1. Copper Crown Copper Foil: A leading domestic enterprise in high-performance electronic copper foil production, capable of producing 1st to 4th generation HVLP copper foil. The products can be applied in 5G communication and AI fields, having entered the supply chains of several top CCL manufacturers, providing high-quality conductive materials for server PCBs to ensure stable signal transmission.
2. Defu Technology: A leading enterprise in the copper foil industry, deeply engaged in the copper foil field for forty years. Its electronic circuit copper foil products include RTF and HVLP, with HVLP1-2 having been supplied in small batches for NVIDIA projects and 400G/800G optical module fields. HVLP3 has passed Japanese copper-clad laminate certification and is used in domestic computing board projects. In July 2025, the company acquired Luxembourg Copper Foil, a global leader in high-end IT copper foil, which is expected to accelerate the domestic substitution of high-end electronic circuit copper foil.
3. China National Materials Technology: Its subsidiary Taishan Fiberglass is a domestic leader in low-dielectric electronic cloth. The first generation of Low-Dk electronic cloth has been supplied in bulk for NVIDIA H100 server PCBs, and the second generation is the first in the country to achieve mass production, enhancing the mechanical and electrical performance of PCBs and improving the stability and durability of server PCBs.
4. Honghe Technology: A global leader in ultra-thin electronic cloth, its low-dielectric electronic cloth has passed certifications from NVIDIA and TSMC, used for AI server PCB substrates, providing lightweight and high-performance foundational support for server PCBs.
5. Ding Tai High-Tech: A global leader in PCB drilling needles, leading in market share, with clients including Pengding Holdings and Shenghong Technology. Its drilling needles, milling cutters, and other products ensure the fine engraving of server PCB circuits, guaranteeing product quality and performance.
6. Dongwei Technology: The only global manufacturer of mass-produced 8/8μm grade MSAP transfer VCP equipment, with a plating uniformity deviation of ≤3% and high yield. Its equipment is crucial for the precision plating of server PCBs, enhancing the conductivity and reliability of circuits.
7. Chip Microelectronics: LDI lithography equipment with a resolution of 10μm, with CoWoP-related orders fully scheduled. High-resolution lithography equipment can achieve finer circuit layouts for server PCBs, enhancing server computing power.
8. DAZU CNC: Focused on the research, production, and sales of PCB-specific processing equipment, its products can be used for processing PCB products related to data center AI servers, covering mechanical drilling machines, CO₂ laser drilling machines, laser direct imaging systems, and other series of products to meet the high-layer and high-density PCB processing needs.
9. Shengyi Technology: The second-largest copper-clad laminate enterprise globally, leading in high-frequency and high-speed CCL technology, is a core supplier for 800G optical module substrates, certified by NVIDIA, providing stable insulation and circuit carrying performance for server PCBs.
10. Shenghong Technology: Specializes in the research, production, and sales of high-precision multilayer, HDI, FPC, and rigid-flex boards. Revenue is expected to exceed 10 billion in 2024, with high-end AI data center computing products in 5th and 6th generation HDI and 28-layer accelerator card products successfully mass-produced. The 1.6T optical module has entered small-scale production, with currently mass-produced PCBs reaching 40 layers, expected to break through to 78 layers. It has entered the supply chains of internationally renowned companies such as NVIDIA, AMD, and Intel, providing high-performance copper-clad laminate products for server PCBs.
11. Hongchang Electronics: As a core supplier of high-frequency and high-speed copper-clad laminates for Shenghong Technology, it provides low-dielectric loss and high-heat-resistant materials that effectively reduce signal interference in server PCBs, improving stability.
12. Shengquan Group: The leading domestic market share for electronic resin used in PCB substrates, has developed low-loss BT resin to meet the needs of 800G optical module PCBs. It has performed outstandingly in the hydrocarbon resin field, being the only company in the country to achieve domestic certification for the full series of M6-M8 resins, with products used in high-frequency and high-speed copper-clad laminates and semiconductor packaging, with downstream clients including first-line copper-clad laminate manufacturers like Shengyi Technology.
13. Dongcai Technology: Holds several key patents for halogen-free flame-retardant modified hydrocarbon resins, with its hydrocarbon resin products certified by copper-clad laminate manufacturers such as Taiguang Electronics and Taiyao Technology, indirectly supplying server systems for NVIDIA, Huawei, and Apple. It is building a 3500 tons/year electronic-grade hydrocarbon resin production capacity, expected to be fully operational by 2026, at which point it will become one of the largest hydrocarbon resin suppliers globally.