The four main functions of semiconductor packaging are: mechanical protection, electrical connection, mechanical connection, and heat dissipation.
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Mechanical protection: Silicon is very fragile, similar to glass, and is easily damaged by physical and chemical factors. The primary role of semiconductor packaging is to protect the chip and devices from physical and chemical damage by sealing them in packaging materials such as epoxy molding compound (EMC).
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Electrical connection: Packaging provides power to the chip through electrical connections between the chip and the system, while also providing input and output pathways for signals to and from the chip.
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Mechanical connection: The chip must be reliably connected to the system to ensure a good connection during use.
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Heat dissipation: If the semiconductor packaging cannot effectively dissipate heat, the chip may overheat, causing the internal transistors to heat up too quickly and fail to operate.
1. Traditional packaging methods can be further divided into ceramic packaging and plastic packaging based on the type of packaging material used.
2. In plastic packaging, it can be further divided into leadframe packaging or substrate packaging based on the type of packaging medium.
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3. Wafer-level packaging methods can be further divided into four different types:
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Wafer-Level Chip Scale Packaging (WLCSP), which forms leads and solder balls directly on the top of the wafer without the need for a substrate;
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Redistribution Layer (RDL), which uses wafer-level processes to rearrange the pad positions on the chip, allowing for electrical connections to the outside;
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Flip Chip packaging, which forms solder bumps on the wafer to complete the packaging process;
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Through-Silicon Via (TSV) packaging, which achieves internal connections within stacked chips through TSV technology.
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