As consumer-grade security demands evolve from “visibility” to “long-term observation and understanding,” AIoT technology continues to break the boundaries between devices and scenarios. The security IPC chip industry is standing at the dual forefront of “technological breakthroughs” and “scenario explosions.” Traditional chips, which relied on constant power and single functions, are increasingly unable to meet the diverse needs of outdoor farms, remote residences, and home care. The low-power intelligent innovation centered around AOV (Always-On Video) technology is becoming the key to success in the industry. Today, companies like Guoke Micro, Rockchip, and Beijing Junzheng are ramping up their efforts, and the return of HiSilicon intensifies competition, leading to a comprehensive industry transformation focused on low power consumption, strong AI, and multi-scenario adaptability.
1. Technological Evolution: From High Definition Integration to Low Power Intelligent TransitionThe technological development of security IPC chips has shifted from an early focus on “high-definition resolution and functional integration” to “low power optimization and front-end AI empowerment” to adapt to diverse edge scenarios such as battery power supply and areas without electricity or networks. This transformation is driven by both market demand and technological breakthroughs.In terms of ultra-high definition and functional integration, the industry has formed a mature technological system. With the widespread demand for 4K and 8K video, IPC chips generally support H.264/H.265 encoding and 1296P, 4K resolution video processing. Some high-end chips, such as Rockchip RK3588 and HiSilicon Hi3559AV100, can achieve 8K encoding and decoding. At the same time, the integration level of chips continues to rise, with a single SoC (System on Chip) integrating ISP (Image Signal Processor), NPU (Neural Processing Unit), network interfaces, and security encryption modules, even supporting multi-camera input and 3D ToF depth sensing, significantly reducing system complexity and cost.For example, the Guoke Micro GK7203V1 series integrates 64MB/128MB DDR memory, USB2.0, SDIO, and other rich peripheral interfaces, and is compatible with various display interfaces such as RGB/I80/BT.656, allowing direct connection to screens for local interaction without the need for additional expansion chips.The breakthrough in low-power technology is a core advancement in recent years, with the AOV mode becoming a key focus. Traditional IPCs rely on constant power supply, limiting their application in outdoor and remote areas. AOV technology achieves power optimization through “ultra-low frame rate monitoring + intelligent wake-up”—capturing images at a low frame rate of 1fps in standby mode, with the NPU detecting targets (such as human shapes and vehicles) in real-time, switching to high-definition mode only when an event is triggered, significantly reducing power consumption.The Guoke Micro GK7203V1 series achieves a power consumption as low as 40mW in AOV mode, while Rockchip’s AOV 3.0 technology reduces standby power consumption to 1mW. Beijing Junzheng’s T41ZM/ZG chips also reach a sleep power consumption level of 1mW, allowing battery-powered IPCs to extend their battery life from several days to several months, even supporting solar power, completely freeing them from reliance on the power grid. Additionally, manufacturers are further reducing power consumption through hardware optimizations, such as GK7203V1’s “high-precision fill light control” that synchronizes image capture with fill light to avoid ineffective power consumption; the “fast wake-up acceleration design” shortens device wake-up time, reducing energy consumption during the startup phase.The enhancement of front-end AI capabilities has upgraded IPCs from “recording tools” to “intelligent analysis terminals.” Early IPCs needed to transmit video to back-end servers for AI processing, which caused delays and bandwidth pressure. New generation chips achieve front-end intelligence by integrating NPUs—Guoke Micro GK7203V1 integrates a 0.2TOPS NPU, supporting algorithms for face recognition and target detection; Rockchip RV1126B supports complex behavior analysis with 3TOPS computing power; HiSilicon Hi3516CV610 enhances inference efficiency through a dedicated AI accelerator.To lower the development threshold, manufacturers are also opening algorithm ecosystems. For instance, Guoke Micro offers over 30 intelligent algorithm licenses for free, and the yoosee Lingmou LM100 chip provides six AI algorithms for human shape, crying, and flame detection, allowing small and medium enterprises to implement intelligent functions without self-development, accelerating the deployment of AI visual technology in various scenarios.2. Product Landscape: Differentiated Layouts and Technical Highlights of Leading ManufacturersIn the security IPC chip market, manufacturers like Guoke Micro, Rockchip, and Beijing Junzheng have formed differentiated layouts based on their advantages in niche areas. The return of HiSilicon further intensifies competition, with each company’s products focusing on low power consumption, AI computing power, and multi-scenario adaptability, collectively driving technological upgrades in the industry.Guoke Micro focuses on “low power + multi-view imaging” as its core competitive advantage, with its GK7203V1 series being a representative product in the consumer-grade IPC market. This chip adopts an ARM Cortex-A7 + RISC-V dual-core architecture, balancing computing power and energy efficiency. The integrated 0.2TOPS NPU, while at a light computing power level, is sufficient to meet the intelligent detection needs of consumer-grade scenarios; it supports dual MIPI access and can be expanded to four views, compatible with both MIPI and DVP mixed input modes, adapting to different resolution sensors, and meeting complex scenarios such as “gun-ball linkage” (wide-angle + telephoto monitoring) and multi-angle monitoring, for example, achieving simultaneous capture of panoramic and close-up images at the door in a visual doorbell.
