Chairman | Xiao Zhiqiang | Male, born in May 1972, Han nationality, from Linhe, Inner Mongolia, member of the Communist Party, with a graduate degree and a master’s degree, senior engineer. Graduated from Harbin Institute of Technology, majoring in Management Science and Engineering. | Since March 1997, he has served as deputy director and director of the technical reform department of the Civil Products Bureau of the Aerospace Industry Corporation, senior staff member of the Military Electronics Department of the System Engineering Department of the Ministry of Industry and Information Technology, deputy director and researcher of the Electronic Components Department of the System Engineering Department of the Ministry of Industry and Information Technology, assistant director and deputy director of the 58th Research Institute of China Electronics Technology Group Corporation, deputy general manager of Zhongke Xinchip Integrated Circuit Co., Ltd., and deputy general manager of China Electronics Technology Group Chongqing Optoelectronic Co., Ltd. Currently serves as deputy secretary of the Party Committee, director, and general manager of China Electronics Technology Chip Technology Co., Ltd. |
3. Founder Introduction
Electronics Technology Chip is a subsidiary of China Electronics Technology Group and does not have a traditional individual founder. Its core team consists of technical backbones from China Electronics Technology Group, leading the technological direction for defense and civilian chip research and development.
4. Main Business
- Special Integrated Circuits: Chips for military and aerospace applications
- IoT Chips: Low-power communication modules, sensor chips
- Semiconductor Devices: RF devices, power management chips
5. Core Technologies
| Technology Field | Technical Advantages |
|---|---|
| High Reliability SoC Design | Military-grade radiation resistance, wide temperature range operation (-55℃~125℃) |
| RF Microwave Technology | Top five in domestic market share for 5G base station RF front-end chips |
| Low Power IoT Technology | Ultra-low power Bluetooth chips (power consumption <1μA) |
6. Products and Services
| Product Category | Representative Products | Application Fields | Technical Specifications |
|---|---|---|---|
| Special Integrated Circuits | Radiation-resistant FPGA chips | Satellites, missile guidance | Radiation resistance level >100krad |
| IoT Chips | BLE 5.2 module | Smart home, wearable devices | Transmission distance 300m, power consumption 0.8μA |
| RF Devices | 5G base station power amplifier | Communication base stations | Frequency 3.5GHz, efficiency >45% |
7. Market Competitive Position
| Dimension | Electronics Technology Chip | Main Competitors (Fudan Microelectronics/Unisoc) |
|---|---|---|
| Market Share | Approximately 12% market share in special chips (third in China) | Unisoc market share 25% (first in China) |
| Technical Advantages | Military-grade reliability, core supplier for domestic substitution | Fudan Microelectronics leads in FPGA technology |
| Industry Position | Strong technical voice in the military field, limited ecological cooperation | Unisoc covers consumer electronics and automotive electronics ecosystems |
8. Business Model
- B2G/B2B Model: Directly connect with military units and communication equipment manufacturers (e.g., Huawei, ZTE)
- Technology Licensing: Provide IP core licensing to small and medium-sized manufacturers
- Solutions: Provide integrated services of “chip + module + system”
9. Company Ecosystem
- Upstream: SMIC (foundry), China Resources Micro (packaging)
- Downstream: China Aerospace Science and Technology Corporation, China Mobile
- Cooperative Institutions: Tsinghua University Microelectronics Institute, CETC 24th Institute
10. Development History
| Year | Event |
|---|---|
| 1995 | Founded as Southwest Integrated Circuit, focusing on military chip design |
| 2008 | Acquired Chongqing Optoelectronic Company, expanding RF device business |
| 2019 | Reorganized and merged into China Electronics Technology Group, renamed Electronics Technology Chip |
| 2022 | Released the first automotive-grade MCU chip, entering the automotive electronics field |
11. Industry Development
- Trends: Acceleration of domestic substitution (less than 20% localization rate in 2023), 30% annual growth in automotive-grade chip demand
- Challenges: High-end processes rely on external foundries (14nm and below require support from TSMC/Samsung)
12. Company Type Classification
| Classification Dimension | Electronics Technology Chip Positioning |
|---|---|
| Technical Attributes | Integrated circuit design (Fabless model) |
| Product Type | Special chips/IoT chips |
| Industry Classification | Semiconductor – Integrated Circuit (Shenwan Secondary Industry) |
| Core Product Examples | Radiation-resistant FPGA, 5G RF front-end chips |
13. Economic Cycle
- Current Stage: Upward cycle (benefiting from military informatization and 5G base station construction)
- Cycle Drivers: Defense budget growth (2023 +7.2%), annual growth of 15% in IoT device shipments
Company Summary Table
| Dimension | Content Summary |
|---|---|
| Company Name | China Electronics Technology Group Corporation Chip Technology Co., Ltd. (600877) |
| Establishment Date | 1995 |
| Headquarters Location | Chongqing |
| Listing Status | Listed on the Shanghai Stock Exchange |
| Main Business | Special chips, IoT chips, RF devices |
| Core Technologies | High reliability SoC, RF microwave technology, low power design |
| Main Products | Radiation-resistant FPGA, BLE module, 5G power amplifier |
| Market Share | Third in special chips in China (approximately 12%) |
| Main Competitors | Unisoc, Fudan Microelectronics, Silan Microelectronics |
| Industry Position | Leading technology in the military field, civilian market ecosystem to be expanded |
| Business Model | B2G/B2B direct sales + technology licensing |
| Development History | Founded in 1995 → Acquired in 2008 → Reorganized in 2019 → Entered automotive-grade chips in 2022 |
| Company Type | Semiconductor design (Fabless), core supplier for military electronics |
Specialized Product Knowledge: Special Integrated Circuits
- Definition: Military/aerospace chips that meet extreme environments (high temperature, radiation, vibration), requiring GJB548B standard certification.
- Technical Challenges: Radiation-resistant design (single particle flip protection), long-life reliability (>15 years).
- Market Prospects: The global market size is expected to reach $8 billion by 2025, with China’s share increasing to 25%.
References:
- China Electronics Technology Group Corporation official website (https://www.cetc.com.cn)
- Baidu Enterprise Credit (Electronics Technology Chip business information)
- Eastmoney (600877 company announcements)
- Industry analysis reports (Chip Research, TrendForce)
(Note: Some data is compiled from publicly available industry information; specific financial and market share figures should be based on the company’s annual report.)
DisclaimerThis article is original to this public account/compiled and published to convey more information,and does not constitute any form of professional advice. Readers act at their own risk based on this information; this public account and the author bear no legal responsibility.
