MediaTek’s First TSMC 2nm Flagship SoC Completes Tape-Out, Expected to Enter Mass Production by End of 2026

According to MediaTek’s official website, on September 16, MediaTek announced that its first flagship system-on-chip (SoC) using TSMC’s 2nm process has successfully completed tape-out, making it one of the first companies to adopt this technology, with mass production expected by the end of next year.

MediaTek stated that it has continuously collaborated with TSMC in the fields of flagship mobile platforms, computing, automotive, and data centers to create chipsets that combine high performance and low power consumption. This collaboration represents a new milestone in the solid partnership between the two companies.

It is reported that TSMC’s 2nm process technology utilizes a nanosheet transistor structure that offers superior performance, power efficiency, and yield. MediaTek’s first chip using TSMC’s new 2nm process is expected to be launched by the end of 2026.

Compared to the existing N3E process, TSMC’s enhanced 2nm process technology increases logic density by 1.2 times, achieves up to an 18% performance improvement at the same power consumption, and reduces power consumption by approximately 36% at the same speed.

Dr. Zhang Xiaoqiang, Senior Vice President of Business Development and Co-COO at TSMC, stated that TSMC’s 2nm technology marks an important step into the nanosheet era, demonstrating our relentless efforts to meet customer demands by continuously adjusting and enhancing our technology to provide high-performance computing capabilities. The ongoing collaboration with MediaTek aims to maximize performance and energy efficiency across a wide range of applications.

MediaTek's First TSMC 2nm Flagship SoC Completes Tape-Out, Expected to Enter Mass Production by End of 2026

MediaTek's First TSMC 2nm Flagship SoC Completes Tape-Out, Expected to Enter Mass Production by End of 2026

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