Trends and Developments in PCB Technology

AI-PCB With the GB200 and GB300 ASICs experiencing explosive growth, and the upgrade of switches from 800G to 1.6T, AI-PCB is expected to see over 50% growth by 2026. Due to a sudden surge in demand, the industry capacity was fully loaded by Q1 2025, and new capacity will require 18-24 months to build, resulting … Read more

Core Reorganization of PCB

Core Reorganization of PCB

1. Copper Crown Copper Foil: A leading domestic enterprise in high-performance electronic copper foil production, capable of producing 1st to 4th generation HVLP copper foil. The products can be applied in 5G communication and AI fields, having entered the supply chains of several top CCL manufacturers, providing high-quality conductive materials for server PCBs to ensure … Read more