Today’s news: (1) The cowop process, which uses PCB to replace cowos, allows chips to be directly packaged onto the PCB, potentially increasing the requirements for PCB to mSAP technology; (2) Orthogonal backplanes may adopt mSAP technology. #mSAP technology benefits manufacturers: Shenghong Technology: One of the suppliers of orthogonal backplanes, with high-end HDI processing capabilities. Dongshan Precision: One of the suppliers of orthogonal backplanes, with a maximum expansion of $1 billion imminent. Xingsen Technology: Possesses substrate and PCB technology capabilities, currently sampling for N customers. Shenzhen Circuit: Possesses substrate and PCB technology capabilities, currently in contact regarding orthogonal backplane solutions. Jingwang Electronics: Continues to advance substrate production capacity, with its Zhuhai factory equipped with SLP capabilities, having entered the supply chain of N customers. Pengding Holdings: Capable of mass-producing SLP, with strong mSAP technology. Fangbang Co., Ltd.: A supplier of removable copper, primarily needed for mSAP processes. Fangzheng Technology: Continuously breaking through multi-stage cavity technology and mSAP production processes.
