Hello everyone, I am the Intelligence Guy~
Since last year, the company’s microcontroller and embedded Linux platforms have started to adopt the architecture of core board and base board for the development of embedded platforms.
Moreover, many current development board manufacturers are also adopting this architecture and form. The most direct benefit is that the core board and base board can be replaced independently. Core boards with similar functions and resources can directly replace each other without needing to redo the layout of the base board, which helps reduce some adverse effects caused by changes. Similarly, for the same core board, different base boards can be tailored to meet various application needs and scenarios. So besides these, what other advantages and disadvantages are there?
Using the architecture of core board and base board to develop embedded platforms, especially in applications of microcontrollers and embedded Linux platforms, has many advantages but also some disadvantages. Here is a summary of the benefits and drawbacks of this architecture:
First, let’s talk about the benefits:
1. Modular Design: The core board and base board architecture makes system design more modular. The core board integrates the main processor, memory, and key functions, while the base board is responsible for expanding and connecting external devices. This separation helps simplify design and maintenance.
2. Easy Upgrades: Replacing and upgrading the core board is relatively simple. Users can upgrade to a more powerful core board without changing the base board. This extends the product lifecycle and adapts to technological advancements.
3. Flexibility: This architecture allows designers to customize the functions on the base board according to different application needs, such as adding different interfaces, sensors, or power management circuits. This flexibility helps meet the demands of different markets.
4. Rapid Prototyping: Core boards are usually pre-validated, which can accelerate prototyping and product market launch. Designers can focus on the design of the base board and other application functionalities.
However, the biggest drawback is performance limitations, as the connection method between the core board and base board may limit data transfer speeds, especially in applications with high bandwidth requirements, which could become a performance bottleneck.
Then there is the need to consider compatibility issues during design. Different versions of core boards may have compatibility problems, and designers need to consider the differences between core boards to ensure the base board supports multiple core board versions. Additionally, the system’s integration may not be very high, and the separation of the core board and base board may lead to an increase in overall size, which is not ideal for applications with space constraints.
To mitigate the drawbacks of this architecture, the size and quality of the PCB are particularly crucial. However, many company teams encounter various design pain points, including the following common issues:
1. Complex wiring in multilayer boards, especially in BGA areas, which is a significant challenge.
2. Frequent issues with vias, unstable soldering, affecting the performance of expensive chips.
3. High prototyping costs, significant supply chain fluctuations, making cost control a challenge.
These are common design pain points for engineers, making it very important to choose an experienced and capable PCB manufacturer. Among them, Jialichuang is a well-known company, especially with rich experience in high-layer PCB products, such as reasonable design of stacking structures, consideration of signal integrity and electromagnetic compatibility, and appropriate thermal design for high-power components.
However, for most engineers, the most direct benefits can be summarized in the following aspects:
Using via-in-pad technology can make the BGA area appear cleaner, significantly improving space utilization. Of course, the quality of the board is also very important, such as avoiding issues like pad lifting, cold solder joints, and yellowing of pad openings; otherwise, even if your software capabilities are strong, you will still be frustrated. Jialichuang now offers free upgrades to via-in-pad technology for 6-32 layer boards, using true Class A materials, ensuring quality in board fabrication.
The connection between the base board and core board is critical, especially for high-frequency signals, which are particularly sensitive. Therefore, gold immersion technology is typically used, as everyone knows that gold layers have excellent conductivity, which enhances the anti-interference capability of high-frequency signals and is resistant to oxidation and corrosion. Usually, Jialichuang offers a cost-effective gold immersion process for 6-32 layer boards. PCBs are not only technology but also an art~
Today’s embedded platforms, especially MCUs, are above GHz, with increasingly powerful performance and richer functional interfaces. A good base board often needs to prepare for the performance iteration and upgrade of the core board, and the reservation of interfaces and compatibility of electrical parameters are worth considering carefully during the design process. Therefore, using the core board + base board design will become a trend at this stage~