A few days ago, I wrote an article summarizing the performance window for mid-year reports in the PCB sector. Here, I will supplement some additional stocks.
1. High-end Substrates and Copper Foil
1. Jin’an Guoji: Domestic replacement of high-frequency and high-speed copper-clad laminates, certified by NVIDIA AI servers.
2. Shengyi Technology: Among the top five global copper-clad laminate manufacturers, a core supplier for 800G optical module substrates.
3. Zhongyi Technology: Bulk supply of HVLP copper foil for power batteries, breakthrough in mass production of composite current collectors.
4. Honghe Technology: Global market share of 30% in ultra-thin electronic fabrics, compatible with HBM packaging substrates.
5. Yihua New Materials: Vertically integrated layout (copper foil – copper-clad laminate – PCB), HVLP copper foil under certification.
6. Defu Technology: Supplies high-end electronic copper foil for PCBs to Shenghong Technology, leading application in solid-state battery copper foil.
2. Server and Communication PCBs
1. Huadian Co., Ltd.: Core supplier of PCB for NVIDIA GPU servers.
2. Shennan Circuit: Major manufacturer of AMD MI300 substrates, leading in FC-BGA technology.
3. Shenghong Technology: Supplier of motherboards for Amazon AI servers, high-end HDI capacity fully loaded.
4. Shengyi Electronics: Exclusive partner for Huawei Ascend AI chip substrates.
5. Guanghe Technology: Third in global market share for server PCBs, covering major server manufacturers.
3. Automotive Electronics PCBs
1. Jingwang Electronics: Main supplier for BYD’s intelligent cockpit domain controller boards.
2. Yidun Electronics: Exclusive supplier of BMS-FPC for Tesla’s 4680 battery.
3. Bomin Electronics: Mass production of IGBT ceramic substrates for vehicles, solving high-power heat dissipation issues.
4. Xiehe Electronics: Leading domestic market share in millimeter-wave radar PCBs.
4. Localization of Equipment and Materials
1. Xinqi Microelectronics: The only domestic PCB direct-write lithography machine, achieving HDI line precision of 5μm.
2. Guanghua Technology: IC substrate etching solution breaks overseas monopoly, certified by Changdian Technology.
5. Breakthrough Companies in Emerging Fields
1. Kexiang Co., Ltd.: HBM packaging substrates validated by Samsung.
2. Junya Technology: Core supplier of military phased array radar PCBs.
3. Zhongjing Electronics: Main supplier of Huawei optical module PCBs, breakthrough in LCP material technology.
4. Aoshikang: Mass delivery of high-speed switchboards for data centers.