Introduction to A8105 Low Power Bluetooth Chip and Module

AMICCOM’s A8105 Bluetooth Low Energy (Bluetooth LE) chip is a highly integrated Bluetooth® LE SoC. The A8105 has received BQB certification for Bluetooth Low Energy. The digital part integrates a high-performance 1T Pipeline 8051, with built-in 16K/32Kbytes Flash Memory, 2KBytes SRAM, and 24 GPIOs along with various digital interfaces. The two-wire ICE can be paired with Keil C development.

The RF of the A8105 employs AMICCOM’s next-generation low power architecture. The RX mode consumes 18mA, while the TX mode consumes 18.5mA (0dBm output); even at +6dBm output, it only requires 23.5mA. The maximum RF output power can reach +10dBm, with a receiving sensitivity of -92dBm (@1Mbps GFSK), and a maximum link budget of 102 dB. The SoC’s internal CPU core, the 1T 8051, allows for fast computation and can adjust the CPU speed based on overall power consumption requirements. The A8105 is equipped with various digital interfaces such as UART, I2C, SPI, and has 2 PWM outputs, 1 16-bit timer, and 2 8-bit timers; these interfaces share pins with 24 GPIOs and can be configured based on usage scenarios. The A8105 includes two ADCs, with 12-bit and 8-bit capabilities. The 12-bit ADC provides 4 channels for measuring external signals; the 8-bit ADC provides RSSI measurements, ranging from -100dBm to +0dBm.

The A8105 is targeted at peripheral applications, with internal flash memory options of 16Kbytes and 32Kbytes. AMICCOM has developed its own protocol stack based on the chip’s functions and has obtained BQB certification. This streamlined and flexible protocol stack supports multiple profiles and services. The 16Kbytes configuration can accommodate user-defined profiles developed by AMICCOM, allowing for simple communication with Apple iOS devices or I/O control of the A8105 via an iOS app. The 32Kbytes version of the A8105 supports AES128, providing encrypted wireless communication for security-related applications. Overall, the A8105 is a high-performance, low-cost Bluetooth Low Energy (Bluetooth LE) SoC chip, offering a convenient and easy-to-develop protocol stack, supporting various digital interfaces and comprehensive I/O, all integrated within a QFN5x5 chip, providing customers with a streamlined and convenient Bluetooth Low Energy solution.

Currently, integrated modular solutions are available for customers, reducing the development threshold for the A8105, facilitating quick application development, and shortening development cycles. The module can be applied in products such as temperature guns, temperature controllers, smart switches, charging piles, and transparent transmission modules.

AMICCOM and its authorized distributor, Dasheng Tang Electronics, have started supplying the product. Samples of the IC and development toolkits are available upon request, and development work can commence. For details, please contact: 0755-83981851