“Chip” News Summary
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Ranking of NAND Flash Manufacturers by Revenue Market Share
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A Batch of New Integrated Circuit Companies Established
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Nearly 10 Chip Companies Engage in Intensive Mergers and Acquisitions
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TSMC’s Two Factories Make Progress
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Semiconductor Giants Receive Billions in Investments
1
Ranking of NAND Flash Manufacturers by Revenue Market Share
According to the latest survey by TrendForce, the NAND Flash industry is expected to face a slight decline in average selling prices (ASP) in the second quarter of 2025. Fortunately, the manufacturers’ production reduction strategies have alleviated the supply-demand imbalance. Coupled with policy support from the US and China, overall shipment volumes are expected to grow significantly, with the top five brands’ combined revenue increasing by 22% quarter-on-quarter to reach $14.67 billion.
In the third quarter, as the effects of subsidy policies in the Chinese market and the manufacturers’ stocking trends weaken, demand is expected to stabilize. Although ASP is anticipated to slightly rebound, consumer demand remains weak, and previous stockpiling has been overdrawn. It is expected that while the NAND Flash industry’s revenue can maintain growth in the third quarter, the extent of growth will narrow.
Analyzing the revenue situation of the top five NAND Flash suppliers in the second quarter, Samsung’s revenue increased by 23.8% quarter-on-quarter to $5.2 billion. This growth is primarily driven by strong enterprise SSD demand spurred by AI servers, significantly outperforming shipment expectations, and through product mix adjustments, inventory was reduced. Samsung’s market share slightly grew to 32.9%, maintaining its position as the revenue leader…For details, click on “Q2 Top Five NAND Flash Manufacturers’ Latest Revenue Market Share Ranking, SK Group’s Market Share Rises to 21%”
2
A Batch of New Integrated Circuit Companies Established
Recently, the new Unisplendour Group has established Hainan Unisplendour Technology Co., Ltd. (hereinafter referred to as “Hainan Unisplendour”) and Shanghai Unisplendour Tongxin Microelectronics Co., Ltd. (hereinafter referred to as “Shanghai Unisplendour Tongxin”) in Hainan and Shanghai.
Hainan Unisplendour was established on August 21 with a registered capital of 100 million yuan, fully owned by Beijing Unisplendour Communication Technology Group Co., Ltd., a subsidiary of the new Unisplendour Group. Shanghai Unisplendour Tongxin was established on August 15 with a registered capital of 30 million yuan, fully owned by Unisplendour Tongxin Microelectronics Co., Ltd. (referred to as “Unisplendour Tongxin”), a core enterprise in the automotive electronics and smart chip sector of the new Unisplendour Group.
In fact, since August, in addition to the new Unisplendour Group, a number of new companies in the integrated circuit field have been established. Geographically, the new companies are distributed across Shanghai, Hangzhou, Foshan, Wuxi, Suzhou, Chengdu, Hohhot, and other locations. From an industry chain perspective, the newly established companies cover power semiconductors, IC design, semiconductor equipment, and other fields…For details, click on “New Unisplendour Group/Star Semiconductor/Cambricon, etc., Establish a Batch of New Integrated Circuit Companies”
3
Nearly 10 Chip Companies Engage in Intensive Mergers and Acquisitions
Entering the second half of 2025, merger and acquisition activities in China’s semiconductor industry have significantly heated up. Statistics show that in August alone, nearly 10 listed companies disclosed important merger or equity investment plans.
Well-known companies such as Chipone Technology, Guokewai, Xindao Technology, and Jingfeng Mingyuan are engaging in intensive capital operations, initiating a “buy-buy-buy” model focused on technology enhancement and vertical integration of the industry chain. These transactions cover a wide range of fields, from traditional power management chips and power semiconductors to semiconductor equipment, precision components, and cutting-edge RISC-V architecture and specialty process wafer foundry. This clearly outlines the roadmap for the Chinese semiconductor industry to accelerate domestic substitution through internal integration…For details, click on “Semiconductor ‘Buy-Buy-Buy’! Nearly 10 Chip Companies Engage in Intensive Mergers and Acquisitions”
4
TSMC’s Two Factories Make Progress
Recent news indicates that TSMC’s two advanced packaging factories (AP1, AP2) planned in the United States have entered the site preparation phase, with construction expected to begin in the second half of 2026 and completion targeted for 2028.
According to the plan, the two advanced packaging factories will focus on different technologies, with AP1 concentrating on the cutting-edge 3D stacking technology (SoIC & CoW), while AP2 will focus on CoPoS technology to meet the packaging needs for AI and high-performance computing chips.
Additionally, foreign media reports that TSMC has begun recruiting CoWoS equipment service engineers, who will be responsible for producing CoWoS and its derivative products, as well as SoIC and CoW technologies, which are next-generation solutions targeting products like NVIDIA Rubin or AMD Instinct MI400 series…For details, click on “Wafer Foundry Giant’s Two Chip Factories Make Progress, Is the Advanced Packaging Race Heating Up?”
5
Semiconductor Giants Receive Billions in Investments
Recently, Intel announced an agreement with the US government, under which the US will invest $8.9 billion to acquire 433.3 million shares of Intel common stock at a price of $20.47 per share, equivalent to 9.9% of the company. Upon successful completion of the transaction, the US will become Intel’s largest shareholder.
The US investment in Intel is considered a passive stake, without board seats, governance rights, or information rights. Additionally, the US has agreed to align with the company’s board on matters requiring shareholder approval, except in very few exceptional cases…For details, click on “Wafer Foundry Giant to Receive $8.9 Billion Investment”
According to the latest report from CNBC, Intel has received $5.7 billion in funding from the US government. Intel’s Chief Financial Officer David Zinser confirmed at a recent investor conference that the company has officially received the $5.7 billion equity investment from the US government. He further pointed out that this investment is part of the agreement for the US government to inject funds into this semiconductor company described as facing financial pressure and to acquire a 10% stake…For details, click on “Semiconductor Giant Receives 40.6 Billion Yuan!”
#Semiconductors #TSMC #Intel #NewUnisplendourGroup
▶ About Us
TrendForce is a global high-tech industry research organization, with research areas covering memory, AI servers, integrated circuits and semiconductors, wafer foundry, display panels, LEDs, AR/VR, new energy (including solar photovoltaics, energy storage, and batteries), AI robotics, and automotive technology, among other cutting-edge technology fields. With years of in-depth research, TrendForce is committed to providing forward-looking industry research reports, industry analysis, project planning assessments, corporate strategic consulting, and brand integration marketing services, making it a trusted decision-making partner in the high-tech field.
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