Key Focus on PCB Topics
Today’s news: (1) The cowop process, which uses PCB to replace cowos, allows chips to be directly packaged onto the PCB, potentially increasing the requirements for PCB to mSAP technology; (2) Orthogonal backplanes may adopt mSAP technology. #mSAP technology benefits manufacturers: Shenghong Technology: One of the suppliers of orthogonal backplanes, with high-end HDI processing capabilities. … Read more