Application of Ultra-High-Speed EtherCAT Real-Time Motion Control Card in High-Speed Semiconductor Die Bonding Machines
Market Application Background The localization of core semiconductor equipment is key to solving“bottleneck” technologies and ensuring national strategic security. Driven by policies and downstream demand, the demand for domestic equipment has surged. The semiconductor die bonding machine is a core packaging device, and its motion control equipment determines the performance of high-speed, high-precision placement of … Read more