Understanding SMARC: An Overview of Module Computer (Core Board) Standards
1.Concept
SMARC (Smart Mobility ARChitecture) is a generic definition for small computer modules based on ARM and X86 technology, designed for low-power embedded architecture platforms aimed at meeting the needs of low power, low cost, and high performance applications. These modules typically use ARM SOCs similar to those found in tablets and smartphones, or other low-power SOCs and CPUs.(314 Pin Gold Finger)
2. Origin
SMARC was initially named ULP-COM, primarily initiated by Kontron, and later renamed to SMARC to highlight its innovation in the mobile computing field and target market. In February 2013, the SGeT association approved the SMARC specification, establishing it as an open and global standard; the latest version of SMARC is 2.1.
3.Main Features
Standardized Interfaces and Sizes: The SMARC standard defines the size, connector types, electrical characteristics, and functional interfaces of computer modules, allowing modules from different manufacturers to be interchangeable on the same baseboard (also known as carrier board or motherboard).Low Power: The power consumption of the modules is typically less than 6W, suitable for battery-powered devices.High Performance: Uses high-performance processors, such as ARM SOCs, to meet various computing needs.Compact Size: The modules are compact, making them easy to integrate into various devices.Scalability: Offers multiple interfaces and expansion options, supporting various peripherals and connection methods.
4.Module Types and Sizes
The SMARC standard defines two types of modules (two module sizes) 82mm x 50mm and 82mm x 80mm. The module PCB has 314 gold fingers that can connect to a 314-pin 0.5mm pitch gold finger connector socket.
5.Technical Specifications and Interfaces
In March 2020, SGET released the SMARC 2.1 specification. The new standard is fully backward compatible with the previous SMARC 2.0 specification, while the new revision introduces new features such as SerDes support for extended edge connections and up to four MIPI-CSI camera interfaces to meet the growing demand for embedded computing and embedded vision integration.
Leave a Comment
Your email address will not be published. Required fields are marked *