An Infrared Thermal Imaging Method for Circuit Board Component Troubleshooting
An Infrared Thermal Imaging Method for Circuit Board Component Troubleshooting Xudong Song, Chao Liu, Liang Song, Jun Liu (Dalian Jiaotong University, School of Intelligent Engineering, Dalian, Liaoning 116028) Abstract: To detect internal faults in circuit board components, an infrared thermal imaging method for troubleshooting circuit board components is proposed. First, a network model called LGC-Net … Read more