Chip Journey (5) – The Start of Tapeout and Costly Investments
In the previous article “Chip Journey (4) – Introduction to Tapeout Design”, the design company and foundry have communicated the tapeout requirements through specified channels. This article begins to introduce the tapeout process for chips, which is also the start of another costly phase of the project.For the fab, the tapeout process generally includes the … Read more