In October last year, the third-generation Snapdragon 8 flagship platform was officially unveiled at the 2023 Snapdragon Summit. Subsequently, flagship devices featuring the third-generation Snapdragon 8 have been released by various brands.
Currently, the release of flagship-level new products has temporarily come to a halt, and more devices positioned differently are expected to be launched soon.
Meanwhile, another new product from Qualcomm has recently surfaced with related leaks, which is expected to support these devices.
Blogger @数码闲聊站 recently mentioned in a leak: “SM8635: TSMC 4nm, 1*2.9GHz± X4, Adreno735 9xxMHz, Antutu 170W±~”
According to the leak, a chip product referred to as SM8635 is expected to arrive soon. It will be built on TSMC’s 4nm process, featuring 1 core at 2.9GHz± X4, with an Adreno 735 GPU running at over 900MHz, and an Antutu score around 1.7 million.
Earlier, the same blogger also mentioned that the SM8635 will adjust its architecture and frequency scale alongside the SM8650, with Antutu scores exceeding the SM8550, making it unmatched in its performance tier.
Here, the SM8650 is the well-known third-generation Snapdragon 8 flagship platform, while the SM8550 is the previous generation’s second-generation Snapdragon 8 mobile platform.
This means that the performance of the SM8635 chip will surpass that of the second-generation Snapdragon 8. Based on the performance and architecture information, it is expected to be positioned slightly below the third-generation Snapdragon 8.
At the same time, blogger @i冰宇宙 recently mentioned in a leak: “Qualcomm is expected to release two chips in March, specifically different frequency versions of one chip, internally codenamed Cliffs, which is the rumored 7675/8635. Both will fully inherit the Snapdragon 8 Gen3 architecture, and the current performance is not yet clear. Traditionally, the previous generation 8 series flagship architecture was downscaled to mid-range, but this year seems to have abandoned the n-1 strategy, which is quite interesting; mid-range models are likely to spark competition again.”
According to the leak, Qualcomm is expected to release the rumored SM7675 and SM8635 chips in March, which are different frequency versions of the same chip. Both chips share the internal development codename “Cliffs” and will fully inherit the Snapdragon 8 Gen3 architecture.
Additionally, multiple leaks regarding the next generation of Qualcomm’s Snapdragon 8 series flagship chips have also emerged.
Blogger @数码闲聊站 mentioned in a leak that the new generation of Qualcomm’s Snapdragon 8 series flagship chip has a Geekbench multi-core score exceeding 10,000, with CPU and GPU performance better than Apple’s A series chips.
Of course, given that there is currently no definitive official information, the details mentioned in the leaks should be taken with caution.
As for other specifications, according to the leaks, the new Snapdragon 8 Gen 4 chip, codenamed “SUN”, will be built on TSMC’s 3nm process, with a CPU architecture of 2*Phoenix L + 6*Phoenix M, showing significant performance improvements in the design of self-developed CPU architectures at this stage.
It is reported that Qualcomm has stated that the Snapdragon 8 Gen 4 chip in 2024 will use Qualcomm’s self-developed Oryon CPU core. At the same time, the cost of the Snapdragon 8 Gen 4 may also increase.
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