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VCM Special Adhesive
Tian Ning Da’s VCM special adhesive is a single-component thermosetting adhesive characterized by low curing temperature and high bonding strength to difficult-to-bond substrates such as nickel, commonly used in professional fields such as VCM, CCD/CMOS modules, fingerprint recognition modules, image sensors, MMC, and BGA encapsulation.
Product Performance Indicators| Product | Application Scenario | Appearance |
Viscosity (25±3℃) |
Shear Strength |
| VCM Special Adhesive | VCM Bracket Base Riveting | Black Liquid | 20000-40000cps |
23MPa(SS/SS) 15MPa(Ni/Ni) |
This product is a single-component epoxy structural adhesive.
(1) Curing Conditions/Speed: 70°C/50min; 80°C/35min; 90°C/15min.
(2) Has strong bonding strength to metals (such as nickel) and inert high polymer substrates (such as LCP).
(3) Storage Conditions: Sealed and light-proof at -10°C to -40°C.
Shenzhen Tian Ning Da: Deep cooperation with Jiyang Smart Manufacturing to provide adhesive solutions for large-scale production of solid-state batteries.