Moreover, the high integration design of GK7203V1 significantly reduces costs, with built-in DDR memory and rich interfaces, eliminating the need for additional storage chips and peripheral modules, providing a high cost-performance solution for battery cameras, dash cams, and face recognition terminals, regarded as the “core engine for cost reduction and efficiency enhancement” in the consumer-grade market.Rockchip focuses on “mid-to-high-end AI computing power and technology integration,” with its RV1126B chip demonstrating strong adaptability to various scenarios. This chip has 3TOPS computing power, supporting advanced features such as dynamic stitching, digital stabilization, and AI-ISP. The AI-ISP technology optimizes image quality in low-light and high-contrast lighting conditions, addressing the pain points of traditional IPCs, such as “poor visibility at night and overexposure in backlight.” The newly added AOV 3.0 technology incorporates audio event wake-up functionality, capable of detecting abnormal sound sources such as barking dogs and broken glass, achieving “dual monitoring of audio and video,” further reducing false positives and missed alerts.In terms of product matrix, Rockchip covers a full range of chips from economical (RV1103, RV1106) to flagship (RK3588), with RK3588 even supporting edge-side multimodal large models, capable of handling more complex intelligent tasks, such as defect detection in industrial vision and environmental perception in intelligent vehicles, meeting the needs of professional security and industrial scenarios.Beijing Junzheng focuses on “low power technology for battery IPCs,” establishing a niche market advantage with its T series chips. The first-generation T41ZM/ZG chips achieved “full-time recording” battery IPCs for the first time, with sleep power consumption as low as 1mW, helping clients like Jiegao and Mirui achieve millions of shipments. The second-generation T32V series has been comprehensively upgraded in power consumption, cost, and functionality, supporting multi-camera capabilities, with memory capacity options ranging from 512Mb to 2Gb to adapt to different product tiers. The upcoming T33V series further optimizes power consumption and cost-performance, and is pin-to-pin compatible with the T32V series, facilitating rapid product iteration for clients.Beijing Junzheng’s core advantage lies in “chip-level hardware-software collaborative design,” optimizing the collaborative working mechanism of CPU, ISP, and NPU to maintain efficient target detection capabilities even in low power states, avoiding frequent wake-ups that consume power, particularly suitable for 4G solar cameras and outdoor battery cameras in scenarios without electricity or networks.The return of HiSilicon reshapes the mid-to-high-end market landscape, with its products highlighted by “high performance and mature ecosystem.” Currently, HiSilicon’s security chip lineup covers all price segments: the flagship Hi3559AV100 supports 8K encoding and decoding and complex AI analysis, suitable for high-end intelligent security; the mid-to-high-end Hi3519AV200 and Hi3516DV500 integrate high-performance NPUs, supporting multi-view imaging and 3D ToF; the base-level Hi3516CV610 enters the consumer-grade market with high cost-performance, compatible with mainstream sensors and algorithms, quickly adapting to the needs of small and medium manufacturers.HiSilicon’s advantage also lies in its long-accumulated ecosystem resources, with a mature and stable SDK (Software Development Kit) and rich cooperation experience with leading security manufacturers like Hikvision and Dahua, enabling rapid responses to customized needs in professional security scenarios, such as providing dedicated algorithm support for intelligent traffic cameras.3. Market Situation: The Rise of Low Power IPCs and Intensifying CompetitionThe security IPC chip market is experiencing “dual growth in consumer and professional levels,” with low-power AOV chips becoming the core growth point in the consumer market. The return of HiSilicon and the layout of multiple manufacturers have shifted industry competition from “price wars” to “technology and ecosystem wars,” continuously reshaping the market landscape.In terms of market scale, the low-power IPC market is showing rapid growth. According to data from AIoT Star Map Research Institute, the market size of low-power IPCs reached 11.25 billion yuan in 2023, with a shipment volume of 22.5 million units, accounting for 10%-20% of the overall IPC market share. The market size is expected to further expand to 14 billion yuan in 2024, with shipment volume increasing to 28 million units, growing at a rate far exceeding that of traditional constant power IPCs.This growth is driven by the explosion of consumer-grade scenario demands: on one hand, high labor costs in Europe and the United States allow low-power IPCs to quickly replace traditional constant power devices due to their advantages of “DIY installation and no wiring required”; on the other hand, the decline in 4G data fees promotes the popularization of the “4G + low-power IPC” combination, suitable for outdoor farms, orchards, and remote residences without networks, allowing users to remotely view monitoring through their mobile phones without relying on broadband networks.The market competition has formed a “multi-strong coexistence” pattern, with the return of HiSilicon intensifying industry differentiation. During HiSilicon’s dormancy, manufacturers like Starshine Technology, Rockchip, and Beijing Junzheng occupied a place through breakthroughs in niche markets—Starshine Technology entered the consumer market with the low-power solution SSC308DE, supporting fast startup and intelligent encoding; Fuhang Micro launched the dual-camera AOV chip FH8626V300, focusing on high detection accuracy and ultra-low power consumption; Ankai Micro’s KM01A/W chips focus on smart home and wearable devices.After HiSilicon’s return, leveraging its technological accumulation and ecosystem advantages, it quickly regained the mid-to-high-end market, with its Hi3516CV610 chip becoming a popular choice in the base market. However, small and medium manufacturers have not exited; instead, they are adhering to differentiated strategies in niche areas, such as Beijing Junzheng focusing on battery IPCs and Guoke Micro concentrating on consumer-grade multi-view scenarios, forming a competitive landscape of “HiSilicon dominating the mid-to-high-end, while small and medium manufacturers delve into niches.”Price and ecosystem have become core competitive factors. In the consumer market, price sensitivity is high, and manufacturers reduce BOM costs through high integration designs—Guoke Micro’s GK7203V1 integrates DDR memory, reducing the number of external components; Rockchip lowers customer development costs through a “SoC + co-processor” dual-track platform.In the professional market, ecosystem adaptability is more critical. HiSilicon, with its long-term cooperation with Hikvision and Dahua, provides customized algorithms and technical support; Rockchip opens its toolchain to support customers in deploying edge-side large models, meeting complex scenario needs in industrial vision. Additionally, free algorithm licenses have become an important means to attract small and medium customers, with manufacturers like Guoke Micro and yoosee offering dozens of AI algorithms, significantly lowering the threshold for intelligent development and accelerating product deployment.The security IPC chip industry is currently in a dual opportunity period of “technological iteration and scenario expansion,” with low power consumption and intelligence remaining the core themes. Manufacturers like Guoke Micro and Rockchip are establishing advantages through breakthroughs in niche areas, while HiSilicon’s return is driving technological upgrades in the industry. The innovation in scenarios and the integration of technologies will further open up market space. In the future, with the arrival of the AIoT 2.0 era, IPC chips will no longer be limited to the security field but will penetrate into more scenarios such as smart homes, industry, and retail, becoming key nodes in the Internet of Everything and providing underlying technical support for the construction of a smart society.
